CyberC 2019 征稿
第11届网络分布式计算与知识发现国际会议
The 11th Int. Conference on Cyber-Enabled
Distributed Computing and Knowledge Discovery
Guilin, China, October 17 - 19, 2019
Web: www.Cyberc.org
Publication: IEEE (EI & Explore),
Journal of Sensors (Selected
Papers)
2019 Theme: Intelligent Cyberspace via the Convergence of AI, Big Data, 5G and
Beyond
Technical
Co-sponsors:
IEEE, IEEE Computer Society, IEEE TCSIM (Technical Committee on Simulation),
IEEE Communications Society (ComSoc) Technical Committee on Big Data (TCBD)
Organizer: Guilin University of
Electronic Technology
Co-hosted by: Nanjing University of Posts & Telecommunications, Zhengzhou
University, Peng Cheng laboratory
Sponsored by: Huawei, AT&T, InfoBeyond, Tech Mahindra
Scopes: CyberC promotes in-depth exploration of the most recent research and
developments in the fields of AI, big data, distributed computing, clouds,
cyber security, pervasive computing, mobile computing, Internet of Things, and
other cyber-based technologies. Professors, scientists, engineers, and students
in these areas are encouraged to participate. CyberC also welcomes industrial
participations.
Summits: CyberC 2019 co-hosts Emerging Technology Summit (AI, Big Data, 5G) forum
that emphasizes innovative and state-of-art R&D, industry products, specifications,
showcases, tutorial, technical transitions, and markets.
Cyber network and cybersecurity
•
Cyber network, configuration, cloud, IoT, and wireless communications
•
DDoS, Ransomware, and cybersecurity attacks and detection
•
Multistage attacks, data security, AI and intrusion detection
•
Risk assessment, management, and network monitoring
•
Authentication and access Control
•
Learning model for attack behavior, prediction, and game theory
•
IoT and security
•
Deploying machine learning and AI to enhance security and privacy
•
Cybersafety and privacy
•
Blockchain theory and its applications (smart grid, healthcare, ICS, etc.)
•
Deploying machine learning and AI to enhance security and privacy
•
Cybersafety and privacy, standardization, compliance and forensics
•
Moving target defensing, image and target detection
Cyber Data and Analytics
• Big data algorithms, models,
and systems for big data
• AI, Neural Network, Deep
Learning
• Machine learning, and big data
architecture and analytics
• Big data software design, middleware and analytics
• High performance computing, and
intensive data networks
• Massive data streaming,
scalable computing, big data task deployments
• Cloud and high performance computing for big data
• Data retrieval, storage, query, communications, and
database
• Data preservation, filter, provenance, and assurance
• Data security, protection, integrity and privacy
standards and policies
• Graph mining and opinion mining, and distributed data
mining
• Data streaming, multimedia, stream, or web mining
• Image/multimedia data management
• Social media and social network analytics
• Security and information assurance for Big Data
Cyber and Distributed Computing
• Authentication, trust, privacy
and other Cyber security issues
• Parallel and distributed algorithms, resource allocation,
and load-balance
• Cloud computing, mobile cloud, mobility-aware cloud
data/streams
• SOA, web services, and mobile services (software,
infrastructure)
• Web services and internet computing
• Web-caching, content delivery systems and data
distribution systems
• Distributed applications, modeling language, and software
engineering
• Pervasive/ubiquitous computing and intelligence
5G and Mobile Computing
• Wireless networks, mesh networks,
MIMO and 5G
• Industry control network,
networking theory and algorithms
• Wireless embedded sensor systems, body sensor, smart
cities & security
• Cognitive radio and SDR
• Future generation communications and pervasive computing
• Peer-to-peer network computing and overlaying networks
• Directional antenna and networking
• FDMA/OFDMA modulations, synchronization, and power
