The IPC-7095D implementation of ball grid array (BGA) and fine pitch ball grid array (FBGA) technology in the design, assembly, inspection and maintenance process poses some unique challenges. It provides useful and practical information for users who use or are considering using BGA. It also introduces how to use BGA to successfully realize the robust design and assembly process of printed circuit board components, and how to solve some common abnormalities that may occur in the BGA assembly process. Due to changes in the alloy in the solder ball, the shape of the solder ball, the packaging procedure, etc., many problems have become particularly important. The main focus of the D version is to provide information for some new mechanical failure problems that occur after assembly, such as cracks or lamination defects. In addition to providing guidelines for BGA inspection and maintenance, this standard also addresses reliability issues related to BGA and the use of lead-free solder joints. There are many X-ray and endoscope photos and illustrations in the standard to confirm some situations encountered in the implementation of the BGA assembly process in the industry.
IPC-7095D catalog download address
IPC-7095D sample download
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