希望利用pdfminer库来识别pdf中的器件引脚图，这样可实现引脚的自动化检查。代码如下：
# import pdfminer
from pdfminer.pdfparser import PDFParser,PDFDocument
from pdfminer.pdfinterp import PDFResourceManager,PDFPageInterpreter
from pdfminer.converter import PDFPageAggregator
from pdfminer.layout import LTTextBoxHorizontal,LAParams
from pdfminer.pdfinterp import PDFTextExtractionNotAllowed
f=open('1.txt','w+',encoding='GB18030')
fp=open('max3222.pdf','rb')
praser=PDFParser(fp)
doc=PDFDocument()
praser.set_document(doc)
doc.set_parser(praser)
doc.initialize()
if not doc.is_extractable:
raise PDFTextExtractionNotAllowed
else:
rsrcmgr=PDFResourceManager()
laparams=LAParams()
device=PDFPageAggregator(rsrcmgr,laparams=laparams)
interpreter=PDFPageInterpreter(rsrcmgr,device)
for page in doc.get_pages():
interpreter.process_page(page)
layout=device.get_result()
for x in layout:
if(isinstance(x,LTTextBoxHorizontal)):
f.write(x.get_text().strip())
f.close()
结果引脚图压根没识别，直接跳到表格。。。。
MAX3222 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver With ±15-kV ESD
ProtectionSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX32221 Features1?? RS-232 Bus-Pin ESD Protection Exceeds ±15 kV
Using Human-Body Model (HBM)
?? Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
?? Operates With 3-V to 5.5-V VCC Supply
?? Operates Up to 250 kbps
?? Two Drivers and Two Receivers
??
Low Standby Current: 1 ??A Typical
?? External Capacitors: 4 × 0.1 ??F
?? Accepts 5-V Logic Input With 3.3-V Supply
?? Alternative High-Speed Pin-Compatible Device
(1 Mbps)
– SNx5C32222 Applications?? Battery-Powered Systems
?? PDAs
?? Notebooks
??
Laptops
?? Palmtop PCs
?? Hand-held Equipment3 DescriptionThe MAX3222 consists of two line drivers, two line
receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins,
including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface
between an asynchronous communication controller
and the serial-port connector. The charge pump and
four small external capacitors allow operation from a
single 3-V to 5.5-V supply. The device operates at
data signaling rates up to 250 kbit/s and a maximum
of 30-V/μs driver output slew rate.
The MAX3222 can be placed in the power-down
mode by setting PWRDOWN low, which draws only 1
μA from the power supply. When the device is
powered down, the receivers remain active while the
drivers are placed in the high-impedance state.
Receiver outputs also can be placed in the high-
impedance state by setting EN high.Device Information(1)PART NUMBERPACKAGEBODY SIZE (NOM)SOIC (20)SSOP (20)12.80 mm × 7.50 mmMAX3222CDW,
MAX322IDW
MAX3222CDB,
MAX322IDB
MAX3222CPW,
MAX322IPW
(1) For all available packages, see the orderable addendum at
the end of the data sheet.7.20 mm × 5.30 mmTSSOP (20)6.50 mm × 4.40 mmBlock Diagram1An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.MAX3222SLLS408H – JANUARY 2000 – REVISED OCTOBER 2016www.ti.comTable of Contents1Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 25 Pin Configuration and Functions ......................... 36 Specifications......................................................... 46.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions ....................... 4
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics: Device .............................. 5
6.6 Electrical Characteristics: Driver ............................... 5
6.7 Electrical Characteristics: Receiver .......................... 6
6.8 Switching Characteristics: Driver .............................. 6
6.9 Switching Characteristics: Receiver .......................... 6
6.10 Typical Characteristics ............................................ 77 Parameter Measurement Information .................. 88 Detailed Description ............................................ 108.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description ................................................. 11
