[Reprint] Intel's first 10nm technology of hybrid CPU "Lakefield" the upcoming release

Intel's first 10nm technology of hybrid CPU "Lakefield" the upcoming release

intel soc also the stuff inside out with a series of Android and apple like. 

https://baijiahao.baidu.com/s?id=1626791977605638179&wfr=spider&for=pc 

intel also learned with amd.

 

MCU front

Date: 03-02 10:38

Intel (Intel) has launched the next generation of processors Lakefield propaganda work, which will be the first to use Intel's new processor Foveros 3D packaging technology, and will be put into operation later this year. By following trailer we can have a general understanding, Intel and Qualcomm will compete for the next generation of notebook computers and portable devices directly in the SoC space.

Lakefield will be a system-on-chip, released this year in one of the most interesting and the most abundant technical packaging products, Intel will showcase its 3D design package that encapsulates a lot of chips on the main fundamental mode, GPU, memory, and I / O . Lakefield represents the transformation of traditional chip packaging. Foveros CPU architecture is a hybrid, which supports the combined fragments into a different IP packet, rather than into a single silicon wafer die. This includes some of the original may be discrete parts. By adopting such a stacked 3D mode, Intel to create smaller, more compact system.

"As a result, the product is in power efficiency, immersive graphics, I / O and memory have been optimized, which are approximately 12mm square in this tiny SoC in." Then we'll CPU architecture this hybrid approach pairing with an innovative 3D packaging technology (which we call Foveros), this technique allows us in three dimensions rather than two-dimensional space is actually the different IP blocks are stacked together, "Intel explained.

Because it is part Lakefield Intel is displayed, a high-performance mixing by the CPU 10 nanometers Sunny Cove based core 4 and 10nm small inner core.

高性能Sunny Cove内核与四个小内核的组合让人想起ARM的big。小的方法。在本例中，Lakefield具有1.5MB L2缓存和4MB last-level缓存(LLC)、Intel Graphics Gen11、LP-DD4内存、Gen 11.5显示处理器、成像处理器、摄像机串行接口和一些其他组件，如上图所示。

通过将所有这些部件打包成一个混合的CPU设计，Intel为oem提供了一个更小的解决方案。例如，可以把这个Lakefield的部件塞进一个只有125mm x 30mm的主板中，这个主板只有一支笔那么长，宽度也不是很大。

这两个DRAM层被放置在容纳10nm上的CPU和GPU的计算芯片上，然后放置在带有缓存和I/O的基模上。英特尔承诺，这款芯片全新的供电系统将具有更长的电池寿命、世界级的性能和惊人的快速连接。这意味着，用更小的芯片，我们将拥有更小的电路板，用更小的电路板，我们将看到一种新的便携式，但功能强大，功能强大的双屏幕可转换笔记本电脑，以及英特尔在视频中简化了一些概念的其他书本式设备。

英特尔表示，预计这种设备将在“今年”投产，我们也期待在今年晚些时候将看到这款独特的芯片。