On August 11, the 11th (2023) China Electronics Special Equipment Industry Association Semiconductor Equipment Annual Conference and Industry Chain Cooperation Forum (CSEAC) with the theme of "Working together to seize opportunities, integrating innovation and manufacturing equipment" was held in Taihu, Wuxi The International Expo Center was successfully closed. The 3-day CSEAC comprehensively presents the development achievements of my country's IC industry in terms of equipment, core components, and key materials, as well as the innovation and exploration of key links in the industrial chain, through exhibitions, forums, and new product releases. As a leader in the field of electron beam detection and measurement, Dongfang Jingyuan was invited by the organizer to appear at the conference, and held two important sessions at the chairman forum on semiconductor manufacturing technology and equipment materials, and the joint development forum on manufacturing technology and semiconductor equipment industry chain The keynote speech shared and discussed related cutting-edge technologies and trends, which received high attention from the participants and sparked enthusiastic responses.
Chairman Forum on Semiconductor Manufacturing Technology and Equipment Materials
In the roundtable dialogue, Dr. Yu Zongqiang, chairman of Dongfang Jingyuan, Dr. Yin Zhiyao, chairman and CEO of China Micro Semiconductor Equipment (Shanghai) Co., Ltd., Dr. Lu Guangquan, chairman of Tuojing Technology Co., Ltd., and other leaders of domestic semiconductor industry leaders On the same stage, exchange and discuss around technological innovation and how to do a good job in the coordinated development of the industry.
When talking about how companies face cyclical fluctuations in the industry, Yu Zongqiang said: "The cycle of the semiconductor industry is very strong, and now geopolitics is added to make it more complicated. Many unpredictable events will happen. My conclusion is to respond to all changes with the same , Practice internal strength well. In addition, do today’s things well, and prepare for tomorrow’s things, and then pay attention to what will happen the day after tomorrow, so as to respond to all changes with the same.”
The development and transformation of the industry is an eternal topic, and then the leaders of the roundtable forum exchanged views on the challenges and opportunities faced by their respective fields. "First of all, there are some things that can be done and some things that can't be done. It is impossible to do everything. Dongfang Jingyuan has only done one thing since its establishment ten years ago - how to improve the yield rate of existing integrated circuit manufacturing. We are also following this main line. Going forward”, Yu Zongqiang’s answer solved many people’s questions: why Dongfang Jingyuan has both electron beam testing and measurement equipment and EDA-related products.
In the speech session, Yu Zongqiang gave an in-depth analysis of the HPOTM (Holistic Process Optimization) yield maximization technical route leading the development of enterprises through the keynote speech of "Challenges in the Post-Moore Era and Opportunities of Artificial Intelligence - Chip Manufacturing from Art to Science to Intelligence" And product design concepts, the underlying core technology linking hardware and software, and current achievements in practice. Through his speech, everyone felt the arrival of the era of "smart manufacturing" of integrated circuits, which was thought-provoking.
Forum on Joint Development of Manufacturing Technology and Semiconductor Equipment Industry Chain
At the forum on the joint development of the manufacturing process and the semiconductor equipment industry chain, Dr. Sun Weiqiang, director of Dongfang Jingyuan Innovation Technology Research Institute, brought a speech entitled "The Road to Localization of Electron Beam Detection and Measurement Equipment for Integrated Circuit Yield Monitoring" speech. In a short 20-minute speech, Dr. Sun Weiqiang discussed the development trend of electron beam detection and measurement equipment, the technological frontier, and the three key points of localization research, as well as Dongfang Jingyuan's three major electronic solutions in CD-SEM, EBI, and DR-SEM. The technological innovations in the field of electron beam detection and measurement are shared, demonstrating the technical strength and forward-looking layout of Dongfang Jingyuan as the leader in the field of electron beam detection and measurement in China.
Electron beam detection and measurement equipment (including electron beam defect detection equipment, key dimension measurement equipment, etc.) It is an indispensable means of yield rate monitoring, but the market has been monopolized by foreign manufacturers for a long time. In order to solve the gap in the localization of such equipment, Dongfang Jingyuan has broken through technical difficulties such as high-resolution large-field scanning imaging, three-dimensional high-precision positioning compensation, intelligent defect detection and classification, etc. through nearly ten years of independent research and development. The chemical electron beam testing equipment has been applied to the integrated circuit production line, which has filled the gap in China and played an important role in promoting the development of detection technology in the field of integrated circuits in my country.
Semiconductor equipment plays an important role in supporting the entire semiconductor industry, and is the link with the broadest market space and the most important strategic value in the semiconductor industry chain. In the future, Dongfang Jingyuan will continue to develop in the field of electron beam detection and measurement, expand its leading advantages, and solve more industry-related problems. At the same time, by opening up the design and manufacturing links, it provides a new solution for the management of integrated circuit manufacturing yield, and contributes to the promotion of industrial development.