8.4 Device Functional Modes ........................................ 119 Application and Implementation ........................ 129.1 Application Information............................................ 12
9.2 Typical Application ................................................. 1210 Power Supply Recommendations ..................... 1311 Layout................................................................... 1311.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 1412 Device and Documentation Support ................. 1512.1 Receiving Notification of Documentation Updates 15
12.2 Community Resources .......................................... 15
12.3 Trademarks ........................................................... 15
12.4 Electrostatic Discharge Caution ............................ 15
12.5 Glossary ................................................................ 1513 Mechanical, Packaging, and OrderableInformation ........................................................... 154 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision G (March 2004) to Revision HPage?? Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
?? Deleted ODERING INFORMATION table; see POA at the end of the datasheet. ................................................................ 3
?? Changed RθJA for DB, DW and PW package from: 70 °C/W to 84.4°C/W (DB), 58 °C/W to 70.2 °C/W (DW) and 83
°C/W to 94.3 °C/W (PW) in the Thermal Information table. ................................................................................................... 52Submit Documentation FeedbackCopyright ?? 2000–2016, Texas Instruments IncorporatedProduct Folder Links: MAX3222www.ti.com5 Pin Configuration and FunctionsSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX3222DB, DW, or PW Package
20-Pin SOIC, SSOP, TSSOP
Top ViewPINNAMEC1+
C1-
C2+
C2-
DIN1
DIN2
DOUT1
DOUT2
EN
GND
NC
PWRDOWN
RIN1
RIN2
ROUT1
ROUT2VCCV+
V-NO.2
4
5
6
13
12
17
8
1
18
11,14
20
16
9
15
10
19
3
7I/O—
—
—
—
I
I
O
O
I
—
—
I
I
I
O
O
—
—
—Pin FunctionsDESCRIPTIONCharge pump capacitor pin
Charge pump capacitor pin
Charge pump capacitor pin
Charge pump capacitor pin
Driver logic input
Driver logic input
RS-232 driver output
RS-232 driver output
Receiver enable, active low
Ground
No internal connection
Driver disable, active low
RS-232 receiver input
RS-232 receiver input
Receiver logic output
Receiver logic output
Power Supply
Charge pump capacitor pin
Charge pump capacitor pinCopyright ?? 2000–2016, Texas Instruments IncorporatedSubmit Documentation Feedback3Product Folder Links: MAX3222MAX3222SLLS408H – JANUARY 2000 – REVISED OCTOBER 20166 Specifications6.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted) (1)(2)Supply voltage, VCC
Positive output supply voltage, V+ (2)
Negative output supply voltage, V– (2)
Supply voltage difference, V+ – V–MIN–0.3
–0.3
0.3www.ti.comMAXUNITV
V
V
VVV6
7
-7
13
6
25
13.2
VCC + 0.3
150
150Input voltage, VIOutput voltage, VODrivers, EN, PWRDOWN
Receiver
Drivers
Receivers
Operating virtual junction temperature, TJ
Storage temperature, Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.–0.3
–25
–13.2
–0.3°C
°C–656.2 ESD RatingsV(ESD)Electrostatic
dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001
RIN, DOUT, and GND pins (1)Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)VALUEUNITPins 8, 9, 16, 17
and 18
All other pinsAll pins±15000±3000±1500V(1)
(2)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted) (1). See Figure 8.Supply voltageVCC = 3.3 V
VCC = 5 VDIR, EN, PWRDOWNDriver and control high-level
input voltage
Driver and control low-level
input voltage
Driver and control input voltage DIR, EN, PWRDOWN
Receiver input voltageDIR, EN, PWRDOWNOperating free-air temperatureMAX3222C
MAX3222IVIHVILVI
VITAVCC = 3.3 V
VCC = 5 VMIN NOM MAX UNIT3
4.5
2
2.40
–25
0
–403.3
53.6
5.50.85.5
25
70
85VVVV
