A, mandatory:
1, all of the components to the board edge side pads distance greater than a thickness at least 1mm or more, since the mass production pipeline plug and wave soldering, the use of guide groove to be provided to .
2, according to structural diagram of the production and processing required clamping edge, certain special requirements set membered prohibition PCB wiring area, the layout area is prohibited.
Second, the mechanical positioning of the fixing element:
1, and the first structure is placed in close fitting components fixed location, such as power socket, indicator lights, switches, connectors and the like, and secured against unintended movement;
Third, the large current element placed:
1, a large current element, generally placed in the regulation of the side plate, to increase the spacing between elements, over-current and to facilitate heat dissipation, the fins headspace.
Four, pcb conventional layout requirements
1, a schematic diagram of functional blocks placed by: ic ic and the surrounding elements as a function module.
2, the layout shortened as much as possible the connection between the high-frequency components, as far away from the input and output.
3, all of esd components should be placed close to the device-side interface, go through esd element when traces, then the interface element.
4, the reset circuit to be close to the panel reset button display.
5, heat-sensitive components, such as crystals away from power elements.
6, heavy and hot components, not into the circuit board, should be placed in the bottom panel of the host, and thermal consideration, with brackets, welding.
7, crimping receptacle around 5mm range, the front does not allow more than the crimp height of the socket member.
8, when the daughter board in contact with the motherboard through the connector housing, to consider whether the corresponding two mating plate when docking pin same network.
9, a symmetrical differential circuit to try to put as mic, USB, mipi other circuits
Fifth, the power filter / decoupling capacitor placed:
1, each ic corresponds to the PIN pin disposed filter capacitor, filter capacitor of the same supply network can not be placed together, the corresponding PIN pin placed dispersion.
2, when the same PIN pin ic two filter capacitors, a small capacity capacitor as close to PIN pin priority.
. 3, ic decoupling capacitors as close to the power pin layout of ic, and the shortest loop is formed between the power and ground.
4, if the double-sided element, the cloth is preferably first decoupling capacitor capacitance device through the belly position of the other side of the board, power and ground, and then into the chip.
Sixth, the isolation between the high and low voltage:
isolation and distance to bear pressure related, usually to distance 2mm, to withstand the pressure test 3000v in 2000kv a board, the distance between the high and low voltage lines should be in 3.5mm or more, to avoid creeping slotted between high and low pressure on the printed circuit board is also in many cases.
Seven were processed digital and analog circuits of the
digital and analog shorted via a resistor, the resistance to put the digital and analog this, often called single-point ground.
Eight, production process requirements surface Board
1, hdi plate, distance from the board edge element pads in 0.8mm or more.
Through the orifice, the distance from the board edge element pads in 1.2mm or more.
2, the position of the small element bga bga from the periphery of the outer frame member and at least 0.5mm or more.
3, the same type of cartridge components should be placed in one direction in the x or y direction.
The same type of polarity should strive to maintain the consistent discrete components in the x or y directions, to facilitate the production and testing.
4, as long as there is a surface element smd SMD placement should point mark, mark point should be placed on the corner, with the side plates mark placed 3-4
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