Column Recommendation: 2023 Digital IC Design Autumn Recruitment Review - Written Test Questions and Interview Records from Dozens of Companies
Column Homepage: 2023 Digital IC Design Autumn Recruitment Review—Dozens of Companies Written Test Questions and Interview Records
Column content:
- Written Examination Review
The written test questions compiled during the 2023 autumn recruitment process include my own job-hunting written test and the written tests of other students. Including Huawei, ZTE, MediaTek, AMD, DJI, Ziguang Zhanrui, Honor, Xiaomi, Fudan Micro, Xingchen, Suiyuan, Telink Micro, Star Micro, Rockchip, Nova, Xinhe, Innosilicon, VeriSilicon, Xihua and other companies. - Interview review:
My own interview during the 2023 autumn recruitment process, mainly including the questions and my answers throughout the interview, as well as self-evaluation in the later period. Including Huawei, ZTE, Xiaomi, zeku, MediaTek, Xingchen, Hesai, Calteland, Sagitar, Horizon, VeriSilicon and other companies. - Preparatory work
includes the recommended materials used in the job hunting process, personal suggestions for making resumes in the job hunting process, experience in preparing for written tests and interviews, etc. - Knowledge finishing article
The knowledge points I summarized during the autumn recruitment process. It mainly includes basic knowledge of digital circuits, FPGA internal structure knowledge points, Verilog grammar test points, HDL design knowledge points, timing analysis, SystemVerilog grammar, digital IC basic knowledge and other knowledge points that are constantly added during the course of learning before the autumn recruitment and during the written test and interview.
Position: IC development engineer (SoC/ASIC chip) position
Interview platform: Tencent meeting
Result: At that time, I felt that the offer was too low and I didn't sign it. As a result, Huawei was even lower.
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