V??C(1) Test conditions are C1??C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2??C4 = 0.33 μF at VCC = 5 V ± 0.5 V.4Submit Documentation FeedbackCopyright ?? 2000–2016, Texas Instruments IncorporatedProduct Folder Links: MAX3222www.ti.com6.4 Thermal InformationTHERMAL METRIC (1) (2) (3)RθJA
RθJC(top)
RθJB
ψJT
ψJBJunction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameterSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX3222DB (SSOP)
20 PINSMAX3222
DW (SOIC)
20 PINSPW (TSSOP)
20 PINS84.4
44.1
40
11
39.570.2
36.2
37.9
11.1
37.594.3
29.9
45.1
1.4
44.6UNIT°C/W
°C/W
°C/W
°C/W
°C/W(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) ?? TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.6.5 Electrical Characteristics: Deviceover operating free-air temperature range (unless otherwise noted) (1). See Figure 8.IIICCPARAMETERInput leakage current (EN,
PWRDOWN)
Supply current
Supply current (powered off)TEST CONDITIONSMINNo load, PWRDOWN at VCC
No load, PWRDOWN at GNDTYP (2)±0.010.3
1MAXUNIT±11
10??AmA
??A(1) Test conditions are C1??C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2??C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.6.6 Electrical Characteristics: Driverover operating free-air temperature range (unless otherwise noted) (1). See Figure 8.PARAMETERTEST CONDITIONSMINTYP (2)MAXUNITVOHHigh-level output voltageLow-level output voltageDOUT at RL = 3 kΩ to GND, DIN =
GND
DOUT at RL = 3 kΩ to GND, DIN =VCC5–55.4–5.4VV??A
??AmAΩ??A±1
±1±60±25±25VOL
IIH
IILIOSroIoffOutput resistanceShort-circuit output currentHigh-level input current
Low-level input currentVI = VCC
VI at GND
VCC = 3.6 V, VO = 0 V
VCC = 5.5 V, VO = 0 V
VCC, V+, and V– = 0 V, VO = ±2 V
PWRDOWN = GND, VO = ±12 V,
VCC = 3 V to 3.6 V
PWRDOWN = GND, VO = ±10 V,
VCC = 4.5 V to 5.5 V
(1) Test conditions are C1??C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2??C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.Output leakage current±3510M±0.01
±0.01300Copyright ?? 2000–2016, Texas Instruments IncorporatedSubmit Documentation Feedback5Product Folder Links: MAX3222VOH
VOLVIT+VIT–Vhys
IoffPARAMETERHigh-level output voltage
Low-level output voltage
Positive-going input threshold
voltageNegative-going input threshold
voltage
Input hysteresis (VIT+ – VIT–)
Output leakage current
Input resistanceIOH = –1 mA
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V0.6
0.81.5
1.8
1.2
1.5
0.3
±0.05
5V
VVVV
??A
kΩ0.4
2.4
2.4±10
7MAX3222SLLS408H – JANUARY 2000 – REVISED OCTOBER 20166.7 Electrical Characteristics: Receiverover operating free-air temperature range (unless otherwise noted) (1). See Figure 8.www.ti.comTEST CONDITIONSMINTYP (2)MAXUNITVCC – 0.6VCC – 0.1EN = VCC
ri
VI = ±3 V to ±25 V
(1) Test conditions are C1??C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2??C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.36.8 Switching Characteristics: Driverover operating free-air temperature range (unless otherwise noted) (1). See Figure 8.PARAMETERMaximum data ratetsk(p)Pulse skew (3)TEST CONDITIONSCL = 1000 pF, RL = 3 kΩ, One DOUT switching, see
Figure 3
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, see
Figure 4SR(tr)Slew rate, transition region
(see Figure 3)RL = 3 kΩ to 7 kΩ, VCC = 3.3
VCL = 150 pF to 1000
pF
CL = 150 pF to 2500
pFMIN15064TYP (2)MAXUNIT250300kbpsnsV/??s3030(1) Test conditions are C1??C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2??C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH ?? tPHL| of each channel of the same device.6.9 Switching Characteristics: Receiverover operating free-air temperature range (unless otherwise noted) (1). See Figure 8.PARAMETERTEST CONDITIONSMINTYP (2)MAXUNITtPLHtPHLtentdis
tsk(p)Propagation delay time, low- to high-
level output
Propagation delay time, high- to low-
level outputOutput enable timeOutput disable timePulse skew (3)CL = 150 pF, see Figure 5CL = 150 pF, see Figure 5