optimization
• Mobile IP and Internet technology
• Key, attacking models, privacy, confidentiality &
security in mobile networks
• Communication, services, middleware, and multimedia on
wireless networks
• QoS, reliability, performance, and communication theory
• Wireless network simulations, implementation, and applications
Cyber Computing and Clouds
• Autonomic, real-time and
self-organizing clouds
• Architectural models for public and private cloud
computing
• Cloud resource management and allocation
• Utility models and service pricing
• New parallel / concurrent programming models for cloud
computing
• Scientific computation and other applications in the
cloud
• Mobility modeling, management and measurement for mobile
clouds
• Mobile multimedia content delivery, transferring, and
migration
• Content delivery networks using storage clouds
• User Experience and Cyber Security
• Performance evaluation, measurement and optimization
• Communications and network security
• Information security, software security, system security,
or cryptography
• Tools, test-bed, simulations, and experimental
environments
• Collaborative and cooperative environments
• QoS, Autonomic, reliability, and fault-tolerance
Workshops:
·
Big Data & AI 2019: The 6th International Workshop on Big Data and Artificial Intelligence,
Chaired by Xiaolan Xie - Guilin University of Electronic Technology
·
Security 2019: The 7th workshop on Cyber Security and Privacy, Chaired by Yujue Wang
- Guilin University of Electronic Technology, and Hongwei Li - University of
Electronic Science and Technology of China
·
Blockchain 2019: The first workshop on Blockchain, Chaired by Bin Cao - Chongqing
University of Posts and Telecommunications, and Lei Zhang - University of
Glasgow
·
IOT 2019: The 3rd
International Workshop on Internet of Things and Future Communication
Technologies, Chaired Ning Cao - Sanming University
INFORMATION
FOR AUTHORS
The CyberC 2019 Proceedings will be published
by IEEE CPS. Full papers for CyberC 2019 must not exceed 10 pages of IEEE 2-column format, while short papers must not exceed 4
pages. Please visit the
conference web site at http://www.cyberc.org for precise formatting and
submission instructions.
IMPORTANT DATES
Submission deadline for full (10-page) and/or short (4-page) papers: May 10, 2019
Notification of acceptance: July 20, 2019
Camera-ready deadline: August 20, 2019
SPECIAL ISSUE
CyberC 2019 provides a special channel for
you to submit your extended version to Journal of Sensors by MDPI. After
submission of a CyberC version, you can submit an extended version to Journal all the time before December 30 2019:
First submitted, first reviewed. Other journal information can be found at http://cyberc.org/Callforpapers/SpecialIssue
HONORABLE CO-CHAIRS
David Lu - AT&T Labs, USA
Ya Zhou - Guilin University of Electronic
Technology, China
GENERAL CO-CHAIRS
Bin Xie - InfoBeyond Technology LLC, USA
Liang Chang - Guilin University of Electronic
Technology, China
SUMMIT/KEYNOTE CO-CHAIRS
Chi-Ming Chen - AT&T Labs, USA
Chonggang Wang - InterDigital, USA
TPC CO-CHAIRS
Yong Ding - Guilin University of Electronic
Technology, China
Guangxia Xu - Chongqing University of Posts
and Telecommunications, China
Ning Wang - Zhengzhou University, China
WORKSHOP CO-CHAIRS
Bin Cao - Chongqing University of Posts and
Telecommunications, China
Lei Zhang - University of Glasgow, United
Kingdom
Xiaolan Xie - Guilin University of Electronic
Technology, China
Hongwei Li - University of Electronic Science
and Technology of China
Yujue Wang - Guilin University of Electronic
Technology, China
Ning Cao - Sanming University, China
PUBLICITY CO-CHAIRS
Xiaolong Xu - Nanjing University of Posts and
Telecommunications, China
PUBLICATION CHAIR
Bin Xie - InfoBeyond Technology LLC, USA
LOCAL CO-CHAIRS
Jingwei Zhang - Guilin University of
Electronic Technology, China
