After the early popular science articles, I believe we have to eMMC, UFS and LPDDR have a deep understanding. Today we talk about Hong Wang semiconductor and MCP and eMCP, a letter difference, what is the difference and the connection between them? What were applied in the field? With this question, with the view of this article.
MCP
MCP is a multichip package Multi Chip Package for short, is the placement of two or more memory chips or stacked horizontally to the same through a BGA package, MCP into one manner, than conventional mainstream TSOP package into individual two chips, save 70% of the space, it simplifies the structure of the PCB, but also simplifies system design, assembly and testing that yield is improved.
MCP composition generally in two ways: as a NOR Flash plus Mobile DRAM (SRAM or PSRAM), plus one for the DRAM or NAND Flash Mobile DRAM (SRAM or PSRAM) and NAND Flash storage due to the high density, low power consumption, small size the cost is low compared to NOR Flash, overall, MCP reduces the hardware cost, the price is even cheaper than separate chips, MCP ultimately depends on a multi-NAND Flash price changes, but in general can be at least 10% cheaper the above.
MCP technology in the development of key control and the actual thickness of the yield, the more MCP chip stack thickness also thicker, then the design process still have to be maintained at a certain thickness, maximum height defined in the original about 1.4 mm (currently popular for 1.0mm), there are certain technical limitations, moreover, in which a chip failure, the other chips not work.
MCP technology is usually the main SLC NAND with LPDDR2, Mobile DRAM is not more than 4Gb, mainly used in the early feature phones (Feature phone) or low-end smart phones, MCP appeared earlier, gradually appeared confined to the technology development, Samsung, SK Hynix, ICMAX such as turning R & D eMMC, eMCP and other technologies.
EMCP MCP compatible with the eMMC
EMCP smart phone memory eMMC standard binding MCP and packaging them, in contrast with the conventional MCP, EMCP NAND Flash because of built-in control wafer, the wafer can reduce the burden of the main operation, and greater capacity management flash memory. Outside the design point of view, whether eMCP or eMMC embedded memory design concept is to allow smartphone looks thinner, more complete leak tightness of the cabinet.
eMCP mainly in order to shorten time to market and low-end smart phone development, mobile phone manufacturers to facilitate the characteristic test, the Chinese mobile phone market is more competitive and seeking have become increasingly important for time to market, and therefore eMCP especially by MediaTek public version of the customer all ages. In the configuration to LPDDR4 based, 8 + 8 + 16 and a maximum of 32, but with the same specifications MCP plus NAND Flash controller chip on the price, the spread of up to 10 to 20%, to end at the phone manufacturers in terms of cost weigh and time to market.
Some eMCP same size 11.5mm x 13mm x 1.Xmm eMMC limited in size and, with LPDDR To eMMC assembled together, a capacity to grow easily, and secondly, a combination of both very prone to signal interference, the mass increase does not uncertainty, difficulty eMCP to have become high-end market development.
Overall, MCP mainly used in very low-end smart phone or feature phone market, eMCP for mainstream type of smart phones, particularly in the use MediaTek processor of mobile phone makers, to promote the use of time to market eMCP help . eMCP low across the main, middle-market, and has a tendency to gradually move towards high-end market, while the eMMC and separate Mobile DRAM greater flexibility in configuration, manufacturers have a greater mastership on open specifications, the mixing between the processor and memory can also have a better grasp, suitable for use in the pursuit of performance flagship model.
Hong Wang semiconductor ICMAX 2019 launched LPDDR4X 8GB memory, sights on high-end mobile phone market, of course, the choice of mobile phone manufacturers in the memory, not the most advanced integrated technology is the best, overall, appropriate, consistent with the chip platform to meet the out of specification requirements, stability and cost, as expected, is the best memory technology integration