On March 14th, the "MediaTek & Quectel's Wireless Innovation" technology exchange activity co-sponsored by Quectel, MediaTek, and University of Technology Sydney (UTS) was successfully held at UTS.
This event focused on the latest developments in 5G, Wi-Fi, loT, GNSS and other technologies. Experts and scholars from Quectel, MediaTek, and UTS demonstrated the latest innovations and research cases in the industry, attracting local mainstream communication operators, customers, Developers and students actively participated.
Scholars and experts gathered to discuss the development and application of wireless technology
During the event, UTS head of school Eryk Dutkiewicz delivered a welcome speech. UTS senior lecturer Dr. Ying He shared the machine learning in wireless communication.
As one of the organizers of this event, Quectel Product Director Wei Lai introduced Quectel's 5G products based on the MediaTek platform in detail. Quectel Australia team Michael Yang gave a detailed introduction to the Quectel GNSS module based on the MediaTek platform.
Shi Junyan, senior manager of MediaTek, and related technical experts gave a detailed introduction on its layout in the fields of 5G CPE, RedCap, GNSS, edge computing, and CE/BB/Auto Wi-Fi solutions.
Quectel joins hands with MediaTek to jointly explore the 5G FWA market
In recent years, with the increasing improvement of global 5G infrastructure and the rapid growth of people's demand for high-speed broadband connections, the 5G FWA (Fixed Wireless Access) market has expanded rapidly. Quectel's 5G modules based on the MediaTek chip platform can efficiently empower the FWA market and have been widely used around the world. Facing the global FWA and IoT markets, many ODM/OEM manufacturers are currently cooperating with Quectel on MediaTek 5G modules.
作为全球第四大无晶圆厂半导体公司，随着5G CPE需求提升，MediaTek推出了性能领先的SoC套片方案，无需调试USB/PCIe接口驱动，使得性能不受限制、吞吐速率更高。此外，MediaTek还提供配套蜂窝的Wi-Fi套片，优化了频率干扰问题，实现蜂窝与Wi-Fi共存，使成本更具竞争力。继此前率先推出的面向 FWA市场的SOC芯片平台T750后，MediaTek还于去年推出了第二代无线宽频解决方案T830 平台。
基于MediaTek芯片平台，移远通信先后开发了基于T750平台的RG500L 和基于T830平台的RG620T两大系列5G模组，其中最新推出的RG620T不仅能提供超高的5G网络速率、卓越的四核A55 CPU、前沿的Wi-Fi 7连接等先进特性，还采用了创新方案，在天线频段设计、Flash memory、QuecOpen上继续推陈出新，充分满足5G FWA市场对高性能灵活配置5G终端的急迫需求，广泛应用在FWA、移动宽带设备、工业自动化等场景。
当前，移远通信基于MediaTek平台的5G模组产品在全球范围内的多个场景得到了广泛应用，针对该系列产品，移远通信设立了专门的研发和技术支持团队，聚焦产品质量和开发周期，为全球客户提供快速、专业的支持和服务。
聚焦GNSS领域，多款定位模组相继推出
除了无线通信领域，移远通信和MediaTek在GNSS等领域也有着深入的合作。基于达发（Airoha）AG3352和AG3335芯片平台，移远通信分别推出了GNSS定位模组LC76G和LC29H。
LC76G是一款外形紧凑的单频超低功耗GNSS 模组，能够快速提供精准的位置定位服务，可助力终端设备将定位精度提高至1.5米内，适用于可穿戴式个人追踪器、野生动物和牲畜追踪器、收费标签、便携式集装箱追踪器、共享出行以及低成本资产追踪等场景；LC29H是移远通信的双频段高精度组合导航定位模组，支持RTK、DR技术，能够提供厘米级别的定位服务，可以满足无人机、割草机、农机、共享等场景的厘米级定位需求。
作为物联网模组和芯片领域的领导者，移远通信和MediaTek接下来将继续深入合作，持续丰富产品种类，推出更多高性能的、符合新标准和市场趋势的模组产品，满足日益增长的用户需求。与此同时，移远通信将紧跟5G、Wi-Fi、GNSS等技术发展的步伐，携手MediaTek等合作伙伴，不断创新，为千行百业的数智化转型贡献力量。