The 88W8997-A0-CBQ2E005-T is the industry's smallest and most energy-efficient MU-MIMO wireless interconnect combo chip for the enterprise and consumer markets. 88W8997 is the industry's first 28nm 2 x 2 802.11ac Wave-2 combo chip that fully supports Bluetooth 4.2 and the full set of future Bluetooth 5.0 functions. The device achieves a peak data transfer rate of up to 867Mbps, targeting flagship smartphone, tablet, mobile computing, gaming, TV and set-top box applications.
Key features:
General-purpose devices to meet a wide range of market segments and application needs
Multiple high-speed host interfaces – SDIO3.0, low-power PCIe, USB3.0 host interfaces;
module options, including M.2 1216 and 2230, SIP Chip circuit board design;
support Android, Chrome, Windows and Linux operating systems.
Small size, high efficiency 88W8997-A0-CBQ2E005-T wireless interconnect chip, NV24C64DWVLT3G 64Kb EEPROM memory—— Mingjiada
NV24C64LV is an EEPROM serial 64Kb I2C automotive memory organized as 256 pages of 32 bytes each. The device supports standard (100 kHz), fast (400 kHz), and accelerated (1 MHz) I2C protocols.
By providing a start address, 1 to 32 consecutive bytes are then loaded into the page write buffer and all data is written to non-volatile memory in one internal write cycle. Data is read by providing a start address, and then continuously shifted out while automatically incrementing the internal address count.
Device: NV24C64DWVLT3G
Description: EEPROM Memory IC 64Kb I²C 1 MHz 400 ns 8-SOIC
Memory Type: Non-Volatile Memory
Format: EEPROM
Technology: EEPROM
Storage Capacity: 64Kb
Memory Organization: 8K x 8
Memory Interface: I²C
Clock Frequency: 1 MHz
Write Cycle Time - Word, Page: 4ms
Access Time: 400 ns
Voltage - Power Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package/Case: 8-SOIC (0.154", 3.90mm wide)
Supplier Device Package: 8-SOIC
Base Part Number: NV24C64
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