1 Introduction to Core Board
Chuanglong Technology SOM-TLT507 is a 4-core ARM Cortex-A53 domestic industrial core board designed based on Allwinner T507-H processor, with a main frequency up to 1.416GHz. All components such as the core board CPU, ROM, RAM, power supply, and crystal oscillator adopt domestic industrial-grade solutions, and the localization rate is 100%.
The core board leads to MIPI CSI, HDMI OUT, RGB DISPLAY, LVDS DISPLAY, CVBS OUT, 2x EMAC, 4x USB2.0, 6x UART, SPI, TWI and other interfaces through the stamp hole connection method, and supports dual-screen different display, G31 MP2 GPU, 4K@60fps H.265 video hardware decoding, 4K@25fps H.264 video hardware encoding. The core board has been verified by professional PCB layout and high and low temperature tests. It is stable and reliable, and can meet various industrial application environments.
When users use the core board for secondary development, they only need to focus on the upper layer application, which reduces the development difficulty and time cost, and can quickly conduct product solution evaluation and technology pre-research.
Figure 1 Front view of the core board
Figure 2 Back view of the core board
Figure 3 Oblique view of the core board
Figure 4 Side view of the core board
2 typical application fields
- industrial control
- Industrial Gateway
- energy power
- Rail
- Instrumentation
3 Software and hardware parameters
hardware block diagram
Figure 5 Core board hardware block diagram
Figure 6 Functional block diagram of T507-H processor
hardware parameters
Table 1
| CPU |
Allwinner T507-H, 28nm |
| 4x ARM Cortex-A53, up to 1.416GHz |
|
| GPU: G31 MP2, Support OpenGL ES 1.0/2.0/3.2, Vulkan 1.1, OpenCL 2.0 |
|
| Encoder: Support 4K@25fps H.264 video hardware encoding |
|
| Decoder: Support 4K@60fps H.265 video hardware decoding |
|
| ROM |
8/16GByte eMMC |
| RAM |
1/2GByte DDR4 |
| Video IN |
1x MIPI CSI, including 4 data lanes, each lane up to 1Gbps, up to 8M@30fps or 4x 1080p@25fps |
| Video OUT |
1x RGB DISPLAY(LCD), support RGB888, RGB666 and RGB565, up to 1080P@60fps |
| 2x LVDS DISPLAY(LVDS0、LVDS1)，支持1080P@60fps Note: LVDS0, LVDS1 and LCD pins are multiplexed |
|
| 1x CVBS OUT, support NTSC and PAL |
|
| 1x HDMI OUT, compatible with HDCP2.2, HDCP1.4 standards, up to 4K@60fps |
|
| LED |
1x Power LED |
| 2x User Programmable LEDs |
|
| stamp hole |
2x 32pin + 2x 53pin, total 170pin, pitch 1.0mm |
| other hardware resources |
2x EMAC (EMAC0, EMAC1), EMAC0 supports RMII/RGMII PHY interface (10/100/1000Mbps), EMAC1 supports RMII PHY interface (10/100Mbps) |
| 1x USB2.0 OTG (USB0), support high speed (480Mbps), full speed (12Mbps) and low speed (1.5Mps) mode |
|
| 3x USB2.0 HOST (USB1, USB2, USB3), support high speed (480Mbps), full speed (12Mbps) and low speed (1.5Mbps) mode |
|
| 2x SMHC (SDC0/SDC1), support SD3.0, SDIO3.0, MMC5.0 Remarks: The eMMC on the core board has used SDC2, and it has not been led to the stamp hole pin |
|
| 6x TWI (Two Wire Interface) (TWI0~TWI4, S_TWI0), support standard mode (100Kbps) and high-speed mode (400Kbps) Remarks: The PMIC on the core board has used S_TWI0, and at the same time leads to the stamp hole pin |
|
| 2x SPI (SPI0, SPI1), each channel contains 2 chip select signals, the clock frequency is up to 100MHz, and supports Master Mode and Slave Mode |
|
| 1x TSC, can be used as SPI (Synchronous Parallel Interface) or SSI (Synchronous Serial Interface) interface |
|
| 6x UART, UART0~UART5, baud rate up to 4Mbps |
|
| 6x PWM, support PWM output, input capture, output frequency up to 24/100MHz |
|
| 1x SCR(Smart Card Reader) |
|
| 1x CIR(Consumer Infrared) |
|
| 4x GPADC (General Purpose ADC), 12bit resolution, sampling rate up to 1MHz Note: Since GPADC0 has been used as a DDR type configuration pin on the core board, it is not recommended to use GPADC0 again |
|
| 1x LRADC (Low Rate ADC), 6bit resolution, sampling rate up to 2KHz |
|
| 3x I2S/PCM, I2S mode supports 8 channels and 32-bit/192Kbit sampling rate, I2S and TDM mode supports up to 16 channels and 32-bit/96Kbit sampling rate |
|
| 1x OWA (One Wire Audio), compatible with S/PDIF protocol |
|
| 1x Audio Codec, including 2-channel DAC, 1 single-ended LINEOUTL/LINEOUTR output |
|
| 1x JTAG |
Remarks: Some pin resources are reused.
