BC v1.2充电规范

1 JEITA
Reference to https://www.mianbaoban.cn/blog/post/169964
符合 JEITA 规范的锂离子电池充电器解决方案

2 Battery Fuel Gauge
2.1 Cycle Count(充放电循环次数)
此指令回传一只读字段,代表电芯组已经历的完整充放电循环数。当放电容量接近或等于设计容量(DesignCapacity)时定义为一循环。
page 63
http://www.ti.com/lit/ug/sluu431/sluu431.pdf
@drivers/power/bq28400_battery.c

2.2 DesignCapacity
DesignCapacity 代表电池设计容量,也就是手机出厂时全新电池的容量。

2.3 FullChargeCapacity
代表实际充满电的电池容量(电池现在总容量),也就是损耗后剩余的总电池容量,小于等于DesignCapacity。

3 BC1.2
3.1 充电器类型探测
1)DCD:DP上有150mV(= 10uA x 15K欧姆下拉电阻)的电压,DM上电压为0
2)Primary Det(DP发起检测DM):
- DP上加载0.6V电压,DM上电压为0,充电器类型是SDP
- DP上加载0.6V电压,DM上电压为0.6V,进入Secondary Det
3)Secondary Det(DM发起检测DP):
- DM上加载0.8V电压,DP上电压为0,充电器类型是CDP
- DM上加载0.8V电压,DP上电压为0.8V,充电器类型是DCP
Figure 3-1 CDP探测波形

3.2 Port Detection for Power Banks
doc no: SLVA770
http://www.ti.com.cn/cn/lit/an/slva770/slva770.pdf

3.3 URLs
USB充电及其线损补偿
https://zhuanlan.zhihu.com/p/25588452

-Microchip UCS1002
智能USB充电系统设计
https://wenku.baidu.com/view/1d9a9cbc8762caaedd33d449.html

4 Charge Flow in sbl1
4.1 Old Target Charging Flow
@core/systemdrivers/pmic/app/chg/src/pm_app_chg_alg.c
--->
pm_chg_battery_and_debug_board_detect_state

4.2 New Target Charging Flow
For example:
@systemdrivers/pmic/config/msm8937/pmi8937/pm_config_target.xml
--->
PM_PROP_SMBCHG_SPECIFIC_DATA

@boot/secboot3/hw/msm8976/sbl1/sbl1_config.c
--->
sbl1_ddr_init

@systemdrivers/pmic/target/msm8937_pm8937_pmi8937/system/src/pm_sbl_boot.c
--->
pm_sbl_chg_init

@systemdrivers/pmic/app/chg/src/pm_app_smbchg.c
--->
pm_sbl_chg_check_weak_battery_status

4.3 EDL D+ Checking
@boot/secboot3/hw/msm8952/sbl1/sbl1_config.c
qsee_jump_func(...)
{
    [...]
    if (boot_usb_al_check_for_pbl_dload(0))
    {
        boot_dload_transition_pbl_forced_dload();
    }
    [...]
}

5 AT43USB380
Figure 5-1 AT43USB380 USB and Charge Pump Connection for Host Mode

6 Abbreviation
ARC:Argonant RISC Core
AT91SAM9260:SAM means Smart ARM-based Microcontroller
ATL(CATL):Contemporary Amperex Technology Limited,Amperex是一个人造词,由Ampere(安培)和excellent(卓越)合成,意为提供卓越的电流
ATMEL SAMBA:ATMEL Smart ARM-based Microcontroller Boot Assistant
CC2530:TI ChipCon2530
DCD:Data Contact Detect
DWC2:Design Ware Controller 2,Apple的嵌入式设备,包括iPad和iPhone都是使用的DWC2
ISP1161:Philips' Integrated host Solution Pairs 1161,“Firms introduce USB host controllers”,https://www.eetimes.com/document.asp?doc_id=1290054
Quirks:the attributes of a device that are considered to be noncompliant with expected operation
SDI:Samsung Display Inc.
SEC:Samsung Electronics Co., Ltd.
SL811HS:Cypress/ScanLogic 811 Host/Slave,性能上与ISP1161(Integrated host Solution Pairs 1161)相当
TDI:TransDimension Inc.,该公司首先发明了将TT集成到EHCI RootHub中的方法,这样对于嵌入式系统来说,就省去了OHCI/UHCI的硬件,同时降低了成本,作为对该公司的纪念,Linux内核定义了宏ehci_is_TDI(ehci);产品UHC124表示USB Host Controller;收购了ARC USB技术;现已被chipidea收购,chipidea又被mips收购
TLV:TI Low Value,高性价比
TPS:TI Performance Solution
TT:Transaction Translator(事务转换器,将USB2.0的包转换成USB1.1的包)
USB BH reset:Bigger Hammer or Brad Hosler,表示warm reset;you may be confused why the USB 3.0 spec calls the same type of reset "warm reset" in some places and "BH reset" in other places. "BH" reset is supposed to stand for "Big Hammer" reset, but it also stands for "Brad Hosler". Brad died shortly after the USB 3.0 bus specification was started, and they decided to name the reset after him. The suggestion was made shortly before the spec was finalized, so the wording is a bit inconsistent.
xECP:xHCI Extended Capabilities Pointer

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