Oil well logging thick film circuit technology to work with
thick-film hybrid integrated circuit --HIC
with the development of thick-film hybrid integrated circuit technology on its wide range of component parameters, precision and high stability, circuit design flexibility, development and production period is short, suitable for a variety of small batch production, etc., complement each other and the semiconductor integrated circuit, each permeability, has become an important part of an integrated circuit, widely used in electronic control devices in the system.
Holding the position and characteristics of the semiconductor integrated circuit than:
a low-noise
circuit of high stability
passive network High frequency linear circuit
precision-linear circuit microwave circuit
power circuit-module circuit during the mixing process in a thickness of thick film hybrid IC film hybrid integrated circuits typically use pattern and printed on a ceramic substrate and sintered at high temperature is formed passive network.
Thick-film hybrid integrated circuit --HIC (Process)
a planar circuit design: logic design, circuit switching, circuit division, layout designs, planar element design, selection of discrete components
making stencil printing 2: the design of the plane pattern fabricated of stainless steel wire mesh or nylon developing method.
3, the choice of substrate and slurry: preparing circuit usually selected 96% alumina ceramic substrate, slurry is usually selected DuPont, USA Electronic Laboratory, Japan Tanaka's conduction band, medium, and so the resistance paste .
4, high temperature sintering: The printed substrate is fired at a high temperature sintering furnace, so that between the paste and the substrate to form a good fusion and network interconnection, and the resistance of the thick film resistor is stabilized.
5, laser trimming: thick film laser trimmers on a good sintered thick film printed circuit substrate transferred resistor repair requirements.
6, mounting: automatic placers outer connector attached to various components and assembled on the circuit substrate, and after completion of reflow soldering furnace, comprising a lead welding and the like.
7, circuit package: the testing of circuit as required for proper packaging.