software parameters
Table 2
| kernel |
Linux-4.9.170、Linux-RT-4.9.170 |
|
| File system |
Buildroot-201902、Ubuntu |
|
| Graphical Interface Development Tool |
Qt-5.12.5 |
|
| The software development kit provides |
V2.0_20220618 |
|
|
|
LED |
KEY |
| UART |
CAN |
|
| SPI |
PWM |
|
| DDR4 |
eMMC |
|
| SD |
GPADC |
|
| Ethernet |
USB2.0 |
|
| 4G/WIFI/Bluetooth |
HDMI OUT |
|
| RTC |
LINE OUT |
|
| MIPI CSI |
CVBS OUT |
|
| TFT LCD |
LVDS LCD |
|
| Touch Screen |
||
4 Development Information
(1) Provide core board pin definition, editable base board schematic diagram, editable base board PCB, chip Datasheet, assist in the selection of domestic component solutions, and shorten the hardware design cycle;
(2) Provide system solidified image, file system image, kernel driver source code, and rich Demo programs;
(3) Provide a complete platform development kit and introductory tutorials, saving time for software finishing and making application development easier.
Development cases mainly include:
- ARM and FPGA communication development case (SPI/SDIO)
- 8/16通道国产同步AD采集开发案例（与AD7606/AD7616管脚兼容）
- Linux、Linux-RT、Qt应用开发案例
- Docker容器技术、MQTT通信协议、Ubuntu操作系统演示案例
- 4G/WIFI/Bluetooth开发案例
- IgH EtherCAT主站、SPI转CAN开发案例
- 双屏异显、OpenCV、H.264/H.265视频硬件编解码开发案例
5 电气特性
工作环境
表 3
| 环境参数 |
最小值 |
典型值 |
最大值 |
| 工作温度 |
-40°C |
/ |
85°C |
| 工作电压 |
/ |
5.0V |
/ |
功耗测试
表 4
| 工作状态 |
电压典型值 |
电流典型值 |
功耗典型值 |
| 空闲状态 |
5.0V |
0.18A |
0.90W |
| 满负荷状态 |
5.0V |
0.41A |
2.05W |
备注：功耗基于TLT507-EVM评估板测得。测试数据与具体应用场景有关，仅供参考。
空闲状态：系统启动，评估板不接入其他外接模块，不执行程序。
满负荷状态：系统启动，评估板不接入其他外接模块，运行DDR压力读写测试程序，4个ARM Cortex-A53核心的资源使用率约为100%。
6 机械尺寸
表 5
| PCB尺寸 |
37mm*58mm |
| PCB层数 |
8层 |
| PCB板厚 |
1.6mm |
图 7 核心板机械尺寸图
7 产品型号
表 6
| 型号 |
CPU |
主频 |
eMMC |
DDR4 |
温度级别 |
是否为 全国产 |
| SOM-TLT507-64GE8GD-I-A1.0 |
T507-H |
1.416GHz |
8GByte |
1GByte |
工业级 |
是 |
| SOM-TLT507-128GE16GD-I-A1.0 |
T507-H |
1.416GHz |
16GByte |
2GByte |
工业级 |
是 |
| SOM-TLT507-64GE8GD-C-A1.0 |
T507-H |
1.416GHz |
8GByte |
1GByte |
商业级 |
否 |
| SOM-TLT507-128GE16GD-C-A1.0 |
T507-H |
1.416GHz |
16GByte |
2GByte |
商业级 |
否 |
备注：标配为SOM-TLT507-64GE8GD-I-A1.0。
型号参数解释
图 8
8 技术服务
（1） 协助底板设计和测试，减少硬件设计失误；
（2） 协助解决按照用户手册操作出现的异常问题；
（3） 协助产品故障判定；
（4） 协助正确编译与运行所提供的源代码；
（5） 协助进行产品二次开发；
（6） 提供长期的售后服务。
9 增值服务
- 主板定制设计
- 核心板定制设计
- 嵌入式软件开发
- 项目合作开发
- 技术培训
更多关于全志科技T507-H核心板的开发资料，欢迎关注本账号或在评论区留言~