Zhenbing Liu - Guilin University of
Electronic Technology, China
FINANCIAL CO-CHAIRS
Sanjuli Agrawal - Indiana University
Southeast, USA
Yingbing Yu - Austin Peay State University,
USA
STUDENT VOLUNTEERS
Bingyao Wang - Guilin University of
Electronic Technology, China
Chengkai Kong - Nanjing University of Posts
and Telecommunications, China
Chi Zhang - Zhengzhou University, China
Dandan Mao - Zhengzhou University, China
Linfeng Li - Chongqing University of Posts
and Telecommunications, China
Lingfeng Shen - Zhengzhou University, China
Shuai Jiang - Nanjing University of Posts and
Telecommunications, China
Wenyao Liu - Guilin University of Electronic
Technology, China
Xufeng Liu - Zhengzhou University, China
Ye Zhang - Chongqing University of Posts and
Telecommunications, China
Ze Li - Zhengzhou University, China
Zhengdong Li - Beijing University of Posts
and Telecommunications, China
STEERING COMMITTEE
Anup Kumar (Chair) - University of
Louisville, USA
Suryadip Chakraborty - Johnson C. Smith
University, USA
Chi-Ming Chen - AT&T Labs, USA
Chih-Lin I - China Mobile, China
Yang Yang - ShanghaiTech University, China
Jiangzhou Wang - University of Kent, UK
Tzyh-Jong (TJ) Wang - AT&T Labs, USA
TECHNICAL PROGRAM COMMITTEE
Ahmed H. Desoky - University of Louisville,
USA
Ahmed Badi - Florida Atlantic University, USA
Alexandre Kandalintsev - University of
Trento, Italy
AtillaElci - Aksaray University, Turkey
Atta urRehman Khan - University of Malaya,
Malaysia
Antonio Abramo - University of Udine, Italy
Benoit Hudzia - SAP Research, UK
Bo Jiang - Intel, USA
Chen Qian - University of Kentucky, USA
Chukwuemeka David Emele - University of
Aberdeen, UK
Dejing Dou - University of Oregon, USA
Ding-Yaeh Hung - WuFeng University, Taiwan
Donglin Wang - New York Institute of
Technology, USA
Dorsaf Azzabi - Canadian University of Dubai,
UAE
Haifeng Zheng - Fuzhou University, China
Hsung-Pin Chang - National Chung Hsing
University, Taiwan
Hufeng Zhou - Brigham and Women’s Hospital
and Harvard Medical School, USA
Hui Lu - Beihang University, P.R. China
Huijuan Wu - University of Electronic Science
and Technology of China, China
Cheng Chang - National DongHwa University,
Taiwan
Jie Li - University of Tsukuba, Japan
Jing He - Kennesaw State University, USA
Jorg Dummler - Chemnitz University of
Technology, Germany
Jun He - University of New Brunswick, Canada
Kai Bu - Zhejiang University, China
Lanxiang Chen - Fujian Normal University,
China
Lin Wang - Xiamen University, China
Manar Ibrahim FawziHosny - King Saud
University, Saudi Arabia
Man Ho Au - University of Wollongong,
Australia
Maurizio Dusi - NEC Laboratories Europe,
Germany
Min Wu - Oracle Corporation, USA
Mohammad Shoeb khan - University of
Louisville, USA
Mahmoud Daneshmand - Stevens Institute of
Technology, New Jersey, USA
Nicolas Sklavos - Technological Educational
Institute of Patras, Greece
Nuno Vasco Lopes - University of Minho,
Portugal
Omid Mahdi Ebadati E. - THamdard University,
India
Rajdeep Bhowmik - Cisco Systems Inc., USA
Ricardo Lopes Pereira - INESC-ID/Instituto
Superior Técnico, Portugal
Ricardo Rodriguez - Technological University
of Ciudad Juarez, Mexico
Shanmugasundaram Hariharan - TRP Engineering
College, India
Shui Yu - Deakin University, Australia
Song Cui - Stanford University, USA
Song Guo - The Hong Kong Polytechnic
University, Hong Kong
SubinShen - Nanjing University of Posts and
Telecommunications, China
Timothy W. Hnat - University of Memphis, USA
Vic Grout - Glyndwr University, UK
Wei-Da Hao - Texas A&M
University-Kingsville, USA
Weirong Jiang - Xilinx, USA
Wei Yang - Jiangxi Normal University, China
Xian-Hua Han - Ritsumeikan University, Japan
Xinyu Que - IBM, USA
Yaser Jararweh - Jordan University of Science
and Technology, Jordan
Zhan lin Ji - University of Limerick, Ireland
Zhefu Shi - Microsoft, USA
Zhengyu He - Google, USA
AUTHOR CONTACTS
Please contact [email protected] if you have any issues