MYD-JX8MX development board is based on Mill electronic NXP i.MX 8M series of application processors designed for high-performance development board, electrical parameters and mechanical dimensions paragraph of this article analyzes the development board. 
4. Electrical Parameters
| project | parameter |
|---|---|
| Operating temperature | Commercial Grade: 0 ~ + 70 ℃ commercial; extended temperature: -30 ~ + 80 ℃ wide temperature level; |
| environment humidity | 20% to 90%, non-condensing |
| Mechanical Dimensions | The core plate: 50mm 82mm bottom: 180 [mm 110 mm |
| PCB specifications | Core board: 10 layers, immersion gold process for producing, a separate ground signal layer, unleaded bottom: layer 6, immersion gold process for producing, a separate ground signal layer, Lead |
| Power supply | Core board: 5V development board: 12V |
Table 4-1 MYD-JX8MX electromechanical parameters
5. FIG mechanical dimensions
5.1 Mechanical Core board size 
5.2 backplane mechanical dimensions