On December 15, Xingsen Technology grandly held the "Thirty Weeks of Dream Ceremony" at the Langham Place Hotel in Pazhou Nanfeng, Guangzhou with the theme of "Connecting the Digital World with Cores". Over the past thirty years, Xingsen has stayed true to its original aspiration, lived up to its mission, bravely stood at the forefront, and continued to move towards becoming the world's leader in digital manufacturing of advanced electronic circuit solutions. On the day of the ceremony, leaders from all walks of life, industry leaders, company customer representatives, employee representatives, etc. came to congratulate each other. Qiu Xingya, chairman of Xingsen Technology Group, Liu Min, chairman of Dianchao Technology, and Zhang, an expert representative from the Dianchao Technology industry Yuan and many other company executives attended the ceremony.
At 9:00 a.m. on the day of the ceremony, it was co-sponsored by Xingsen Technology and Dianchao Technology. The Guangdong Integrated Circuit Industry Association, Guangzhou Semiconductor Association, and the province and ministry jointly built the National Key Laboratory of Precision Electronic Manufacturing Technology and Equipment (Guangdong University of Technology) An advanced packaging technology development forum co-organized with the theme of "AI Accelerated Hardware Interconnect Innovation" kicked off the ceremony.
This "AI Accelerated Hardware Interconnect Innovation" advanced packaging technology development forum is the first show of EITIA (Electronic Interconnect Technology Innovation Conference). The gold content of the forum is self-evident. Nearly 500 representatives of outstanding industry companies gathered here to participate together. The holding of this important forum.
The atmosphere at the forum was warm and it was widely recognized in the industry! This forum closely integrates innovation, technology, industry and globalization. The success of the event is not only an important milestone, but also paves the way for the future of the semiconductor industry.
This forum focuses on cutting-edge AI technology and hardware interconnection, covering innovation and development trends in the field of electronic packaging. The forum invited many industry leaders to lead the forum. Qiu Xingya, chairman of Xingsen Technology Group, and Liu Min, chairman of Dianchao Technology, attended the forum in person to witness this glorious moment with the guests and the audience.
Chairman of Xingsen Technology Group - Qiu Xingya; Chairman of Dianchao Technology - Liu Min
This forum was hosted by Professor Chen Xin, chief consultant of Xingsen Technology and former president/party secretary of Guangdong University of Technology.
Chief Consultant of Xingsen Technology-Chen Xin
A big opening, there will be repercussions. When the forum opened, Qiu Xingya, chairman of Xingsen Technology Group, delivered a speech. Mr. Qiu said that this development forum is mainly to jointly discuss the latest market trends and technology development directions of advanced packaging in the semiconductor industry, focusing on cutting-edge AI technology and hardware interconnection innovation, as well as innovation and development trends in the field of electronic packaging. He hopes that through this exchange It can inspire more innovative thinking in the industry and promote semiconductor packaging technology to play a more important role in future industry development.
Chairman of Xingsen Technology Group-Qiu Xingya
Subsequently, Zhang Yuan, an expert representative of the E-Chao technology industry, gave a forum introduction. The Electronic Interconnect Technology Innovation Conference, referred to as EITIA, aims to break through the cutting-edge electronic interconnect technology and is driven by terminal demand. It consists of leading enterprises in the upstream, midstream and downstream of the industry chain, A collaborative, innovative, technological and global industrial technology innovation conference that is voluntarily initiated and organized by universities, scientific research institutions, social organizations, etc. from horizontal to edge and vertical to bottom.
Expert representative of Dianchao technology industry-Zhang Yuan
Afterwards, many big names gave keynote speeches around the theme of this forum.
Sharing topic: Semiconductor market trends and prospects.
Jiang Xugao, Prismark partner and head of Asia Pacific, gave a speech. Dr. Jiang Xugao analyzed the market trends and prospects of semiconductors based on the current development status of the global semiconductor packaging industry. Dr. Jiang Xugao said that the semiconductor industry has been affected by the economic environment and the overall output value has declined. However, semiconductors in automobiles, servers and other fields have achieved growth against the trend. With the popularity of AI, packaging substrates, as one of its key raw materials, will experience rapid growth in the next few years.
Prismark Partner, Asia Pacific Head-Jiang Xugao
Sharing topic: Arm Neoverse empowers edge computing.
Tan Zhaolu, chief solution architect of Arm Technology, introduced the Arm Neoverse platform. Arm Neoverse is a product designed specifically for the infrastructure application market and has been widely used in data centers, cloud computing, 5G data transmission, edge computing and other fields. Since its release in 2018, Arm Neoverse’s CPUs have been widely deployed in domestic and foreign data centers.
Chief Solution Architect of Arm Technology-Tan Zhaolu
Sharing topic: Chip packaging design trends and EDA verification solutions.
Peng Qihuang, President of Siemens EDA Asia Pacific, introduced chip packaging technology trends and EDA verification solutions from three aspects: industry trends, design processes and ecosystems. President Peng Qihuang said that advanced packaging technology will be the focus of development in the future, and ecosystem and in-depth cooperation are indispensable. At the same time, the ability of suppliers, partners, foundries and OSAT to seamlessly share designs and technologies are all important factors in future development.
