1. Classification of memory chips
RAM (Random Access Memory) random access memory, we often hear the word RAM in our daily life. For example, a mobile phone has 6G RAM+128G ROM. Those who are familiar with mobile phones know that RAM stands for running memory. The larger the running memory, the more applications you can open without getting stuck.
DRAM (Dynamic Random Access Memory) is the most common system memory. The running memory of the computers and mobile phones we use is DRAM.
SRAM (Static Random Access Memory, static random access memory), it is a kind of memory with static access function, its internal mechanism is more complicated than DRAM, it can save the data stored in it without refreshing the circuit
ROM (Read Only Memory) is a memory that stores fixed information. It is characterized in that it can only read data under normal working conditions, and cannot modify or rewrite data in real time.
The characteristic of EPROM optically erasable programmable read-only memory is that its contents can be erased and rewritten by special devices. When the EPROM leaves the factory, its storage content is all "1", and the user can rewrite it to "0" according to the needs. When the storage content needs to be updated, the original storage content can be erased (restored to all "1") in order to write a new one. Content. EPROM generally exposes the chip to ultraviolet rays for about 15 to 20 minutes to erase the contents, and then rewrites the information with a special device (EPROM writer). Once written, it is relatively fixed. Before the widespread use of flash memory, EPROM was often used in the software development process.
EEPROM or E2PROM Electrically Erasable Programmable Read-Only Memory The operation of erasing EPROM with ultraviolet light is complicated and slow. EEPROM can electrically erase the storage content in the chip, the erasing time is fast, and it can even be operated in an online state. EEPROM can use word erasing mode and block erasing mode, one storage unit can be erased by word erasing mode, and all storage units in the data block can be erased by block erasing mode.
Flash ROM flash memory is a block erasable memory that appeared in the mid-1980s. It is a high-density, non-volatile read/write semiconductor memory. It breaks through the traditional memory system and improves the existing characteristics of memory. The content or data in Flash ROM does not require power support to save like RAM, but it is rewritable like RAM. Under a certain low voltage, its internal information can be read and unwritable, similar to ROM, while at a higher voltage, its internal information can be changed and deleted, similar to RAM.
2. Market share of memory chips
3. DRAM and NAND FLASH
The sales of DRAM and NAND Flash in China occupy more than 30% of the global market share
DRAM:
In the downstream field of DRAM, smart terminals and other mobile devices account for the largest proportion, accounting for more than 35% in 2018-2020. Servers are the second largest application field of DRAM, accounting for about 25%-30% in 2018-2020 , the third largest field is the consumer electronics market, accounting for about 15-18% in 2018-2020. The PC field accounts for about 12%-14%. The market share of DRAM for graphics is relatively small.
Taking shipments in the third quarter of 2021 as an example:
In terms of market share, Samsung has 44%, SK Hynix has 27.2%, and Micron has 22.9%. South Asia, Winbond, and PSMC rank third, fourth, and fifth respectively.
Take the TOP10 global DRAM memory manufacturers in 2020 as an example:
Kingston 78%, ADATA 3.19%, Memory Technology (Ramaxel) ranked third, Kimtigo ranked fourth, and POWEV Jiahe Jinwei ranked fifth. The sixth to tenth places are respectively: Smart Modular Technologies, Team Group, Patriot Memory, Apacer, and Innodisk, and their shares are all below 1%.
NAND FLASH:
NAND Flash is currently the most important product in flash memory, with the advantages of non-volatility, high density, and low cost. It is widely used in eMMC/eMCP, U disk, SSD and other markets. SSD accounts for the largest proportion, accounting for nearly 50%, followed by mobile terminals, mainly eMMC and eMCP in smartphones and tablets, accounting for about 40%, and the third is mobile storage, including USB and flash memory cards. Lower share.
Taking shipments in the fourth quarter of 2021 as an example:
The first Samsung and the fourth SK Hynix are mainly produced in South Korea, the second Kioxia (Toshiba) and the third Western Digital (SanDisk) are mainly produced in Japan, the fifth Micron and the sixth Intel (Solidigm) produced in the United States and Taiwan, China
4. Development trend of China's memory chip industry
(1) Memory chips are ushering in a golden period of development. Global memory and flash memory products are basically monopolized by South Korea, Japan, the United States and other countries in the international competitive market. In the field of DRAM, Samsung, Hynix, and Micron are the industry leaders. In the field of NAND, Samsung, Toshiba, Cintiq, Hynix, Micron, and Intel jointly control the global discourse power . At present, China has initially completed its strategic layout in the field of memory chips. However, due to China's late start and technological blockade, the market share is small, and there is still a lot of room for development before full domestic substitution.
