From March 14th to 16th, the 2023 Embedded World in Nuremberg, Germany was successfully held at the Nuremberg International Expo Center. The conference showcases the development trend of the embedded system industry to professional audiences around the world, appreciates the changes and progress that cutting-edge technologies have brought to industries in all fields, and brings a technological feast to application fields such as automobiles, communications, security, smart cities, and industrial Internet of Things.
Nuremberg Embedded Systems Exhibition is currently the largest embedded exhibition in the world. As a barometer of the economic development of the embedded industry and the development trend of the EU industry, the exhibition comprehensively displays the entire embedded industry: hardware, tools, application software and services. Display topics; covering many fields such as Industry 4.0, automation, motion control, human-machine interface, Internet of Things, cloud computing, medical electronics, smart home, motor control, smart metering, industrial communication, etc., for semiconductors, embedded boards, industrial computers It provides a platform for the display and exchange of the world's most cutting-edge technologies and trends in the fields of intelligent systems in various industries and Internet of Things solutions.
As one of the important layouts for enterprise development, MeiG Smart accelerates the pace of expanding overseas markets, bringing a variety of 5G/4G, C-V2X car-grade, Android smart, AI computing power, LTE-A, Cat.1/4/ 6/9/12, NB-IoT, GNSS and other wireless communication modules and industry solutions were unveiled at the exhibition, and a number of new products and Internet of Things industry solutions were released at the same time.
In terms of car-grade modules , MeiG released a new generation of 5G car-grade C-V2X MA925 series modules at the exhibition. This series of modules is based on the design, development and production of the second-generation Snapdragon® automotive 5G modem and RF platform recently launched by Qualcomm Technologies, supports the 3GPP Release 16 standard, integrates multi-core CPU processors, and has a maximum computing power of 22K DMIPS; at the same time Major adjustments and optimizations have been made to the software architecture, and the Hypervisor mechanism has been introduced to greatly improve the security, ease of use and maintainability of the product.
MA925系列模组支持5G NR独立组网（SA）和非独立组网（NSA）模式，向下兼容4G/3G/2G网络，最多支持4.4Gbps的下行速率；支持选配C-V2X功能，使用全球统一的ITS 5.9GHz频段部署V2X应用，可采用PC5 Mode 4模式直连通信。
预留SDIO接口用于外挂802.11p单元（DSRC），集成一个22K DMIPS算力的CPU处理器；内置ECDSA硬件引擎，实现高达6000次/秒的C-V2X验签性能；灵活的GNSS定位服务，支持L1+L5 / L1+L2（选配）双频GNSS、惯性导航（DR）、GNSS数据后处理引擎（PPE）和数据校正服务等多种技术。
在5G R17模组方面，美格智能正式发布了新一代5G R17通信模组SRM817系列和SRM817WE系列，分别基于高通技术公司最新推出的全球首个5G Advanced-ready调制解调器及射频系统——骁龙®X72和X75 5G调制解调器及射频系统开发，支持3GPP Release 17标准及特性，拥有更快的网络速率、更强的处理性能和更丰富的外设接口。
SRM817系列和SRM817WE系列模组皆采用LGA封装，支持5G独立组网（SA）和非独立组网（NSA）两种组网方式，同时向下兼容4G/3G网络；采用四核A55处理器，主频最高可达2.2GHz，拥有更强悍的处理能力；均支持OpenWRT和RDK-B操作系统。
同时支持Open CPU；丰富的外设接口，包括3组高速PCIe接口、2组USXGMII接口、1组USB 3.1、2组USIM、PCM、UART等，支持最新一代Wi-Fi 7解决方案以及10Gb的以太网能力；SRM817系列产品为Sub-6GHz模组，Sub-6GHz可支持最大200MHz带宽；SRM817WE系列产品可支持毫米波，Sub-6GHz可支持最大300MHz带宽。
5G+AIoT关键性能技术，正在为万物互联的数智世界奠定坚实的通信基础。展会现场，美格智能通过展示智能模组+物联网定制化解决方案，生动展现了5G、AIoT等创新能力如何打破“物理世界”与“数字世界”的壁垒，赋能智能座舱、新零售、智能机器人、AR/VR终端、XR元宇宙、工业互联网、边缘计算等领域。
美格智能作为业内首家推出5G智能模组的企业，目前已经实现“低、中、高”三档5G智能模组与高算力AI模组全覆盖。5G智能模组将5G高速率传输与高算力相结合，通过特别的器件选型和标准化可插拔式模块化设计，提升了诸如元宇宙、机器视觉、智能座舱等智能化产业的快速迭代能力。
同时，在智能模组和算力模组产品中集成了先进的AI处理器芯片，历经多代产品的演进，对应AI算力覆盖从0.2Tops到近30Tops范围，为各类智能化场景提供AI算力支撑。
新一轮科技革命和产业变革加速演进，新技术、新业态、新模式层出不穷，更大范围、更宽领域、更高能级的摩尔定律正在显现。面向万物智联的未来世界，美格智能将以强大的软硬件一体研发能力和多层级研发体系的规模优势为后盾，以不断创新的智能模组产品及行业解决方案，推动物联网相关产业的技术升级，让5G+AIoT释放出强大的动能，催生无限可能。