On May 11, at the 2023 "Qualcomm & MeiG Smart Internet of Things Technology Open Day" Shenzhen station event, Jin Haibin, deputy general manager of MeiG Smart, shared the 5G+AIoT technology empowerment under the title "Digital Intelligence Leads Converged Innovation" value outlook.
▲Jin Haibin, deputy general manager of MeiG Smart
▌Computing Power: "Oil" in the Digital Economy Era
This year, the wave of generative AI set off by ChatGPT has swept across all walks of life, and the application of multi-modal large models in digital scenarios has become an established trend. Jin Haibin pointed out that under the wave of development of AI technology innovation and digital intelligent reconstruction of thousands of industries, the deep integration of AIGC and IoT provides a new idea for the digital transformation of the industry. Smart devices with edge computing power, such as AR/VR/XR, edge computing, mobile smart terminals, live broadcast equipment, smart retail terminals, smart cars, smart gateways, and industrial vision collectors, are in increasing demand.
Behind AI artificial intelligence is the organic integration of core elements such as computing power, data, and algorithms. When Moore's Law is going to fail, the computing power required by the AI model is predicted to double every 100 days, which means that the computing power required by AI will exceed 1 million times in five years. In the future, the computing power will play a digital role The role of "oil" in the era.
▌Smart module: the carrier of the combination of AI and Internet of Things
Jin Haibin pointed out that AI computing usually requires a CPU or ARM core to perform scheduling processing, and then a large number of parallel computing is completed by GPU, FPGA or ASIC. Compared with general-purpose computing chips, the advantages of heterogeneous computing chips integrating general-purpose computing units and high-performance special-purpose computing units are more prominent.
With the arrival of a brand-new era of intelligence, intelligent modules integrating connection, computing, perception, and expression are at the center of the stage. Jin Haibin mentioned that the smart modules of MeiG Smart's iconic products are all developed based on SoC chips, which naturally have the characteristics of SoC heterogeneous computing. And from the earliest CPU+GPU, it has gradually developed into a strong combination of CPU+GPU+DSP+NPU, which can undertake fragmented intelligent scenarios and meet the differentiated needs of different industries.
▌Meg Smart: Helping Computing Power Pratt & Whitney
As the first enterprise in the industry to propose the concept of intelligent modules, MeiG Intelligent continues to pay attention to the profound changes brought about by the development of artificial intelligence technology to the module industry, and provides cost-effective AI computing power modules and mature intelligent system solutions for industry customers , to make the computing power more HP.
MeiG Intelligent AI computing power intelligent module matrix, the corresponding computing power of the product covers 0.2Tops~48Tops. The newly released high-computing AI intelligent module SNM970 is equipped with Qualcomm QCS8550 processor, integrates 8-core Qualcomm Kryo CPU, supports Wi-Fi 7 and Bluetooth 5.3, and creates a more stable and enjoyable network experience. The integrated Qualcomm Hexagon™ processor, a Qualcomm neural network processing unit, provides groundbreaking AI performance for the entire system. With the support of up to 48Tops AI computing power, it can perform high-speed, high-quality calculation and processing of massive data, providing industry applications and Scenes create more room for imagination.
The AI computing power box created by MeiG Intelligent for the field of edge computing has up to 15Tops AI computing power, supports one-stop edge device management, supports Wi-Fi 6E, and has rich expansion interfaces, which is convenient for rapid deployment in various scenarios. Adopting an integrated heat dissipation design, the performance will not be compromised under long-term continuous operation. It is suitable for new retail, logistics and warehousing, machine vision, industrial AR and other fields.
In the field of smart cockpit, MeiG Intelligent has launched a series of smart modules and M2M modules, and has accumulated core technologies such as customized smart cockpit solutions, smart central control, vehicle DVR, T-BoX, and OBD. The first 5G smart module SRM900 series is developed based on the Qualcomm SM6350 platform. It has developed a 5G solution for smart cockpits with one core and multiple screens, and has outstanding performance in the field of smart cockpits.
The 5G high-computing power AI smart module SRM930, which was launched later, has further improved the CPU computing power, AI computing power and multimedia fields, realizing "one core with multiple screens", multi-screen linkage, and multi-screen touch, supporting high-resolution display and 3D rendering. It can be connected to multiple camera signals to realize applications such as fast display of reversing images and 360 surround view stitching. The newly released high-computing AI intelligent module SNM960 this year can provide more advanced and comprehensive technical services for the intelligentization of the automobile industry. SNM960 series is developed based on Qualcomm SM8475 processor, integrated 8-core Kryo 780 CPU and Qualcomm Adreno VPU 665, built-in Adreno GPU730, AI computing power exceeds 27Tops, can be equipped with high AI computing power algorithm, more cost-effective.
In the future, with the gradual expansion and improvement of the product matrix of high-computing AI smart modules, MeiG Smart will continue to bring more innovative, efficient and practical solutions to the industry, and lead the high-quality AIoT industry with digital and intelligent innovation capabilities. develop.