1 Introduction to Core Board
Chuanglong Technology SOM-TL62x is a high-performance and low-power industrial-grade core board based on TI Sitara series AM62x single/dual/quad-core ARM Cortex-A53 + single-core ARM Cortex-M4F heterogeneous multi-core processor design. Level B2B connector leads to 2x Ethernet, 9x UART, 3x CAN-FD, GPMC, 2x USB 2.0, CSI, DISPLAY and other interfaces. The main frequency of the processor ARM Cortex-A53 (64-bit) main processing unit is up to 1.4GHz, and the main frequency of ARM Cortex-M4F real-time processing unit is up to 400MHz. It adopts the latest 16nm process and has a GPMC parallel port that can communicate with FPGA at high speed. It also supports dual Different screen display, 3D graphics accelerator. The core board has been verified by professional PCB layout and high and low temperature tests. It is stable and reliable, and can meet various industrial application environments.
When users use the core board for secondary development, they only need to focus on the upper layer application, which reduces the development difficulty and time cost, and can quickly conduct product solution evaluation and technology pre-research.
Figure 1 Front view of the core board
Figure 2 Back view of the core board
Figure 3 Oblique view of the core board
Figure 4 Side view of the core board
2 typical application fields
- Industrial HMI
- Instrumentation
- Industrial Gateway
- Industrial robot
- Motion Controller
- Distribution terminal
3 Software and hardware parameters
hardware block diagram
Figure 5 core board hardware block diagram
Figure 6 AM62x processor functional block diagram
hardware parameters
Table 1
CPU |
CPU: TI Stara AM6231/AM6232/AM6254 |
1x ARM Cortex-A53(64bit), main frequency 1.0GHz(AM6231), or 2x ARM Cortex-A53(64bit), main frequency 1.4GHz(AM6232), or 4x ARM Cortex-A53(64bit), main frequency 1.4GHz(AM6254) |
|
Cortex-M4F, dedicated real-time processing unit, main frequency 400MHz |
|
3D GPU graphics accelerator, supports OpenGL 3.x/2.0/1.1, Vulkan 1.2(AM6254 Only) |
|
ROM |
4/8GByte eMMC |
RAM |
512M/1G/2GByte DDR4 |
B2B Connector |
2x 60pin male B2B connector, 2x 60pin female B2B connector, 240pin in total, 0.5mm pitch, 4.0mm height |
LED |
1x Power LED |
2x User Programmable LEDs |
|
hardware resources |
1x GPMC |
3x CAN-FD |
|
6x I2C, support 100Kbps, 400Kbps communication rate |
|
5x SPI |
|
3x MMCSD, support 4bit SD/SDIO Remarks: The eMMC device on the core board has used MMCSD0 |
|
1x OSPI |
|
14x Timer(4 Timer in M4F) |
|
3x ePWM |
|
9x UART |
|
3x eCAP |
|
2x USB 2.0 |
|
2x 10/100/1000M Ethernet, support EtherCAT, TSN communication protocol |
|
1x CSI |
|
3x MCASP |
|
3x eQEP |
|
1x DSS(VOUT0) |
|
1x OLDI/LVDS(4 lanes - 2x) |
Remarks: Some pin resources are reused.
software parameters
Table 2
Linux kernel version |
Linux-5.10 |
|
File system |
Linux、Linux-RT、Ubuntu、RTOS |
|
CCS version number |
CCS11.2.0 |
|
The software development kit provides |
Processor-SDK Linux-RT、MCU-PLUS-SDK |
|
Driver support |
SPI FLASH |
DDR4 |
eMMC |
MMC/SD |
|
GPMC |
Ethernet |
|
ePWM |
eCAP |
|
LED |
KEY |
|
RS232 |
RS485 |
|
RS422 |
EEPROM |
|
USB 2.0 |
CAN-FD |
|
2C |
RTC |
|
USB 4G |
USB WIFI |
|
TFT LCD/HDMI OUT |
LVDS LCD |
|
Touch Screen |
MIPI CSI |
4 Development Information
(1) Provide core board pin definition, editable base board schematic diagram, editable base board PCB, chip Datasheet, shorten the hardware design cycle;
(2) Provide system solidified image, kernel driver source code, file system source code, and rich Demo programs;
(3) Provide a complete platform development kit and introductory tutorials, saving time for software finishing and making application development easier;
(4) Provide detailed multi-core architecture communication tutorials to perfectly solve the bottleneck of multi-core development.
开发案例主要包括:
- Linux/Linux-RT应用开发案例
- Qt开发案例
- Cortex-M4F开发案例
- 多核通信开发案例
- 多网口开发案例
- 双屏异显开发案例
- EtherCAT开发案例
- 4G通信开发案例
- TSN通信开发案例
- MIPI摄像头视频采集开发案例
- 基于GPMC的ARM与FPGA通信开发案例
5 电气特性
工作环境
表 3
环境参数 |
最小值 |
典型值 |
最大值 |
工作温度 |
-40°C |
/ |
85°C |
工作电压 |
/ |
3.3V |
/ |
功耗测试
表 4
工作状态 |
电压典型值 |
电流典型值 |
功耗典型值 |
空闲状态 |
3.3V |
0.46A |
1.52W |
满负荷状态 |
3.3V |
0.69A |
2.28W |
备注:功耗基于TL62x-EVM评估板测得。测试数据与具体应用场景有关,仅供参考。
空闲状态:系统启动,评估板不接入其他外接模块,不执行程序。
满负荷状态:系统启动,评估板不接入其他外接模块,运行DDR压力读写测试程序,每个ARM Cortex-A53核心的资源使用率约为100%。
6 机械尺寸
表 5
PCB尺寸 |
34mm*56mm |
PCB层数 |
10层 |
PCB板厚 |
1.6mm |
安装孔数量 |
4个 |
图 7 核心板机械尺寸图
7 产品型号
表6
型号 |
CPU |
主频 |
eMMC |
DDR4 |
温度级别 |
SOM-TL6254-1400-64GE8GD-I-A2.0 |
AM6254 |
1.4GHz |
8GByte |
1GByte |
工业级 |
SOM-TL6254-1400-64GE16GD-I-A2.0 |
AM6254 |
1.4GHz |
8GByte |
2GByte |
工业级 |
SOM-TL6232-1400-64GE8GD-I-A2.0 |
AM6232 |
1.4GHz |
8GByte |
1GByte |
工业级 |
SOM-TL6231-1000-32GE4GD-I-A2.0 |
AM6231 |
1.0GHz |
4GByte |
512MByte |
工业级 |
备注:标配为SOM-TL6254-1400-64GE8GD-I-A2.0。
型号参数解释
图 8
8 技术服务
(1)协助底板设计和测试,减少硬件设计失误;
(2)协助解决按照用户手册操作出现的异常问题;
(3)协助产品故障判定;
(4)协助正确编译与运行所提供的源代码;
(5)协助进行产品二次开发;
(6)提供长期的售后服务。
9 增值服务
- 主板定制设计
- 核心板定制设计
- 嵌入式软件开发
- 项目合作开发
- 技术培训