新浪科技讯，北京时间 4 月 9 日早间消息，据美国科技博客 9to5mac 报道，台积电有望为苹果公司的 2020 年款 iPhone 生产 5 纳米A系列芯片。
9to5mac 早在去年初就曾报道称，台积电正在为此目标做准备。而据中国台湾地区媒体 Digitimes 周一报道，该公司在这条道路上已经达成了一个重大的里程碑。
Digitimes 报道称，台积电现已完成设计基础设施，能令苹果公司等客户开始使用 5 纳米工艺进行芯片设计。台积电此前已经宣布在开放式创新平台（Open Innovation Platform，OIP）内部交付其 5 纳米设计基础设施的完整版本，而此次全面发布则意味着 5 纳米片上系统（SoC）设计可被用于下一代先进移动和高性能计算（HPC）应用，这种设计以高增长的 5G 和人工智能（AI）市场为目标。
台积电称，领先的 EDA（电子设计自动化）和 IP 供应商与该公司进行了合作，通过多种硅测试工具开发并验证了完整的设计基础设施，其中包括技术文件、工艺设计套件（PDK）、工具、流程和 IP 等。采用 5 纳米工艺的芯片不仅将可拥有较当前一代芯片高出 1.8 倍的逻辑密度，而且有望在速度和功率效率上大幅提升。
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