GOWIN FPGA chip GW2A curing method

foreword

This article introduces the process of using the Gowin compiler to solidify the Gowin FPGA chip.

hardware environment

Development board: Gaoyun DK_START_GW2A55-PG484_V1.3 development board

FPGA chip model: Gaoyun GW2A-LV55PG484

Development environment: Gowin compiler

Steps

After the development board is powered on, right-click the retrieved device and select "Configure Device",

Select "External Flash Mode" for "Access Mode", select "exFlash Erase, Program thru GAP-Bridge" for "Operation", click "Save" to save, click "Program/Configure" option

,

After completion, a message will be printed out, indicating that the programming is complete.

Summarize

Generally speaking, the operation is simple.