May 27, 2019, at the opening keynote COMPUTEX 2019 Taipei International Computer Show, Dr. Lisa Su AMD president and CEO for the first time announced a variety of 7nm process based on high-performance computing and graphics cards, is expected for PC games players, fans and content creators to bring a higher level of performance, technology and experience.
1, the new "Zen 2" core greatly enhance the performance level of the industry's products generational, IPC (instructions per clock cycle) than expected "Zen" architectural improvements of up to 15%. The newly designed "Zen 2" processor core brings substantial upgrading to a new generation of AMD Dacentrurus and EPYC (Xiao Long) processor, including larger cache capacity and a new floating point unit.
2, the third generation AMD desktop processor Dacentrurus series, including the new 12-core Dacentrurus 9 series processors will deliver top performance.
3, AMD X570 chipset is the world's first chipset to support PCIe4.0, the use of socket AM4 architecture, will be released over the same period the balance of 50 new motherboard.
4, RDNA game structure aimed at promoting computer games, game consoles and cloud the future of computing, is expected to achieve incredible performance, power and memory efficiency improvements in a smaller package.
5,7nm AMD Radeon RX 5700 series graphics card game series, with high-speed GDDR6 graphics memory to support PCIe 4.0.
Dr. Lisa Su attended together also include Roanne Sones, vice president of Microsoft's Platforms Group, Chief Operating Officer Joe Hsieh, Asus, Acer joint chief operating officer Jerry Kao, and other key industry technology leaders, AMD demonstrated their common high-performance computing and graphics ecosystem the far-reaching impact.
Dr. Lisa Su said: "2019 for AMD is incredible start, AMD to celebrate 50 years of innovation process through the introduction of several leading products, and thus continue to push the envelope and computer graphics technology to .AMD next-generation core, a breakthrough single-chip packaged modular design (chiplet) and advanced process technology made a major strategic investment, which brings advanced 7nm process products for the company's high-performance computing ecosystem. in preparing the new generation of sharp Long desktop processors, EPYC (Xiao Long) server processor and Radeon RX card game market on the occasion, we are very pleased to start the 2019 Taipei international computer show, together with industry partners.
AMD高性能台式机产品
以引领PC产业之道为先，AMD公布了全球领先的第三代锐龙台式机处理器，这款处理器在游戏、生产力和内容创建应用程序方面均具备开创性的性能。基于全新“Zen 2”单封装模块化芯片架构（chiplet）的第三代AMD锐龙台式机处理器预计将提供前所未有的核心缓存性能，以释放精英级游戏动能。此外，全系第三代AMD锐龙台式机处理器均已为世界首款PCIe 4.0接口提供完备支持，提供极为先进的主板、显卡以及存储技术，打造全新性能标杆并提供了极致的消费者体验。
AMD还为第三代锐龙台式机处理器全新打造了全新的锐龙9系列产品线，其旗舰型号为12核心/24线程的锐龙9 3900X，将以其卓越性能继续推动高性能Socket AM4平台架构。AMD同时还完善了8核心的锐龙7系列以及6核心的锐龙5系列产品。
在主题演讲中，Lisa Su博士还进行了多项现场产品演示，以凸显第三代AMD锐龙台式机处理器的领先性能。
第三代AMD锐龙台式机处理器参数以及上市时间：
AMD为Socket AM4平台推出了世界首款完备支持PCIe 4.0接口的全新X570芯片组，存储性能将比PCIe 3.0快42%，全面支持高性能显卡、网络设备、NVMe硬盘等PCIe产品。基于AMD X570芯片组的主板将比PCIe 3.0主板带宽加倍，电脑发烧友在构建定制化系统时可获得更高的性能和灵活性。 X570芯片组将为AMD打造前所未有的开放式生态系统。华擎、华硕、七彩虹、技嘉、微星等板卡合作伙伴预计将推出五十余款全新X570主板，而影驰、技嘉和群联电子等合作伙伴也将推出全新PCIe 4.0存储解决方案。第三代AMD锐龙台式机处理器预计将于2019年7月7日在全球上市。
此外，包括宏碁、华硕、CyberPowerPC、惠普、联想和MainGear在内的众多知名OEM厂商和系统集成商，也将在未来数月宣布其基于第三代AMD锐龙台式机处理器的游戏桌面平台计划，以此继续增强此全新平台构建的强大生态系统。
AMD高性能游戏产品
AMD还推出了新一代的基础游戏架构-RDNA，旨在推动未来几年电脑游戏、游戏机和云游戏的发展。RDNA采用全新计算单元设计，与上一代GCN图形核心架构相比，RDNA预计将在更小封装中提供不可思议的性能，功耗和显存效率。与GCN图形核心架构相比，RDNA预计提供高达1.25倍的每时钟性能和高达1.5倍的每瓦性能，以更低功耗和更小延迟提供更好游戏性能。
即将推出的7nm AMD Radeon RX 5700系列显卡采用RDNA架构，配备高速GDDR6显存并支持PCIe 4.0接口。
在主题演讲中，Lisa Su博士展示了RDNA的强大性能，并且当场使用一款AMD Radeon RX 5700显卡展示了《奇异小队》（Strange Brigade）游戏demo中的图形性能，其性能表现不可思议，达到每秒100帧左右。
AMD Radeon RX 5700系列显卡预计将于2019年7月上市。请于太平洋时间2019年6月10日下午3点在AMD E3直播活动中了解更多细节。
AMD数据中心产品
AMD数据中心业务继续赢得客户青睐，在从最大的云环境到百亿亿级超级计算的工作负载中得到部署和应用，并从AMD EPYC（霄龙）和AMD Radeon Instinct处理器所面临的巨大市场机遇中获益。
在主题演讲中，Lisa Su博士首次公开进行了第二代AMD EPYC（霄龙）服务器平台的对比演示，继续引起大家对下一代EPYC（霄龙）处理器的期待。
Finally, AMD and Microsoft Azure announced that the use of Azure HB cloud instance running on the system (Xiao Long) processor-based first-generation AMD EPYC, achieve computational fluid dynamics (CFD) previously unavailable performance levels. Use AMD EPYC (Xiao Long) outstanding memory bandwidth, Azure HB using the Le Mans 100 million units simulations on more than 11,500 core extends the Siemens Star -CCM + applications, far more than previously never reached 10,000 core objectives. Microsoft Azure Virtual Machines product manager Navneet Joneja expressed: "HB series of virtual machine (VM) on the Azure changed the rules of the game of high-performance computing (HPC) HPC in the cloud for the first time customers can be extended to several MPI workloads. ten thousand core, and has a comparable local cloud cluster deployment flexibility, performance and economy. we look forward to making a significant contribution to this new Azure cloud instance can drive innovation and productivity for HPC. "
Compared with the previous generation, the second generation AMD EPYC (Xiao Long) server processor family will provide up to twice the performance per slot and up to four times the floating point performance.
The second generation AMD EPYC (Xiao Long) server processor 2019 series are expected to be launched in the third quarter.