I see my friends here might be how to update the technical content of circuit doubt, is actually very simple, this series is to share the most advanced technology and applications in the field of domestic oil well logging, in fact, there are many deficiencies, Xiao Bian also check They may say, promptly corrected the wrong content.
Special high temperature in the fifth chapter introduced inside MCM technology, HQA series quartz servo accelerometer flexible circuit technology is MCM thick film circuit, at a higher temperature environment, far exceeding the stability and reliability of the conventional technology circuitry instruments product. In the field of oil well logging, so manufacturers are not particularly large, mainly influenced by economic size enterprises, expensive equipment investment.
Thick film hybrid integrated circuits are produced by screen printing and sintering a thick film technology on the same substrate in a passive network, and assembling the semiconductor device chip or monolithic integrated circuits or discrete micro elements thereon, and then packaging them plus hybrid integrated circuits, thick film hybrid integrated circuits is a micro-electronic functional components.
Thick-film hybrid integrated circuit six advantages
High Temperature: selecting ceramic substrate board, good heat dissipation, the application temperature of up to -55 ℃ ~ 250 ℃;
Small size: internal modules bare chip mounting, the packing density of up to 10 to 100 / cm², the product volume is reduced 30% to 70% over conventional PCB circuit;
Reliability: internal hermetic packaging using high purity nitrogen, the use of solder die bonding process, difficult to produce Weld, sealing off, reduced by 70% to 90% over the PCB circuit pads;
Good electrical properties: the internal components using gold wires, traces short, small parasitic effects, low noise, low power consumption, small temperature drift;
Corrosion: gold or ceramic seal housing, modular package design, assembly, corrosion-resistant, and easy maintenance and troubleshooting instrumentation circuitry;
Security and good: die multi-chip package, the formation of a full-featured application SOC module, imitation big difficulty, confidentiality, and effectively protect the user's intellectual property rights.