Introduction to Evaluation Board
Chuanglong TL6678-EasyEVM is a high-end multi-core DSP evaluation board based on TI's KeyStone architecture C6000 series TMS320C6678 octa-core C66x fixed-point/floating-point high-performance processor. It consists of a core board and a backplane. The core board has been verified by professional PCB Layout and high and low temperature testing, which is stable and reliable and can meet various industrial application environments .
The evaluation board has rich interface resources , leading to high-speed communication interfaces such as dual Gigabit Ethernet ports, SRIO, PCIe, etc., which is convenient for users to quickly evaluate product solutions and technical pre-research.
Figure 1 Front view of the evaluation board
Figure 2 Oblique view of evaluation board
Typical application areas
- Software radio
- Radar detection
- Photodetection
- Video tracking
- Image Processing
- Underwater detection
- Positioning navigation
Software and hardware parameters
Hardware block diagram
Figure 3 The hardware block diagram of the evaluation board
Figure 4 Evaluation board hardware resource diagram 1
Figure 5 Evaluation board hardware resource diagram 2
Hardware parameters
Table 1
CPU |
CPU : TI C6000 TMS320C6678 |
8x TMS320C66x fixed-point/floating-point DSP core, clocked at 1/1.25GHz |
|
1x Network Coprocessor |
|
ROM |
128MByte NAND FLASH |
128Mbit SPI NOR FLASH |
|
1Mbit EEPROM |
|
RAM |
1/2GByte DDR3 |
ETC |
256/512MByte DDR3 |
SENSOR |
1x TMP102AIDRLT temperature sensor |
B2B Connector |
2x 50pin male B2B connector, 2x 50pin female B2B connector, pitch 0.8mm, height 5.0mm; 1x 80pin high-speed B2B connector, pitch 0.5mm, height 5.0mm; Total 280pin |
LED |
2x power indicator (1 core board, 1 backplane) |
4x user programmable indicator lights (2 core boards, 2 backplanes) |
|
KEY |
1x power reset button |
1x system reset button |
|
1x non-maskable interrupt button |
|
1x user input button |
|
S RIO |
1x SRIO, four ports, a total of four channels, each channel has a maximum communication rate of 5Gbaud, led out through the HDMI interface |
PCIe |
1x PCIe Gen2, a dual-channel port, the highest communication rate per channel 5GBaud, x4 gold finger connection |
I |
1x IDC3 simple horn holder, 2x 25pin specification, 2.54mm pitch, including EMIF16 expansion signal |
1x IDC3 simple horn socket, 2x 25pin specification, 2.54mm pitch, including SPI, I2C, TIMER, GPIO and other expansion signals |
|
1x IDC3 simple horn holder, 2x 25pin specification, 2.54mm pitch, with TSIP expansion signal |
|
UART |
1x Debug UART, Micro USB interface, provide 4-pin TTL level test port |
Ethernet |
2x SGMII, RJ45 interface, 10/100/1000M adaptive |
FAN |
1x FAN, 3pin header terminal, 12V power supply, 2.54mm pitch |
JTAG |
1x 14pin TI Rev B JTAG interface, pitch 2.54mm |
1x 60pin TI MIPI high-speed JTAG interface, pitch 0.5mm |
|
BOOT SET |
1x 5bit start mode selection dial switch |
SWITCH |
1x power toggle switch |
POWER |
1x 12V3A DC input DC417 power interface, outer diameter 4.4mm, inner diameter 1.65mm |
Software parameters
Table 2
DSP end software support |
SYS/BIOS operating system |
CCS version number |
CCS5.5 |
Software development kit provided |
MCSDK |
- Provide core board pin definition, editable bottom board schematic diagram, editable bottom board PCB, chip datasheet, shorten the hardware design cycle;
- Provide a complete platform development kit, introductory tutorial, save time for software organization, easy to get started;
- Provide a wealth of Demo programs, including multi-core DSP architecture communication tutorials, which perfectly solve the bottleneck of multi-core development.
Development routines mainly include:
- Development routines based on SYS/BIOS
- Multi-core development routines based on IPC and OpenMP
- SRIO, PCIe, EMIF16 development routines
- DSP algorithm development routine
working environment
table 3
Environmental parameters |
Minimum |
Typical value |
Max |
Core board working temperature |
-40°C |
/ |
85°C |
核心板工作电压 |
/ |
9V |
/ |
评估板工作电压 |
/ |
12V |
/ |
功耗测试
表 4
类别 |
电压典型值 |
电流典型值 |
功耗典型值 |
核心板 |
9.17V |
961.6mA |
8.82W |
评估板 |
11.97V |
1092mA |
13.07W |
备注:功耗测试数据与具体应用场景有关,测试数据仅供参考。
表 5
|
核心板 |
评估底板 |
PCB尺寸 |
80mm*58mm |
200mm*106.6mm |
PCB层数 |
12层 |
4层 |
板厚 |
1.6mm |
1.6mm |
安装孔数量 |
6个 |
8个 |
图 6 核心板机械尺寸图(顶层透视图)
图 7 评估底板机械尺寸图