Digital technology library needs:
- Synopsys folder contains .lib and .db files this process is time model (DC-link library and the target library)
Content elaborated:
Logiclibrary semiconductor process is maintained and provided by vendors extension .lib (ASCll code, readable) or .db (2 binary, the DC used) the library, the library comprising for each logic elements (such as NAND gates, inverter, buffer, ram, etc.) features and capabilities information, such as time unit, the unit voltage, cell name, pin name foot, arc delay, power consumption and load information Pin pin information. The library also provides the conditions upon which the library must meet, such as maximum conversion time line, the maximum fanout values, etc. These conditions are referred to as design rule constrains (DRC).
must:
Determining a temperature protocol interface using the parameters of their voltage and temperature range and process library or the like is consistent with the .db.
- Synopsys file folder containing .sdb, DC as a comprehensive symbol libraries.
- FRAM layout part comprises a cell information, cell information is abstract layout, such as the NAND cell profile, Pin foot position, and the metal layer information, mainly for the ICC FRAM P & R and the DCT;
- .tf file: technologylibrary process information is included:
technology file. .tf technology file typically expand file name is given, the information is included in each layer of metal or reference number and name of the vias, the dielectric constant of each layer design rules, each of the physical and electrical characteristics and precision electronic units.
- TLUPLUS fiie (.itf files can be converted to TLUPLUS file) and LayerMapping file (tf files and can write according to their own):
In order to better estimate the delay, it is best to add RC Information: TLUPLUS fiie and LayerMapping file. TLUPLUS often with .tluplus file name suffix to expand, by the ITF (InterconnecttechnologyFormat, ITF file contains information about the physical characteristics of the process, such as layer thickness, dielectric constant, shallow trench Isolatlon and copper dishlng (Desensity Analysis and width)) file through starRc RC model generation tool to extract a file, a lookup table comprising RC, of course, the document may also be provided directly factory; and Layyer mapping technology file contains the files and the two files TLUplus file name matching the metal layer information.