PCB high-speed processing and how to design microvias

How to design high-speed processing and PCB micro via holes
connected to the circuit under the best properties of different circuit boards must be separated, but again without electromagnetic interference, then the circuit board manufacturers need to use micro-vias (microvia). Typically microvia diameter of 0.20 mm to 0.05mm, vias are generally divided into three categories, i.e. blind holes (blind via), buried vias (bury via) and the through-hole (through via). Blind holes located on the top and bottom surfaces of the printed circuit board, having a certain depth, the line for connecting the surface layer and below the inner-layer circuit, the depth of the hole is typically no more than a certain ratio (aperture). Buried hole printed circuit board means located inner connection hole, it does not extend to the surface of the board. Both types of holes are located in an inner layer circuit board using through-holes prior to lamination molding process is completed, the inner layer may also be made into several overlapping the via hole formation process. The third is called vias, such holes through the entire board, may be used as an adhesive to achieve interconnection or positioning hole assembly.
In the design of RF circuit boards, as far as possible the high power RF amplifier (HPA) and a low noise amplifier (LNA) to isolate, simply, is to make a high-power RF transmitter circuit away from the low-noise receiver circuit. If the PCB board has a lot of space, you can easily do this. However, many normal components, PCB space will become very small, so it is difficult to achieve. Put them in both sides of the PCB, or let them operate alternately, rather than simultaneously. High-power RF circuit may further include a buffer (buffer) and a voltage controlled oscillator (VCO).
Design can be divided into partitions partitioning entity (physical partitioning) and electrical partition (Electrical partitioning). Entity relates partition layout components, shielding and orientation problems; may continue to partition into an electrical power distribution, the RF trace, and the signal sensing circuit, grounding the partition.
Is the key layout of components a superior RF design, the most effective technique is to first stationary components located on the RF path and adjust its orientation so that the length of the RF path is minimized. Away from the RF input and RF output, and as far from the high-power circuits and low noise circuits. Friends can have pcb design
The most effective method is to stack the circuit board main ground layer arranged on the second subsurface, and as far as possible down the RF line on the surface layer. The pore size through the RF path can be reduced not only to minimize the path inductance, but also can reduce Weld points on the main ground, can reduce the chance of leakage of RF energy to other areas of the laminate.
In physical space, linear circuits such as multi-stage amplifier is usually sufficient RF isolation between a plurality of open areas, but the duplexer, mixer and IF amplifier always has a plurality of RF / IF signal interference, Therefore, care must be taken to minimize this effect. RF and IF traces should cross to go as far as possible, and as a ground contact area of the spacer therebetween. RF correct path is very important to the performance of the entire PCB board, which is why the layout of components is usually the reason most of the time accounted for in mobile phone PCB board design.
PCB board in a mobile phone, generally low-noise amplifier circuit may be placed on one surface of a PCB board, and the high power amplifier on the other side, and eventually on the same surface by the duplexer to connect them to the RF antenna end and the other end of the base frequency of the processor. This requires some skill to ensure that RF energy does not by through holes, passing to the other side surface of the plate, is a common technique uses a blind hole on both sides. By blind holes can be arranged in regions on both sides of the PCB are not subject to RF interference to the through hole to minimize adverse effects.
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