July 11, 2023 , Shanghai, China ——Semiconductor officially released the high-speed digital signal integrity and power integrity The Intellectual Property (SI/PI) EDA2023 software set covers many important functions and upgrades in the field of advanced packaging and high-speed design.
Following the release of the 2023 version of RF EDA solutions at the International Microwave Exhibition IMS last month, Xinhe Semiconductor released the rest of the 2023 version of the full range of EDA products, including 2.5D/3D signal integrity and power integrity for advanced packaging. Sexual simulation, as well as three platforms of 3D EM electromagnetic simulation platform, multi-field co-simulation and high-speed system simulation.
Release Highlights
2.5D/3D Advanced Packaging SI/PI Simulation
Metis 2023 is a SI/PI simulation platform specially designed for 2.5D and 3DIC advanced packaging, which can easily realize the design analysis of 2.5D and 3DIC packaging. The latest upgrade introduces the parametric template function of transmission lines and Interposer, which can quickly perform pre-simulation analysis and evaluation of transmission lines and Interposer wiring. Other new features include: layout editing with through-silicon via TSV array channel simulation, automatic completion of electrical conductor (PEC) port addition, and stacking capabilities such as chip package bump and wire modeling. Additionally, it supports comprehensive PI AC analysis for quick assessment of power integrity in 2.5D and 3DIC packages.
3D EM electromagnetic simulation platform
- Hermes 2023 is an electromagnetic simulation platform suitable for arbitrary 3D structures such as chips, packages, circuit boards, and connectors. It supports full 3D modeling and simulation functions, and includes three major processes: Hermes Layered, Hermes 3D, and Hermes X3D, which support chip , Package and board-level electromagnetic simulation, pure 3D structural electromagnetic simulation, RLGC parasitic parameter extraction function. The Hermes platform is embedded with FEM3D full-wave electromagnetic field simulation engine and X3D RLGC parasitic parameter solver, and cooperates with adaptive mesh division and XHPC distributed simulation technology to realize efficient and easy-to-use simulation process and high-precision intelligent solution capability.
Multi-field co-simulation platform
- Notus 202 3 is a platform for chip/package/board-level SI/PI collaborative analysis, topology extraction and electrothermal stress analysis in high-speed design. It can quickly analyze whether the signal, power supply, temperature and stress meet the defined specification requirements through simulation, which is convenient for user design iterations, and can perform thermal stress analysis based on the thermal analysis results. Notus's simulation is based on process-based operation, easy to use and set up, which lowers the user's threshold for use, and its rich results, layout-based color map display and hotspot indication can facilitate users to quickly locate problems.
High-speed system simulation platform
- ChannelExpert 2023 is a full-link analysis platform for time domain and frequency domain of high-speed systems. It provides a fast, accurate and easy way to evaluate, analyze and troubleshoot high-speed channel signal integrity problems. It supports IBIS/AMI model simulation, AMI model creation, GUI and operation similar to schematic diagram editing. It can help engineers quickly build high-speed channels, run channel simulations, and check whether channel performance meets specifications, etc. The main functions of the new version include the creation of standard AMI models, output of DDR4/DDR5X/LPDDR4/LPDDR5X simulation reports according to JEDEC standards, etc. In addition, ChannelExpert also includes advanced circuit analysis functions, such as analysis modules such as statistics, COM, DOE, Yield and MC.
About Xinhe Semiconductor
Xinhe Semiconductor is a high-tech enterprise engaged in the research and development of electronic design automation (EDA) software tools. With simulation-driven design, it provides EDA solutions covering the entire industry chain with completely independent intellectual property rights covering IC, packaging and system, and supports advanced technology and Advanced packaging, dedicated to empowering and accelerating the design of a new generation of high-speed and high-frequency smart electronic products, has been widely used in 5G, smartphones, Internet of Things, artificial intelligence, and data centers.
Xinhe Semiconductor's self-innovated next-generation integrated passive device IPD platform, featuring high integration, high performance, and miniaturization, provides a series of integrated passive chips for customers such as mobile terminals, IoT, HPC, and automotive electronics, with cumulative shipments Over 2 billion pieces, and was selected by Yole as one of the main suppliers of IPD filters in the world.
Founded in 2010, Xinhe Semiconductor has its operation and R&D headquarters in Zhangjiang, Shanghai, R&D sub-centers in Suzhou, Wuhan, and Xi'an, and sales and technical support departments in Silicon Valley, Beijing, Shenzhen, Chengdu, and Xi'an.