TL6678-EasyEVM high-end multi-core DSP evaluation board

Introduction to Evaluation Board

Chuanglong TL6678-EasyEVM is a high-end multi-core DSP evaluation board based on TI's KeyStone architecture C6000 series TMS320C6678 octa-core C66x fixed-point/floating-point high-performance processor. It consists of a core board and a backplane. The core board has been verified by professional PCB Layout and high and low temperature testing, which is stable and reliable and can meet various industrial application environments .

The evaluation board has rich interface resources , leading to high-speed communication interfaces such as dual Gigabit Ethernet ports, SRIO, PCIe, etc., which is convenient for users to quickly evaluate product solutions and technical pre-research.

 

Figure 1 Front view of the evaluation board

 

 

Figure 2 Oblique view of evaluation board

  

Typical application areas

  • Software radio
  • Radar detection
  • Photodetection
  • Video tracking
  • Image Processing
  • Underwater detection
  • Positioning navigation

 

 

Software and hardware parameters

Hardware block diagram

 

Figure 3 The hardware block diagram of the evaluation board


 

Figure 4 Evaluation board hardware resource diagram 1

 

 

Figure 5 Evaluation board hardware resource diagram 2

 

Hardware parameters

 

Table 1

CPU

CPU : TI C6000 TMS320C6678

8x TMS320C66x fixed-point/floating-point DSP core, clocked at 1/1.25GHz

1x Network Coprocessor

ROM

128MByte NAND FLASH

128Mbit SPI NOR FLASH

1Mbit EEPROM

RAM

1/2GByte DDR3

ETC

256/512MByte DDR3

SENSOR

1x TMP102AIDRLT temperature sensor

B2B

Connector

2x 50pin male B2B connector, 2x 50pin female B2B connector, pitch 0.8mm, height 5.0mm;

1x 80pin high-speed B2B connector, pitch 0.5mm, height 5.0mm;

Total 280pin

LED

2x power indicator (1 core board, 1 backplane)

4x user programmable indicator lights (2 core boards, 2 backplanes)

KEY

1x power reset button

1x system reset button

1x non-maskable interrupt button

1x user input button

S RIO

1x SRIO, four ports, a total of four channels, each channel has a maximum communication rate of 5Gbaud, led out through the HDMI interface

PCIe

1x PCIe Gen2, a dual-channel port, the highest communication rate per channel 5GBaud, x4 gold finger connection

I

1x IDC3 simple horn holder, 2x 25pin specification, 2.54mm pitch, including EMIF16 expansion signal

1x IDC3 simple horn socket, 2x 25pin specification, 2.54mm pitch, including SPI, I2C, TIMER, GPIO and other expansion signals

1x IDC3 simple horn holder, 2x 25pin specification, 2.54mm pitch, with TSIP expansion signal

UART

1x Debug UART, Micro USB interface, provide 4-pin TTL level test port

Ethernet

2x SGMII, RJ45 interface, 10/100/1000M adaptive

FAN

1x FAN, 3pin header terminal, 12V power supply, 2.54mm pitch

JTAG

1x 14pin TI Rev B JTAG interface, pitch 2.54mm

1x 60pin TI MIPI high-speed JTAG interface, pitch 0.5mm

BOOT SET

1x 5bit start mode selection dial switch

SWITCH

1x power toggle switch

POWER

1x 12V3A DC input DC417 power interface, outer diameter 4.4mm, inner diameter 1.65mm

 

Software parameters

 

Table 2

DSP end software support

SYS/BIOS operating system

CCS version number

CCS5.5

Software development kit provided

MCSDK

 

Development Information

  1. Provide core board pin definition, editable bottom board schematic diagram, editable bottom board PCB, chip datasheet, shorten the hardware design cycle;
  2. Provide a complete platform development kit, introductory tutorial, save time for software organization, easy to get started;
  3. Provide a wealth of Demo programs, including multi-core DSP architecture communication tutorials, which perfectly solve the bottleneck of multi-core development.

Development routines mainly include:

  • Development routines based on SYS/BIOS
  • Multi-core development routines based on IPC and OpenMP
  • SRIO, PCIe, EMIF16 development routines
  • DSP algorithm development routine

Electrical characteristics

working environment

 

table 3

Environmental parameters

Minimum

Typical value

Max

Core board working temperature

-40°C

/

85°C

核心板工作电压

/

9V

/

评估板工作电压

/

12V

/

功耗测试

 

表 4

类别

电压典型值

电流典型值

功耗典型值

核心板

9.17V

961.6mA

8.82W

评估板

11.97V

1092mA

13.07W

备注:功耗测试数据与具体应用场景有关,测试数据仅供参考。

 

机械尺寸图

 

表 5

 

核心板

评估底板

PCB尺寸

80mm*58mm

200mm*106.6mm

PCB层数

12层

4层

板厚

1.6mm

1.6mm

安装孔数量

6个

8个

 

图 6 核心板机械尺寸图(顶层透视图)

 

 

图 7 评估底板机械尺寸图

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Origin blog.csdn.net/Tronlong/article/details/108621361