Quanzhi Technology T3 domestic industrial evaluation board specification (quad-core ARM Cortex-A7, main frequency 1.2GHz)

1 Introduction to Evaluation Board

Chuanglong Technology TLT3-EVM is a 4-core ARM Cortex-A7 high-performance low-power domestic evaluation board designed based on Allwinner T3 processor. The main frequency of each core is up to 1.2GHz. It consists of a core board and an evaluation board.

The evaluation board is rich in interface resources, leading out communication interfaces such as dual network ports, dual CAN, dual USB, and dual RS485, onboard Bluetooth, WIFI, 4G (optional) modules, and simultaneously leading out MIPI LCD, LVDS LCD, and TFT LCD , CVBS OUT, CAMERA, LINE IN, H/P OUT and other audio and video multimedia interfaces, support dual-screen different display, 1080P@45fps H.264 video hardware codec, and support SATA mass storage interface.

The core board adopts 100% domestic components and has been verified by professional PCB layout and high and low temperature tests. It is stable and reliable, and can meet various industrial application environments. Most of the components on the evaluation board adopt domestic solutions, which is convenient for users to quickly conduct product solution evaluation and technology pre-research.

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Figure 4

Figure 5

Figure 6

2 typical application fields

  • energy power
  • Rail
  • industrial control
  • Industrial Gateway
  • Instrumentation
  • Security Monitoring

3 Software and hardware parameters

hardware block diagram

Figure 7 Evaluation board hardware block diagram

Figure 8 Evaluation board hardware resource diagram 1

Figure 9 Evaluation board hardware resource diagram 2

hardware parameters

 

Table 1

CPU

CPU: Allwinner T3

4x ARM Cortex-A7, up to 1.2GHz per core

GPU:Mali400 MP2,支持OpenGL ES 1.1/2.0、Open VG 1.1

Encoder: Support 1080P@45fps H.264 video hardware encoding

Decoder: Support 1080P@45fps H.264 video hardware decoding

ROM

8GByte eMMC

RAM

1/2GByte DDR3

LED

2x power indicator light (1 on the core board, 1 on the evaluation board)

4x User Programmable LEDs (2 on core board, 2 on evaluation board)

KEY

1x PMIC PWRON button

1x CPU RESET button

3x user input buttons

RTC

1x RTC seat, suitable for button battery ML2032 (3V rechargeable), CR2032 (3V not rechargeable)

Ethernet

1x MII ETH, RJ45 interface, 10/100M adaptive

1x RGMII ETH, RJ45 interface, 10/100/1000M adaptive

WIFI

1x WIFI module (Taiwan system), connected via USB1 HUB (Taiwan system), 150Mbps rate

4G

1x 4G module (optional), connected via USB1 HUB, Mini PCIe socket

1x Micro SIM interface

Bluetooth

1x Bluetooth 5.1 master-slave integrated module (Norway), connected via UART2, 2Mbps communication rate

USB

1x USB0 OTG, USB 2.0, Micro USB port

1x USB1 HOST, USB 2.0, lead out through USB1 HUB

1x USB2 HOST,USB 2.0

UART

1x Debug UART, lead out from UART0, Micro USB interface

2x RS485 UART, led by UART4, UART5, 3pin 3.81mm green terminal

1x RS232 UART, lead out from UART3, DB9 interface

2x CMOS UART, led by UART6, UART7, 4pin 2.54mm white terminal

SATA

1x 7pin SATA interface, support 3.0Gbps rate

Video IN

2x CAMERA, lead out from CSI0, CSI1 parallel ports, 2x 12pin headers, pitch 2.54mm

1x TVIN, lead out from TVIN0, TVIN1, TVIN2, TVIN3, 6pin 2.54mm white terminal

Video OUT

1x TFT LCD resistive touch screen interface, support 1080P@60fps, 40pin FFC connector, pitch 0.5mm

1x LVDS LCD resistive touch screen interface, support 1080P@60fps, 2x 15pin (display) + 6pin (backlight) headers, pitch 2.0mm; 4pin (touch) headers, pitch 2.54mm

Note: There is a multiplexing relationship between LVDS LCD and TFT LCD pins

1x MIPI LCD capacitive touch screen interface, support 1080P@60fps, 40pin (display) + 6pin (touch) FFC connector, pitch 0.5mm

