Definition of SMT journey and development trend : Surface Mount Technology (SMT) refers to a technology for mounting and soldering surface mount devices on the surface of printed circuit boards. This technology makes electronic products more light, thin, short and small. , Multi-function, high reliability, low cost and other advantages.
After years of development, SMT technology has been quite mature and has been widely used in electronic manufacturing industries such as computers, communications, consumer electronics, industrial automation and so on. In the supply chain of the electronics manufacturing industry, manufacturing has become a more important link, and the processing costs in the manufacturing process do not include the costs of PCB board production and component purchase.
Status:
first stage (1960-1975): miniaturization, hybrid integrated circuits (calculators, quartz watches)
second stage (1976-1980): reducing size and enhancing circuit functions (cameras, video recorders, digital cameras
) (1980-1995): Reduce costs, vigorously develop production equipment, and improve product cost performance (Ultra-large scale integrated circuits).
Current stage (1995-present): Micro-assembly, high-density assembly, three-dimensional assembly technology status: According to foreign data reports, enter 20 Since the 1990s, electronic products using through-hole assembly technology are declining at a rate of 11% per year, while electronic products using SMT are increasing at a rate of 8%.
New technology revolutions and cost pressures have spawned an automated, intelligent, and flexible manufacturing, assembly, logistics, assembly, packaging, and test integration system MES. High performance, ease of use, flexibility and environmental protection are the inevitable trends of SMT equipment development:
1. High precision and flexibility: intensified industry competition, shortened time to market of new products, more stringent requirements on environmental protection; compliance with lower cost and more The trend towards miniaturization places higher demands on electronic manufacturing equipment. Electronic equipment is developing in the direction of high precision, high speed, ease of use, more environmental protection and more flexibility. The placement head function head realizes any automatic switching; the placement head realizes dispensing, printing, and detection feedback. The stability of placement accuracy will be higher, and the compatibility of parts and substrate windows with greater flexibility will be stronger.
2. High speed and miniaturization: bringing high efficiency, low power, less space and low cost. The demand for high-speed multi-functional placement machines with high efficiency and multi-functional placement is gradually increasing, and the production mode of multi-track and multi-table placement production rate can reach about 100,000CPH.
3. The trend of integration of semiconductor packaging and SMT: The volume of electronic products is becoming smaller and smaller, the functions are becoming more diversified, and the components are becoming more and more precise. Semiconductor manufacturers have begun to apply high-speed surface mount technology, and the surface mount production line also integrates some applications of semiconductors, and the boundaries of traditional technology areas are increasingly blurred.
