720D is a nationally produced core module based on Shanghai Fudan Microelectronics FMQL20S400. This core module integrates the minimum system of Fudan Micro's FMQL20S400 (compatible with FMQL10S400) on a 50*70mm core board. It can be used as a core module for functional expansion, especially in the control field, and can exert its unique Advantage. The main chip of this core board is compatible with XILINX’s ZYNQ7010 or ZYNQ7020 series FPGAs. The core board is equipped with DDR3 SDRAM, EMMC, SPI FLASH, Ethernet PHY chips, etc. The expansion of PL side IO is achieved through two board-to-board connectors.
FMQL20S400 is a fully programmable fusion chip developed by Fudan Microelectronics. It integrates a quad-core processor (PS) and programmable logic (PL) with rich features in a single chip. Based on the advanced 28nm process and the corresponding development software, Implement an integrated software and hardware platform to facilitate user development and save production costs. This core module is mainly used in industrial control signal processing, industrial control image processing and other scenarios.
Technical indicators
1. Onboard FPGA real-time processor:
1) FPGA model: Fudan Micro FMQL20S400;
2) Processing system (PS): quad-core processor, maximum frequency 1GHz;
3) Logic resources: 85K, block RAM 560KB, DSP unit 220;
4) Package size: FCBGA400, 17*17mm, fully compatible with XC7Z020;
2. Dynamic cache indicators:
1) Number of caches: 2 pieces of DDR3 SDRAM particles;
2) Chip model: Unisoc Micro SCB13H4G160AF;
3) Cache bandwidth: 32-bit data bus, working clock not less than 500MHz;
4) Cache capacity: 2GByte;
3. Non-volatile storage:
1) QSPI FLASH: Fudan Micro JFM25Q256, capacity 256Mbit;
2) EMMC: Longsys FEMDRW008G, capacity 8GByte;
4. Ethernet interface:
1) Chip model: YT8531H from Yutai Microelectronics;;
2) Support 10M/100M/1000M adaptive Ethernet;
5. Other interface performance:
1) Crystal oscillator: The PL side supports one 50MHz clock, and the PS side supports one 33.33Mhz clock (Beijing Jingyuxing);
2) Board-to-board connector: 2 120Pin located on the Bottom layer (Hongyutong);
6. Physical and electrical characteristics
1) Board size: 50 x 70mm
2) Board power supply: 2A max@+5V (±5%)
3) Heat dissipation method: natural air cooling or metal conduction cooling
7. Environmental characteristics
1) Working temperature: -40°~﹢85°C;
2) Storage temperature: -55°~﹢125°C;
3) Working humidity: 5%~95%, non-condensing
software support
1. Board-level software development package (BSP):
1) Support naked running and Linux operating system;
2) Support underlying interface driver; support peripheral interface expansion;
2. Customized algorithms and system integration can be provided according to customer needs:
Application scope
1. Electric power, railway, and industrial control signal processing; low-latency image processing;
2. Small package and small size intelligent signal processing system;