1 Introduction to Core Board
Chuanglong Technology SOM-TL64x is a multi-core industrial-grade core board based on TI Sitara series AM64x dual-core ARM Cortex-A53 + single/quad-core Cortex-R5F + single-core Cortex-M4F design, leading out 5x TSN through industrial-grade B2B connectors Ethernet, 9x UART, 2x CAN-FD, GPMC, PCIe/USB 3.1 and other interfaces. The core board has been verified by professional PCB layout and high and low temperature tests. It is stable and reliable, and can meet various industrial application environments.
When users use the core board for secondary development, they only need to focus on the upper layer application, which reduces the development difficulty and time cost, and can quickly conduct product solution evaluation and technology pre-research.
Figure 1 Front view of the core board
Figure 2 Back view of the core board
Figure 3 Oblique view of the core board
Figure 4 Side view of the core board
2 typical application fields
- Industrial Gateway
- Industrial robot
- Motion Controller
- server Driver
- Distribution terminal
3 Software and hardware parameters
hardware block diagram
Figure 5 core board hardware block diagram
Figure 6 AM64x processor functional block diagram
hardware parameters
Table 1
| CPU |
CPU: TI Sitara AM6412/AM6442 |
| 2x ARM Cortex-A53(64bit), main frequency 800MHz(AM6412)/1.0GHz(AM6442) |
|
| 1x Cortex-R5F (AM6412, main frequency 400MHz), or 4x Cortex-R5F (AM6442, main frequency 800MHz) |
|
| 1x Cortex-M4F, clocked at 400MHz |
|
| 2x PRU-ICSSG, support EtherCAT, TSN industrial protocol, each PRU-ICSSG supports 2 Gigabit Ethernet ports (AM6442 only) |
|
| ROM |
4/8GByte eMMC |
| RAM |
512M/1G/2GByte DDR4 |
| B2B Connector |
2x 60pin male B2B connector, 2x 60pin female B2B connector, 240pin in total, 0.5mm pitch, 4.0mm height |
| LED |
1x Power LED |
| 2x User Programmable LEDs |
|
| hardware resources |
1x GPMC |
| 2x CAN(AM6412)，或2x CAN-FD(AM6442) |
|
| 6x I2C, support 100Kb/s, 400Kb/s, 3.4Mb/s |
|
| 1x ADC, 12bit, 8 analog inputs, sampling rate 4MSPS (AM6442 only) |
|
| 7x SPI |
|
| 2x MMCSD, support 4bit SD/SDIO (the eMMC on the core board has used MMCSD0) |
|
| 8x FSI (Fast Serial Interface), including 6 FSI_RX, 2 FSI_TX |
|
| 1x OSPI/QSPI |
|
| 1x PCIe Gen2, single channel, maximum communication rate 5Gbps |
|
| 16x Timer |
|
| 9x ePWM |
|
| 9x UART |
|
| 3x eCAP |
|
| 3x eQEP |
|
| 1x USB 3.1 DRD (if it needs to support PCIe function, it can only be used as USB 2.0 DRD) |
|
| 2x 10/100/1000M Ethernet, support EtherCAT, TSN industrial protocol (one of them is multiplexed with PRU-ICSSG network port) |
Remarks: Some pin resources are reused.
software parameters
Table 2
| ARM side software support |
Linux-5.10.65 |
|
| CCS version number |
CCS11.1.0 |
|
| The software development kit provides |
Processor-SDK Linux-RT、MCU-PLUS-SDK |
|
| Driver support |
SPI FLASH |
DDR4 |
| eMMC |
MMC/SD |
|
| GPMC |
PCIe NVME |
|
| Ethernet |
PRU |
|
| eCAP |
FSI |
|
| LED |
KEY |
|
| RS232 |
RS485 |
|
| EEPROM |
CAN-FD |
|
| 2C |
RTC |
|
| USB 4G |
PCIe 5G |
|
| USB WIFI |
ADC |
|
4 Development Information
(1) Provide core board pin definition, editable base board schematic diagram, editable base board PCB, chip Datasheet, shorten the hardware design cycle;
(2) Provide system solidified image, kernel driver source code, file system source code, and rich Demo programs;
(3) Provide a complete platform development kit and introductory tutorials, saving time for software finishing and making application development easier;
(4) Provide detailed multi-core architecture communication tutorials to perfectly solve the bottleneck of multi-core development.
Development cases mainly include:
- Linux/Linux-RT application development case
- Cortex-R5F、Cortex-M4F开发案例
- 多核通信开发案例
- 多网口开发案例
- EtherCAT开发案例
- 4G/5G通信开发案例
- TSN通信开发案例
- 基于GPMC的ARM与FPGA通信开发案例
- 基于PCIe的ARM与FPGA通信开发案例
5 电气特性
工作环境
表 3
| 环境参数 |
最小值 |
典型值 |
最大值 |
| 工作温度 |
-40°C |
/ |
85°C |
| 工作电压 |
/ |
5.0V |
/ |
功耗测试
表 4
| 电压典型值 |
电流典型值 |
功耗典型值 |
| 5.0V |
0.11A |
0.55W |
备注：功耗基于TL64x-EVM评估板测得。功耗测试数据与具体应用场景有关，测试数据仅供参考。测试条件：系统启动，评估板不接入其他外接模块，不执行额外应用程序。
6 机械尺寸
表 5
| PCB尺寸 |
35mm*58mm |
| PCB层数 |
10层 |
| PCB板厚 |
1.6mm |
图 7 核心板机械尺寸图
7 产品型号
表 6
| 型号 |
CPU |
CPU主频 |
eMMC |
DDR4 |
温度级别 |
| SOM-TL6412-32GE4GD-I-A1.0 |
AM6412 |
Cortex-A53:800MHz Cortex-R5F:400MHz |
4GByte |
512MByte |
工业级 |
| SOM-TL6442-64GE8GD-I-A1.0 |
AM6442 |
Cortex-A53:1000MHz Cortex-R5F:800MHz |
8GByte |
1GByte |
工业级 |
| SOM-TL6442-64GE16GD-I-A1.0 |
AM6442 |
Cortex-A53:1000MHz Cortex-R5F:800MHz |
8GByte |
2GByte |
工业级 |
备注：标配为SOM-TL6412-32GE4GD-I-A1.0。
型号参数解释
图 8
8 技术服务
（1）协助底板设计和测试，减少硬件设计失误；
（2）协助解决按照用户手册操作出现的异常问题；
（3）协助产品故障判定；
（4）协助正确编译与运行所提供的源代码；
（5）协助进行产品二次开发；
（6）提供长期的售后服务。
9 增值服务
- 主板定制设计
- 核心板定制设计
- 嵌入式软件开发
- 项目合作开发
- 技术培训