Use the board: Z-turn Board
Chip: Xilinx Zynq-7010/7020 processor
Engineers have made at the time the trial zynq Series Z-turn Board: VREFP_0 grounded following questions on the schematic page P3 Bank0
And 7 series FPGA Xilinx devices Zynq creatively sensor on-chip (internal temperature sensor and the power consumption of the sensor) the analog to digital converter and the associated sheet, which is compared to the previous generation to Xilinx newly added features, the system can be design eliminates external ADC device, effectively improve the integration of the system.
tica, sans-serIF "> Zynq XADC device module includes two 12-bit analog-digital converter 1 MIPS and associated sensor chip analog to digital converter can provide a general purpose system applied to high-precision analog interface, all XADC bank0 dedicated pin modules are located next figure shows the basic input output requirements XADC:
Recommended There are two configurations: one on the left by the XADC Vccaux (1.8V) supply, and with an external reference source 1.25V. External reference source can achieve better performance in terms of accuracy and thermal drift, a bead with analog and digital ground isolation, it avoids the more common analog and digital circuits and the common ground noise into the analog circuit disadvantage; FIG XADC is right in reference sources within the chip, then the pin must be connected to VREFP press shown in FIG.
Recommendations of the manual is 1.25V reference iput.
Will zynq on the z-turn board board VREFP_0 the connection is part of what? Which is the right side? If yes, why not switch to an external reference source, so is not it better point? I also noticed that you use the TLV62130 can produce such high precision voltage converter chip on the board, why not just let it generate a stable reference voltage of 1.25V it?
The reason for this is because the design with internal reference voltage one is easy, the second is sufficient for most needs.