(2) IP innovation and independent manufacturing For memory chips, since the difficulty of the memory chip process lies in IP and manufacturing, the mainstream business model of leading manufacturers is the IDM model, which is subject to restrictions on China's semiconductor industry in Europe, America, Japan and South Korea. The main method is the combination of cooperative authorization and independent research and development. Due to the relatively late start of Chinese manufacturers in the DRAM field, the accumulation of patents is relatively weak. However, due to the relatively mature technology development of DRAM in general, the capital investment of international leading companies in the field of R&D has decreased, which provides a good opportunity for Chinese manufacturers to continue to increase capital investment and achieve domestic substitution. On this basis, Chinese manufacturers accelerate independent IP research and development, reduce costs and improve product performance, so as to reach the international leading level in terms of bargaining power and pricing flexibility. In terms of NAND Flash IP, 3D NAND Flash stacking technology has been upgraded from 2D planar technology. Since 3D stacking technology is a new technology that has emerged in recent years, the technology gap between China's leading enterprise YMTC and international manufacturers is relatively small. However, in the field of IP reserves, Chinese manufacturers are still in a weak position, and memory chip giants such as Samsung, Toshiba, SanDisk, and Hynix still have an overwhelming advantage. Under the general trend of the transfer of the semiconductor industry to China, major international manufacturers have set up factories in mainland China or increased the scale of factories in mainland China. According to SEMI data, over the past four years, more than 60 fabs have been put into production worldwide, of which 26 are located in mainland China , accounting for more than 40% of the global fabs. The manufacturing industry is the core link of integrated circuits, and the migration of the manufacturing link to the mainland will directly promote the development of China's memory chip industry. With the establishment of a large number of fabs in China, China's memory chips will usher in the breakthrough and maturity of advanced process technology.
(3) Fab layout
There are mainly Chinese factories of international giants and domestic manufacturers. International giants have been cultivating for many years, and domestic manufacturers have started mass production and have a large planned production capacity. The giants in China's future storage industry will be Tsinghua Unigroup and Changxin (GigaDevice). Judging from the semiconductor memory business revenue of some key companies such as GigaDevice, Juchen, and Ziguang Guowei, their semiconductor memory business revenue has achieved steady growth in the past five years. As of 2020, they were 3.283 billion yuan, 409 million yuan, 11 million yuan.
(5) Layout of packaging and testing plants
Haitai Semiconductor: a joint venture between Hynix and Taiji Industrial, which mainly undertakes the chip packaging and testing business of Wuxi Hynix;
Ziguang Hongmao: mainly undertakes the chip packaging and testing business of Ziguang Group;
BIWIN Storage: Undertake part of the packaging business of Yangtze River Storage;
Taiji Semiconductor: one of the suppliers of the follow-up packaging and testing business of Hefei Ruili memory business (Changxin);
STATS ChipPAC: Undertake part of SanDisk’s packaging and testing business;
Payton Technology: the largest DRAM memory chip packaging and testing company in China, and the main supplier of Kingston's packaging and testing business;
Konka Xinying: engaged in packaging, testing and sales of memory chips.
(6) Layout of self-owned brands
Longsys: A leader in the field of storage modules in China, an international storage brand company, a large fund has invested in shares, and will use the 3D NAND chip of Yangtze River Storage, and choose the storage control chip of Yiwei Electronics and Maxio Technology, which is composed of Payton Technology, Zhenzhen Kun technology packaging production, to create purely domestic memory chips.
Konka: From a home appliance manufacturer to a semiconductor manufacturer, it has established a storage industry chain of design, packaging and testing, and channels. Its subsidiary Konxinwei has completed the design and mass production of eMMC5.1 main control chips, and will complete SSD, UFS and other storage in the next two years The design and mass production of the main control chip; Konka Xinying, which has "packaging and testing + channels", and Zhongkang Storage Technology, which has already been deployed
5. The operating conditions, market position and technical strength of related enterprises in the industry
At present, major companies in the global semiconductor storage industry include Kingston, Phison, Corsair, SmartGlobal, and BIWIN Storage. Among them, Kingston is a leading global manufacturer of memory and storage solutions, with an international service network covering six continents, including distributors, retailers and OEM customers; A leader in the field of control chips such as PCIe solid-state disks.
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Domestic memory chip industry layout - simplified version 1. Classification and proportion of memory chips The largest proportion is DRAM and NAND FLASH, and only these two types will be analyzed below. 2. The layout of international giants 1. DRA... - Xueqiu's
global semiconductor memory industry is showing a fluctuating growth trend. DRAM and NAND Flash are the mainstream markets_Guanyan Report