承诺全力支持台湾发展5G,原本高达234亿元新台币的天价罚金降为27.3亿元新台币,高通不再继续缴纳剩余罚款......

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8月10日据路透社报道,中国台湾“公平贸易委员会”周五表示,芯片巨头高通将支付27.3亿元新台币(约合8900万美元),就监管机构提起的反垄断案达成和解。委员会表示,高通还同意与其他芯片和手机制造商就专利许可协议进行真诚的谈判。

依据和解内容,美商高通公司对国内手机制造商及晶片供应商作出行为承诺,并负有向公平会报告执行情形之义务;美商高通公司同意不争执已缴纳之新台币(下同) 27亿3千万元罚锾,并承诺在台湾进行为期5年之产业投资方案,说明如下:

一、 公平会表示,美商高通公司同意遵守并执行授权行动通讯标准必要专利(下称行动通讯SEP)予台湾手机制造商之行为承诺及若美商高通公司拟将行动通讯SEP授权予台湾晶片供应商时之其他行为承诺,已足以消解原处分对美商高通公司行动通讯SEP授权实务之反竞争疑虑:

1、 本于善意重新协商授权条款:

台湾手机授权制造商如认为其与美商高通公司之专利授权合约中有被迫同意且不合理之授权条款,美商高通公司承诺将本于善意重新协商,就重新协商条款之争议,台湾手机授权制造商与美商高通公司可另行协议采取其他如法院或仲裁之中立争端解决程序。

2、 协商期间不拒绝晶片供应:

在重新协商或争端解决程序期间,台湾手机授权制造商如继续履行其供应及授权合约义务,并本于善意进行重新协商,美商高通公司同意其不会终止或威胁终止供应行动数据机晶片予该制造商。

3、 行动通讯SEP授权之无歧视性待遇:

美商高通公司承诺就其行动通讯SEP授权方案,将对条件相当之台湾手机制造商与非台湾手机制造商给予无歧视之待遇。

4、 对台湾晶片供应商之待遇:

美商高通公司同意,经台湾晶片供应商要求,其将提供一合约。该合约约定,如美商高通公司未先就行动通讯SEP请求项向晶片供应商提出依公平、合理且无歧视(FRAND)之授权条款,美商高通公司不得本于任何行动通讯SEP请求项对该晶片供应商提起任何诉讼。

5、 不再签署独家交易之折让约定:

美商高通公司承诺,在其与晶片客户之晶片供应合约中,不再签署任何以客户同意独家采用美商高通公司行动数据机晶片为条件,而给予权利金折让之约定;及不再以该晶片客户之全部晶片采购有一定比率系向美商高通公司采购,作为契约之授权金折扣或权利金折让约定之条件。

6、 定期向公平会报告执行情形:

美商高通公司并承诺在5年期间内,每6个月就行为承诺之执行情形向公平会进行报告,如美商高通公司与台湾手机制造商或台湾晶片供应商完成增修或新订契约,亦将于签署该等契约后30日内向公平会进行报告。

公平会指出,原处分要求美商高通公司在处分后应本于善意及诚信对等原则与晶片竞争同业及手机制造商进行协商,并停止反竞争疑虑之行为,而美商高通公司在诉讼上和解所提出之行为承诺,公平会认为足以达到原处分维护自由公平竞争之规制目的。

二、 公平会表示,原处分所裁处之234亿元罚锾,美商高通公司同意不争执已分期缴纳共计27亿3千万元之罚锾,并承诺以5年期产业方案对台湾进行投资合作,该投资包含5G合作、新市场拓展、与新创公司及大学之合作,并设立台湾营运及制造工程中心。高通公司将与公平会及台湾经济部、科技部等相关单位紧密配合,以落实上述方案及投资。公平会认为该产业投资方案及其承诺之投入,将有助于提升台湾半导体、行动通讯及5G技术发展等方面之整体经济利益与公共利益。

因此,本案经综合审酌后,公平会于107年8月8日第1396次委员会议决议通过,并于107年8月9日在智财法院与美商高通公司达成公平会史上首次基于公共利益之诉讼上和解,原处分以和解内容代替之。公平会希望本案能有效地形塑行动通讯产业良好之竞争环境,并对台湾半导体、行动通讯及5G技术发展等各方面带来正面影响。

高通官方新闻:

Qualcomm Incorporated (NASDAQ: QCOM) today announced that it has reached a mutually agreed settlement with the Taiwan Fair Trade Commission (TFTC) resolving the TFTC’s investigation of Qualcomm and Qualcomm’s litigation challenging the TFTC’s decision alleging violations of Taiwan’s Fair Trade Act. As a result, the whole TFTC decision is replaced by the settlement terms and the decision shall be deemed revoked ab initio (from the beginning) and Qualcomm’s litigation filed in the Taiwan Intellectual Property Court is closed.

As part of the resolution, Qualcomm has agreed to certain process-related commitments confirming principles of mutual good-faith and fairness in the negotiation of agreements with handset licensees to Qualcomm’s cellular standard essential patents (SEPs). The resolution does not require component-level licensing or set specific financial terms; instead it is focused on commitments that ensure good-faith negotiations for the benefit of licensees and SEP owners. As part of the settlement, the parties agreed that the NTD 2.73 billion (approximately $93 million USD) Qualcomm paid towards the monetary fine through the end of July will be retained by the TFTC and no other amounts will be due.

In addition, Qualcomm will drive certain commercial initiatives in Taiwan over the next five years for the benefit of the mobile and semiconductor ecosystem, SMEs and consumers, including 5G collaborations, new market expansion, start-up and university collaborations and the development of a Taiwanese center for operations and manufacturing engineering. Qualcomm will work with the TFTC and sister agencies within the Taiwanese government to implement these initiatives and investments.

“We are pleased to have reached a mutually beneficial resolution with the TFTC that puts the litigation behind us,” said Alex Rogers, executive vice president and president, Qualcomm Technology Licensing. “This settlement directly addresses concerns raised by the TFTC, regardless of disputed positions, and builds on our foundation of collaborative, long-term business relationships in Taiwan. We are happy to reaffirm our commitment to licensing our valuable intellectual property under principles of fairness and good faith. With the uncertainty removed, we can now focus on expanding our relationships that support the Taiwanese wireless industry and rapid adoption of 5G technology.”

For more than two decades, Qualcomm has contributed extensively to the development of Taiwan’s mobile and semiconductor industries to achieve shared success in Taiwan and globally. Qualcomm’s significant R&D investments in fundamental mobile technologies and its broad-based licensing of those technologies to mobile phone suppliers have facilitated the explosive growth of the mobile communications industry in Taiwan and worldwide. This brings immense benefit to consumers and fosters healthy competition at all levels of the mobile ecosystem.

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转载自blog.csdn.net/weixin_42913285/article/details/81587097
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