President of Siemens EDA Asia Pacific-Peng Qihuang
Sharing topic: Evolution and challenges of advanced packaging technology.
Liu Weidong, technical marketing director of Huatian Technology, introduced the evolution trend of advanced packaging technology from aspects such as advanced packaging platform, high-end advanced packaging platform, and advanced packaging technology development roadmap. Director Liu Weidong said that the development of advanced packaging is of great significance to the semiconductor industry, but challenges such as mismatched capabilities and demands are current problems. In the future, localized equipment and materials will usher in new opportunities and challenges in advanced packaging.
Huatian Technology Technical Marketing Director-Liu Weidong
Sharing topic: Advanced packaging substrate technology and development
Chen Zongyuan, general manager of Xingsen Technology’s BGA business unit, introduced in detail the development direction of advanced FCBGA substrates and shared Xingsen Technology’s FCBGA substrate planning for the future development. General Manager Chen Zongyuan said that with the development of packaging technology and high-end applications, the importance and challenges of advanced FCBGA substrates have also increased. Xingsen Semiconductor's vision is to become the world's preferred supplier of advanced FCBGA substrates, meeting the needs of domestic and foreign customers from sample research and development, small batch trial production to mass production. In the direction of technological development, Xingsen FCBGA substrates will continue to develop and break through in the direction of high-level count, large size, fine lines, small spacing, and multi-function.
General Manager of Xingsen Technology BGA Business Unit-Chen Zongyuan
Sharing topic: Research and application of polymer-based advanced electronic packaging materials.
Yu Shuhui, researcher and doctoral supervisor at the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, shared the research and application of polymer-based advanced electronic packaging materials based on actual research cases. Dr. Yu Shuhui said that high-end electronic materials for integrated circuits are fundamentally an engineering problem at the molecular level. It is multi-disciplinary and basic research and industrialization must "actively go in both directions", and no one is missing.
Researcher at Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences-Yu Shuhui
At the end of the roundtable
forum, Professor Chen Xin served as the moderator, and Teacher Zhang Yuan, Dr. Jiang Xugao, President Peng Qihuang, Dr. Chen Zongyuan, and Dr. Yu Shuhui served as guests. High-quality discussions centered on the development trends of the semiconductor industry, production expansion, R&D innovation and other topics. roundtable conference. The guests expressed their opinions and actively interacted with the participants, and came up with many valuable suggestions.
The "AI Accelerated Hardware Interconnect Innovation" advanced packaging technology development forum has been successfully concluded. Xingsen Technology and Dianchao Technology, as the initiators of this EITIA (Electronic Interconnect Technology Innovation Conference), actively responded to the needs of the high-end digital chip market , use its own resources to collaboratively mobilize upstream, midstream and downstream enterprises, universities and scientific research institutions, social organizations, etc. in the industry chain to voluntarily initiate and form a collaborative, innovative, technological, and global industry conference from horizontal to edge and vertical to bottom.
The "AI Accelerates Hardware Interconnect Innovation" advanced packaging technology development forum is an important step in EITIA industry activities. In the future, Dianchao Technology will continue to hold EITIA industry activities to "connect" more upstream, midstream and downstream enterprises, universities and scientific research institutions in the industry chain. Collaborative innovation brings more valuable industry conferences.
Fueling Xingsen’s 30th Anniversary Celebration
Corporate culture is the foundation of corporate development. Over the past thirty years, Xingsen Technology has shared weal and woe with the development of China's electronic circuits, adhering to its mission - to promote the continuous innovation of electronic technology and move towards the world's leader in digital manufacturing of advanced electronic circuit solutions. The thirty years of Xingsen Technology are like a microcosm of the electronic circuit industry, witnessing scenes of successful experiences and the joy of victory again and again.
Qiu Xingya, chairman of Xingsen Technology Group, said that customer trust is the biggest driving force for Xingsen Technology's products. Xingsen Technology's thirty years of growth cannot be separated from the help and support of government leaders and the guidance of all sectors of society. Next, Xingsen Technology will start a new journey, starting with a new mission vision, core values and brand vision. The mission is to "facilitate the continuous innovation of electronic technology", the vision is to "become the global leader in digital manufacturing of advanced electronic circuit solutions", the core values are "customer first, efficient and reliable, continuous innovation and common growth", and the brand slogan is "Use the core Connecting the Digital World", and continue to focus, gather strength, and fusion to achieve new visions and goals.
The concepts of Dianchao Technology and Xingsen Technology coincide with each other. In the process of continuous exploration and practical development, they provide customers with digital marketing services that exceed expectations, continue to innovate, create breakthroughs, and strive to set a benchmark for the industry. Artificial intelligence has swept across all walks of life, and the future has become unpredictable. Digital transformation is one of the important means of response. As a leader in XR virtual technology live broadcast in the electronics industry, Dianchao Technology is actively building new digital models and creating diversified new digital marketing solutions. .
In the future, Dianchao Technology will continue to give full play to its resource advantages to help customers with their digital transformation, while integrating more online and offline activities, and carrying out more high-quality industry conferences and live broadcasts, with "digitalization" as the core strategy Basically, it brings more possibilities to the industry!