CL = 150 pF, RL = 3 kΩ, see
Figure 6
CL = 150 pF, RL = 3 kΩ, see
Figure 6
See Figure 5300300200200300nsnsnsnsns(1) Test conditions are C1??C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2??C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH ?? tPHL| of each channel of the same device.6Submit Documentation FeedbackCopyright ?? 2000–2016, Texas Instruments IncorporatedProduct Folder Links: MAX3222www.ti.com6.10 Typical CharacteristicsTA = 25° C; VCC = 3.3VSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX3222Figure 1. Driver VOH vs Load CurrentFigure 2. Driver VOL vs Load CurrentCopyright ?? 2000–2016, Texas Instruments IncorporatedSubmit Documentation Feedback7Product Folder Links: MAX3222MAX3222SLLS408H – JANUARY 2000 – REVISED OCTOBER 20167 Parameter Measurement Informationwww.ti.comFigure 3. Driver Slew RateFigure 4. Driver Pulse SkewFigure 5. Receiver Propagation Delay Times8Submit Documentation FeedbackCopyright ?? 2000–2016, Texas Instruments IncorporatedProduct Folder Links: MAX3222www.ti.comSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX3222Parameter Measurement Information (continued)Figure 6. Receiver Enable and Disable TimesCopyright ?? 2000–2016, Texas Instruments IncorporatedSubmit Documentation Feedback9Product Folder Links: MAX3222MAX3222SLLS408H – JANUARY 2000 – REVISED OCTOBER 20168 Detailed Description8.1 Overviewwww.ti.comThe MAX3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-
232-F and provides the electrical interface between an asynchronous communication controller and the serial-
port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew
rate.
The MAX3222 can be placed in the power-down mode by setting PWRDOWN low, which draws only 1 μA from
the power supply. When the device is powered down, the receivers remain active while the drivers are placed in
the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to VCC,
and V?? is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting EN
high.8.2 Functional Block DiagramFigure 7. Logic Diagram (Positive Logic)10Submit Documentation FeedbackCopyright ?? 2000–2016, Texas Instruments IncorporatedProduct Folder Links: MAX3222www.ti.com8.3 Feature Description8.3.1 PowerSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX3222The power block increases, inverts, and regulates voltage at V+ and V- pins using a charge pump that requires
four external capacitors.8.3.2 RS232 DriverTwo drivers interface standard logic level
to RS232 levels. PWRDOWN input
low turns driver off and
PWRDOWN input high turns driver on. Both DIN inputs and PWRDOWN input must be valid high or low. Do not
float logic input pins.8.3.3 RS232 ReceiverTwo receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT.
Each RIN input includes an internal standard RS232 load. EN input low turns on both ROUT pins. EN input high
puts both ROUT pins into high impedance state, output off. EN input must be valid high or low. Do not float logic
input pins.8.4 Device Functional ModesDriver and receiver outputs are controlled by the functional truth tables.Table 1. Functional Table - Each Driver (1)INPUTSPWRDOWNL
H
HDINX
L
HOUTPUT DOUTZ
H
L(1) H = high level, L = low level, X = irrelevant, Z = high impedanceTable 2. Functional Table - Each Receiver (1)INPUTSRINL
H
X
OpenENL
L
H
LOUTPUT ROUTH
L
Z
H(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or
connected driver offCopyright ?? 2000–2016, Texas Instruments IncorporatedSubmit Documentation Feedback11Product Folder Links: MAX3222MAX3222SLLS408H – JANUARY 2000 – REVISED OCTOBER 20169 Application and Implementationwww.ti.comInformation in the following applications sections is not part of
the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.NOTE9.1 Application InformationThe MAX3222 interfaces a universal asynchronous receiver / transmitter (UART) to RS-232 port voltage levels.
