Huawei Technologies Co., Ltd. recently disclosed a patent titled "Flip-Chip Package with Improved Thermal Performance", with the application publication number CN116601748A.
Embodiments of the patent provide a flip-chip package, a device equipped with a circuit applying the package structure, and a method of assembling the package.
More intuitively, it is a way to provide contact between the chip and the heat sink, which can help improve heat dissipation performance. It can be applied to chip types such as CPU, GPU, FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit), etc. Devices can be smartphones, tablets, wearable mobile devices, PCs, workstations, servers, etc.
The patent mentions that recent advances in semiconductor packaging handling performance have placed higher demands on thermal performance to ensure stable operation. In this regard, flip-chip packaging offers advantages in terms of thermal performance due to its structural feature that the chip is connected to the substrate via its underlying bumps, enabling the positioning of the heat sink on the top surface of the chip.
Typically, to improve cooling performance, a thermal interface material (TIM), such as thermal grease, is applied to the top surface of the chip and sandwiched between the chip and at least a portion of the heat sink. From the viewpoint of reducing the thermal resistance in the TIM to improve the thermal performance of the package, the thickness of the TIM is made smaller.
Compared with previous heat dissipation schemes where it was difficult to finely control the thickness of the TIM, the thickness of the thermal interface material in Huawei's patent is limited by the height of the wall-like structure in the molded component. Since the height of the wall-like structure composed of the mold compound can be easily controlled during the molding process, the thickness of the thermal interface material can be tuned to the desired minimum thickness, resulting in improved thermal performance.
Flip chip packaging technology is expected to make the design of electronic equipment more flexible and diverse. Since flip-chip packaging can make the chips more compactly arranged on the circuit board, the size of the product can be further reduced, thereby bringing a thinner and lighter appearance to mobile phones, tablet computers, smart wearable devices, etc. At the same time, it will also greatly improve the heat dissipation problem of mobile phone equipment.
However, this packaging technology also has many technical limitations. For example, flip-chip packaging requires complex wiring and connections on the back of the chip, which has high requirements on the manufacturing process and may increase production costs. Then there is the question of reliability. Since flip-chip packaging directly exposes the chip to the outside, it is easily affected by the external environment, and stronger protection measures are needed to ensure the stable operation of the chip.
Since the technology is still in the patent stage, it is unknown when it will actually be applied. Generally speaking, a patented technology will have a certain period from the technology verification stage to the final commercial use. There are also some technologies that are used as technical reserves and may never be applied.
According to Huawei's current status, technologies such as chip packaging are likely to be more difficult in commercial mass production.
In the consumer market, Yufan Micro also announced the latest radio frequency chip sealing technology , patent number CN 218677151 U, the utility model belongs to the field of semiconductor packaging technology, and provides a package integrating MCU and radio frequency chip, which can realize The function of the micro control chip (MCU) and the radio frequency chip.
It is mainly composed of a 2.4g chip or a 433m chip, plus an MCU package. The RF package chip has been widely welcomed in the remote control market once it is launched. The ultra-high cost performance is a magic weapon for winning in the consumer market, which can help merchants reduce all aspects. the cost of. For details, please visit Yufanwei official website (www.yufanwei.com)