Outline
What is the LGA, PGA, BGA type of package? Is well known, the main CPU package type into three: LGA, PGA, BGA, LGA package which is the most common, and are based on Intel processor of this type of package, PGA package and is commonly used as a package type AMD.
PGA's full name is called "pin grid array", or "pin grid array packages." Pin on the CPU.
LGA's full name is called "land grid array", or "land grid array." Pin sockets on the PCB.
BGA's full name is called "ball grid array", or "ball grid array packages grid." Blind stitch, directly welded.
Any object on the computer interface, there are two ways, one is removable, known as male female port mouth, one is welded. Similarly the interface of the CPU, male female opening the LGA and PGA mouth, welded refers BGA.
PGA
PGA's full name is called "pin grid array", or "pin grid array packages." Pin on the CPU.
pga pin is characterized in the CPU, while the motherboard is a Xiaodong, the CPU for the public, the motherboard for the mother.
PGA pin structure below, a PGA pin is straight to the pillars, is welded to the bottom of the solder contact by the CPU.
Since the PGA CPU is to go straight pin, if the motherboard CPU is generally planar contact base, then, even if the produced CPU can do flat pins and the base contact, once the deformation of the base, deformation or CPU, it will appear the case of the reach of poor contact pin CPU might point does not shine, it may lead to failure of some functions may also be directly burned.
Therefore, the motherboard of the base portion is made of PGA Xiaodong Dong, but there is a side Xiaodong sandwiched stitch design, the pin on the CPU is a lateral force. And a copper pillar lateral force will have a certain degree of curvature, even if there are some errors in dimensions, just some clips clamp tight loose some only, of the base is substantially PGA design ensures that each stitch will not be open circuit.
Larga
LGA's full name is called "land grid array", or "land grid array." Pin sockets on the PCB.
PGA pin is on the CPU, if the bent pin on the CPU, that whether it is paid or unpaid maintenance, it is the responsibility of intel or AMD, so most people think that in order to "pass the buck" So was born LGA .
LGA and PGA difference is also apparent, the solder and remove the LGA copper pillar stitch, leaving only the contacts, pins are on the motherboard.
针脚在主板上，CPU的触点是平面的，那问题跟11楼一样，如果主板CPU底座上的针脚是直上直下的，那就会出现接触不良的情况，所以CPU底座上的针脚都做成倾斜的。
做成倾斜的针脚，CPU压上去之后就可以倾斜受力，针脚和触点之间只有压得紧和压得松的区别，不会出现接触不良的情况。
BGA
BGA的全称叫做“ball grid array”，或者叫“球柵网格阵列封装”。无针脚，直接焊接。
BGA封装也就是焊接的。焊接方法就是通过植球板将焊锡球先用热风枪吹在CPU触点上，然后对准主板PCB加热即可。
BGA广泛应用于笔记本中，做成BGA的目的就是加强集成度，避免你自己换U升级。
intel从5代酷睿移动版开始全面使用BGA封装，未来可能永远也不会再考虑使用PGA封装。但幸好还有个替代品：“台U本”。“台U本”也就是所谓的“准系统”，使用的是台式机CPU，主板也是LGA的接口，可以随意更换台式机使用的CPU。
BGA转PGA
另外还有一种封装方式是BGA转PGA，主要适用于既有BGA也有PGA的4代酷睿移动版。简单点说就是你笔记本是PGA接口，可以选择BGA接口的CPU，小工厂加工出来一个BGA转PGA的PCB板子，然后把BGA的CPU焊在这个板子上，买回来可以当做PGA的CPU直接用在PGA接口的笔记本上。但是要注意的是，小厂加工水平有限，有可能会虚焊，散热器底座螺丝时受力不均可能会导致开焊，所以BGA转PGA的CPU才会特别便宜。
PGA封装的问题
PGA封装，针脚插在小洞洞里，底座与CPU PCB会有大面积的接触，受力也会比较均匀。
这样的话，散热器的压力会均匀的受力在CPU底座上，并不会影响针脚。
PGA的最大问题就出在AMD的扣具设计上，AMD的CPU如果用了较差的硅脂，硅脂干了后会粘住CPU导致散热器拆不下来，而强行拔的话，就可能导致针脚损坏。
而intel在LGA775时代也是PGA封装的，为什么intel就不会出现散热带着CPU一起拔下来呢？
我们来看下图：intel的CPU顶盖四周是凹下去的，这样的话，CPU底座就可以框住CPU，而AMD的就是一个平板，CPU底座只能靠夹住针脚来固定CPU，没有任何卡住顶盖的设计，所以AMD的CPU在拆卸散热的时候，千万不要直接上拔，大力很可能不会发生奇迹的！
LGA封装的问题
LGA的问题也很多，LGA上就像是针板胸口碎大石，整个散热的压力都压在针脚上。
所以LGA很怕安装散热器的时候受力不均，更怕散热器压力太大，因为受力不均或压力太大都可能会导致针脚错位。
像玄冰400那种扣具，就很可能在安装时导致CPU针脚错位，然后再开机CPU就很可能会短路烧毁。
LGA针脚受力还有一个致命缺点，就是散热器是压在CPU顶盖上的，而CPU顶盖不可能跟CPU PCB一样大，外面总是露出来一圈PCB的，而这部分PCB受到针脚上来的压力，但自己顶部是没有受力点的。
6代酷睿开始intel将CPU的PCB减薄，结果就是，如果你CPU散热上的太紧，CPU PCB边缘就会上翘。而上翘之后针脚就可能会错位，而错位后就可能会损坏CPU或主板，所以说没事儿别折腾，你的每一次折腾都可能导致再也开不开机。
结论
所以结论再简单不过，卡住顶盖的PGA是目前相对最安全最保险的方式。但intel和AMD目前均未使用这种接口设计。intel台式机全系列LGA，而移动平台和嵌入式平台全系列BGA；AMD低端全部都是没有卡住顶盖的PGA，高端都是LGA，嵌入式平台的当然也都是BGA的。垄断型的行业就是这么任性，我们也只能默默承受了。
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