External capacitors are used to generate RS-232 compliant voltages. For proper operation, add capacitors as
shown in Figure 8.9.2 Typical ApplicationROUT and DIN connect to UART or general purpose logic lines. RIN and DOUT lines connect to a RS232
connector or cable.C3 can be connected to VCC or GND.
Resistor values shown are nominal.
NC ?? No internal connection
Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should
be connected as shown.Figure 8. Recommended Application Schematic9.2.1 Design Requirements?? Recommended VCC is 3.3 V or 5 V. 3 V to 5.5 V is also possible
?? Maximum recommended bit rate is 250 kbit/s.Table 3. VCC vs Capacitor ValuesVCC3.3 V ± 0.3 V
5 V ± 0.5 V
3 V ± 5.5 VC10.1 ??F
0.047 ??F
0.1 ??FC2, C3, and C40.1 ??F
0.33 ??F
0.47 ??F12Submit Documentation FeedbackCopyright ?? 2000–2016, Texas Instruments IncorporatedProduct Folder Links: MAX3222www.ti.com9.2.2 Detailed Design ProcedureSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX3222?? All DIN, PWRDOWN and EN inputs must be connected to valid low or high logic levels.
?? Select capacitor values based on VCC level for best performance.9.2.3 Application CurvesFigure 9. Loopback Waveforms
VCC = 3.3 V, Data Rate 250 kbit/sFigure 10. Loopback Waveforms with 1-nF load
VCC = 3.3 V, Data Rate 250 kbit/s10 Power Supply RecommendationsVCC should be between 3 V and 5.5 V. Charge pump capacitors should be chosen using table in Table 3.11 Layout11.1 Layout GuidelinesKeep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise
and fall times. Make the impedance from MAX3222 ground pin and circuit board's ground plane as low as
possible for best ESD performance. Use wide metal and multiple vias on both sides of ground pinCopyright ?? 2000–2016, Texas Instruments IncorporatedSubmit Documentation Feedback13Product Folder Links: MAX3222MAX3222SLLS408H – JANUARY 2000 – REVISED OCTOBER 201611.2 Layout Examplewww.ti.comFigure 11. MAX3222 Layout14Submit Documentation FeedbackCopyright ?? 2000–2016, Texas Instruments IncorporatedProduct Folder Links: MAX3222www.ti.com12 Device and Documentation SupportSLLS408H – JANUARY 2000 – REVISED OCTOBER 2016MAX322212.1 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.12.2 Community ResourcesThe following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.TI E2E?? Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaborationamong engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.12.3 TrademarksE2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.12.4 Electrostatic Discharge CautionThese devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.12.5 GlossarySLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.13 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.Copyright ?? 2000–2016, Texas Instruments IncorporatedSubmit Documentation Feedback15Product Folder Links: MAX3222PACKAGE OPTION ADDENDUMwww.ti.com24-Aug-2018Addendum-Page 1PACKAGING INFORMATIONOrderable DeviceStatus(1)Package Type Package