1x VGA OUT, lead out from TVOUT0, TVOUT1, TVOUT2, 15pin VGA seat

1x CVBS OUT, from TVOUT3, RCA lotus

AUDIO

1x 3.5mm LINE IN interface

1x 3.5mm H/P(Headphone) OUT jack

Watchdog

1x 3pin header configuration interface, pitch 2.54mm, using external chip solution (USA)

CAN

2x CAN, 3pin 3.81mm green terminal, extended by SPI2

SDIO

1x SDIO, led by SDC3, 2x 6pin female header, pitch 2.54mm

SD

1x Micro SD, led out by SDC0

EXPORT

1x EXPORT expansion interface, 2x 6pin headers, pitch 2.54mm

BOOT SET

1x 1bit start mode selection DIP switch

SWITCH

1x Power toggle switch

POWER

1x 12V6A DC input DC-005 power interface, which can be connected to a power plug with an outer diameter of 5.5mm and an inner diameter of 2.1mm

software parameters

Table 2

kernel

Linux-3.10.65, Yihui SylixOS (domestic operating system, planned)

File system

Buildroot-201611/Ubuntu, Yihui SylixOS (domestic operating system, planned)

Graphical Interface Development Tool

Qt-5.9.0

The software development kit provides

T3_LinuxSDK_V1.3_20190122

Driver support

DDR3

eMMC

Bluetooth

SPI NOR FLASH

LED

KEY

UART

CAN

SD

SATA

Ethernet

USB 2.0

WIFI

4G Module

RTC

LINE IN

H/P OUT

MIPI LCD

TFT LCD

LVDS LCD

TVIN

VGA OUT

CVBS OUT

Touch Screen

CSI ROOM

4 Development Information

(1) Provide core board pin definition, editable base board schematic diagram, editable base board PCB, chip Datasheet, shorten the hardware design cycle;

(2) Provide system solidified image, kernel driver source code, file system source code, and rich Demo programs;

(3) Provide a complete platform development kit and introductory tutorials, saving time for software finishing and making application development easier.

Development cases mainly include:

  • Linux application development case
  • Linux-RT应用开发案例
  • Qt开发案例
  • 4G/WIFI/CAN/Bluetooth开发案例
  • T3与FPGA通信开发案例
  • Docker容器技术演示案例
  • Ubuntu操作系统演示案例
  • 翼辉SylixOS国产操作系统演示案例(计划)
  • IgH EtherCAT主站开发案例(计划)

5 电气特性

工作环境

 

表 3

环境参数

最小值

典型值

最大值

核心板工作温度

-40°C

/

85°C

核心板工作电压

/

5.0V

/

评估板工作电压

/

12.0V

/

功耗测试

表 4

类别

工作状态

电压典型值

电流典型值

功耗典型值

核心板

空闲状态

5.0V

0.14A

0.70W

满负荷状态

5.0V

0.47A

2.35W

评估板

空闲状态

12.0V

0.13A

1.56W

满负荷状态

12.0V

0.27A

3.24W

备注:功耗基于TLT3-EVM评估板测得。功耗测试数据与具体应用场景有关,测试数据仅供参考。

空闲状态系统启动,评估板不接入其他外接模块,不执行程序。

满负荷状态系统启动,评估板不接入其他外接模块,运行DDR压力读写测试程序,4个ARM Cortex-A7核心使用率约为100%。

6 机械尺寸

表 5

核心板

评估底板

PCB尺寸

55mm*75mm

150mm*225mm

PCB层数

8层

4层

PCB板厚

1.6mm

1.6mm

安装孔数量

/

4个

图 10 核心板机械尺寸图

图 11 评估底板机械尺寸图

7 产品型号

表 6

型号

CPU

CPU主频

eMMC

DDR3

TLT3-EVM-A2.0-64GE8GD-I-A1.1

T3

1.2GHz

8GByte

1GByte

TLT3-EVM-A2.0-64GE16GD-I-A1.1

T3

1.2GHz

8GByte

2GByte

备注:标配为TLT3-EVM-A2.0-64GE8GD-I-A1.1。

型号参数解释

 

 图12

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Origin blog.csdn.net/Tronlong/article/details/131429984