- Arcing arc discharge
- PR burn photoresist burn
- Peeling set off
- Bubble bubble
- Pits
- Broken fragment
- Polymer
- Blind VIA
- Poor planization Poor planization
- Blister foaming (highlight protrusions)
- PR Shrink photoresist shrinkage
- Foreign contamination foreign contamination
- Poor Coating Poor photoresist coating
- Corrosion Corrosion
- PR Flow photoresist flow
- Craze missing corner
- PR Lifting photoresist stripping
- Crack crack
- PR Non-uniform Photoresist thickness is uneven
- Tape residue
- PR remaining photoresist residue
- Si fragment broken chip
- Powder
- Contamination Dirty
- PR Bridge photoresist bridge
- Dis-color color abnormality
- Residure (ETCH) etching residue
- Damaged
- Residue( PHOTO ) yellow photoresist residue
- Educt of Phosphorous
- Residue (unknow) Undefinable residue
- Film abnormality film abnormality
- Repeating Defect Repeating Defect
- Finger print
- Roughness
- Flow type particle raised dust
- Residue(SPUT) metal sputtering residue
- Metal flaking metal flaking
- Scratch scratch
- hillock bump
- Si node silicon spots
- Nitride haze silicon nitride surface haze
- Slip slip line
- Local Defocus Area focus is poor
- Shot Defocus Shot Defocus
- Mis-alignment
- Stacking Faults 叠差
- Missing pattern is poorly defined
- Spike highlight, raised object
- Notching rat bite (jagged)
- Non-uniform color/line unevenness
- Tree - Like Defect dendritic corrosion
- No Pattern No graphics
- Thickness abnormal Thickness abnormal
- Orange Peel orange surface
- Under develop Poor development
- Over-etch Over-etching
- Void hole
- Out of control
- W Precipitation tungsten fold out
- Out of spec
- Particle dust
- Water spot water mark
From Zhihu: Dark Forest-Zhang Bin