Drawing
DBPins Package
Qty
70Eco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp ( °C)Device Marking(4/5)SamplesMAX3222CDBACTIVESSOP20Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)CU NIPDAULevel-1-260C-UNLIM0 to 70MA3222CMAX3222CDBRACTIVESSOPDB202000CU NIPDAULevel-1-260C-UNLIM0 to 70MA3222CMAX3222CDBRE4ACTIVESSOPDB202000CU NIPDAULevel-1-260C-UNLIM0 to 70MA3222CMAX3222CDBRG4ACTIVESSOPDB202000CU NIPDAULevel-1-260C-UNLIM0 to 70MA3222CMAX3222CDWACTIVESOICDW2025CU NIPDAULevel-1-260C-UNLIM0 to 70MAX3222CMAX3222CDWRACTIVESOICDW202000CU NIPDAULevel-1-260C-UNLIM0 to 70MAX3222CMAX3222CDWRE4ACTIVESOICDW202000CU NIPDAULevel-1-260C-UNLIM0 to 70MAX3222CMAX3222CPWACTIVETSSOPPW2070CU NIPDAULevel-1-260C-UNLIM0 to 70MA3222CMAX3222CPWRACTIVETSSOPPW202000CU NIPDAULevel-1-260C-UNLIM0 to 70MA3222CMAX3222IDBACTIVESSOPDB2070CU NIPDAULevel-1-260C-UNLIM-40 to 85MB3222IMAX3222IDBRACTIVESSOPDB202000CU NIPDAULevel-1-260C-UNLIM-40 to 85MB3222IMAX3222IDBRE4ACTIVESSOPDB202000CU NIPDAULevel-1-260C-UNLIM-40 to 85MB3222IMAX3222IDWACTIVESOICDW2025CU NIPDAULevel-1-260C-UNLIM-40 to 85MAX3222IMAX3222IDWG4ACTIVESOICDW2025CU NIPDAULevel-1-260C-UNLIM-40 to 85MAX3222IMAX3222IDWRACTIVESOICDW202000CU NIPDAULevel-1-260C-UNLIM-40 to 85MAX3222IMAX3222IPWACTIVETSSOPPW2070CU NIPDAULevel-1-260C-UNLIM-40 to 85MB3222IMAX3222IPWRACTIVETSSOPPW202000CU NIPDAULevel-1-260C-UNLIM-40 to 85MB3222IPACKAGE OPTION ADDENDUMwww.ti.com24-Aug-2018Orderable DeviceMAX3222IPWRE4Status(1)ACTIVEPackage Type Package
Drawing
PWTSSOPPins Package
Qty
200020Eco PlanLead/Ball FinishMSL Peak TempOp Temp ( °C)Device MarkingSamples(2)(6)(3)(4/5)Green (RoHS
& no Sb/Br)CU NIPDAULevel-1-260C-UNLIM-40 to 85MB3222I(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2www.ti.com2-Oct-2019PACKAGE MATERIALS INFORMATIONTAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage
TypePackage
DrawingPinsSPQMAX3222CDBR
MAX3222CDWR
MAX3222CPWR
MAX3222IDBR
MAX3222IDWR
MAX3222IPWRSSOP
SOIC
TSSOP
SSOP
SOIC
TSSOPDB
DW
PW
DB
DW
PW20
20
20
20
20
202000
2000
2000
2000
2000
2000Reel
Diameter
(mm)
330.0
330.0
330.0
330.0
330.0
330.0Reel
Width
W1 (mm)
16.4
24.4
16.4
16.4
24.4
16.4A0
(mm)B0
(mm)K0
(mm)P1
(mm)W
(mm)Pin1
Quadrant8.2
10.8
6.95
8.2
10.8
6.957.5
13.3
7.1
7.5
13.3
7.02.5
2.7
1.6
2.5
2.7
1.412.0
12.0
8.0
12.0
12.0
8.016.0
24.0
16.0
16.0
24.0
16.0Q1
Q1
Q1
Q1
Q1
Q1Pack Materials-Page 1www.ti.com2-Oct-2019PACKAGE MATERIALS INFORMATION*All dimensions are nominalDevicePackage TypePackage Drawing PinsMAX3222CDBR
MAX3222CDWR
MAX3222CPWR
MAX3222IDBR
MAX3222IDWR
MAX3222IPWRSSOP
SOIC
TSSOP
SSOP
SOIC
TSSOPDB
DW
PW
DB
DW
PW20
20
20
20
20
20SPQ2000
2000
2000
2000
2000
2000Length (mm) Width (mm) Height (mm)367.0
367.0
367.0
367.0
367.0
367.0367.0
367.0
367.0
367.0
367.0
367.038.0
45.0
38.0
38.0
45.0
38.0Pack Materials-Page 2PACKAGE OUTLINESSOP - 2 mm max heightSMALL OUTLINE PACKAGEC0.1 CSEATING
PLANEDB0020ASCALE 2.000A17.5
6.9
NOTE 310B8.2
7.4 TYP
PIN 1 INDEX AREA18X 0.65202X
5.851120X 0.38
0.22
0.1C A B5.6
5.0
NOTE 4SEE DETAIL A(0.15) TYP0.25
GAGE PLANE0 -80.95
0.552 MAX0.05 MINA 15DETAIL ATYPICAL4214851/B 08/2019NOTES:1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.www.ti.comDB0020AEXAMPLE BOARD LAYOUTSSOP - 2 mm max heightSMALL OUTLINE PACKAGE20X (1.85)SYMM1
20X (0.45)18X (0.65)(R0.05) TYP20SYMM1011(7)LAND PATTERN EXAMPLEEXPOSED METAL SHOWN
SCALE: 10XSOLDER MASK
OPENINGMETALMETAL UNDER
SOLDER MASKSOLDER MASK
OPENINGEXPOSED METALEXPOSED METAL0.07 MAX
ALL AROUNDNON-SOLDER MASK
DEFINED
(PREFERRED)SOLDER MASK DETAILS15.0000.07 MIN
ALL AROUNDSOLDER MASK
DEFINED4214851/B 08/2019NOTES: (continued)6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.www.ti.comDB0020AEXAMPLE STENCIL DESIGNSSOP - 2 mm max heightSMALL OUTLINE PACKAGE20X (1.85)SYMM1
20X (0.45)18X (0.65)(R0.05) TYP20SYMM1011(7)SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCIL
SCALE: 10XNOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.4214851/B 08/2019www.ti.comPACKAGE OUTLINESOIC - 2.65 mm max heightSOICCSEATING PLANE0.1 CDW0020ASCALE 1.200A113.0
12.6
NOTE 310.63
9.97TYPPIN 1 ID
AREA18X 1.27202X
11.4310B7.6
7.4
NOTE 41120X 0.51
0.31
0.25C A B2.65 MAXSEE DETAIL A0.33
0.10TYP0.25
GAGE PLANE0 - 80.3
0.11.27
0.40DETAIL ATYPICAL4220724/A 05/2016NOTES:1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.www.ti.comDW0020AEXAMPLE BOARD LAYOUTSOIC - 2.65 mm max heightSOICSYMM20X (2)120X (0.6)18X (1.27))(R
0.05
TYP10(9.3)LAND PATTERN EXAMPLESCALE:6XSYMM2011SOLDER MASK
OPENINGMETALMETAL UNDER
SOLDER MASKSOLDER MASK
OPENING0.07 MAX
ALL AROUNDNON SOLDER MASK
DEFINED0.07 MIN
ALL AROUNDSOLDER MASK
DEFINEDSOLDER MASK DETAILS4220724/A 05/2016NOTES: (continued)6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.www.ti.comDW0020AEXAMPLE STENCIL DESIGNSOIC - 2.65 mm max heightSOICSYMM20X (2)120X (0.6)18X (1.27)10(9.3)SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCIL
SCALE:6XSYMM2011NOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.4220724/A 05/2016www.ti.comIMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ?? 2019, Texas Instruments IncorporatedC1+就出现了表格里面那一次，还没有用图像识别的能识别几个字符来的实在。
所以这条路走死，另外想办法。
