[Reprint] The difference between STM32 size and capacity chips and the selection of startup files

This article mainly discusses the characteristics of STM32F103xC, STM32F103xD and STM32F103xE high-capacity enhanced chips:

1) What is a large-capacity chip?

A: Chips with up to 512K bytes of flash memory and 64K bytes of SRAM are high-capacity chips.

2) STM32 has small capacity, medium capacity and large capacity models. What is the difference?

      Because the STM32F103xx is a complete series, its members are completely pin-to-pin compatible, as well as software and functionally compatible. In the reference manual, STM32F013x4 and STM32F103x6 are classified as small-capacity products, STM32F103x8 and STM32F103xB are classified as medium-capacity products, STM32F103xC, STM32103xD and STM32F103xE are classified as large-capacity products, of which our Shenzhou II is the selected STM32F103xC chip. No. III is the STM32xE chip, which is a large-capacity product with a larger capacity. Everyone has more reference when making products and projects.

      Small-capacity and large-capacity products are extensions of medium-capacity products (STM32F103x8/B), and the corresponding data sheets for small capacities are "STM32F103x4/6 Data Sheet" and "STM32F103xC/D/E Data Sheet".

      Small-capacity products have less flash memory, RAM space, and fewer timers and peripherals. The large-capacity products have larger flash memory, RAM space and more on-chip peripherals, such as SDIO, FSMC, I2S and DAC, etc., while maintaining compatibility with other products in the same series.

Table: STM32F103xx series

The difference between STM32 size and capacity chips - fly-top - fly-top

Startup file selection

startup_stm32f10x_cl.s Interconnected devices, STM32F105xx, STM32F107xx

startup_stm32f10x_hd.s Large capacity STM32F101xx, STM32F102xx, STM32F103xx

startup_stm32f10x_hd_vl.s High-capacity STM32F100xx

startup_stm32f10x_ld.s Small capacity STM32F101xx, STM32F102xx, STM32F103xx

startup_stm32f10x_ld_vl.s Small-capacity STM32F100xx

STM32F101xx, STM32F102xx, STM32F103xx in startup_stm32f10x_md.s

STM32F100xx of capacity in startup_stm32f10x_md_vl.s

startup_stm32f10x_xl.s FLASH at 512K to 1024K bytes for STM32F101xx, STM32F102xx, STM32F103xx

cl: interconnected products, stm32f105/107 series

vl: value-added products, stm32f100 series

xl: ultra-high density products, stm32f101/103 series

ld: low density product, FLASH less than 64K

md: medium density product, FLASH=64 or 128

hd: high density product, FLASH greater than 128

3) Specifications

A: The STM32F103xC, STM32F103xD and STM32F103xE series are 32-bit RISC cores operating at 72MHz, rich in enhanced I/O ports and peripherals connected to two APB buses.

4) with the interface

A: All models of devices include 3 12-bit ADCs, 4 general-purpose 16-bit timers and 2 PWM timers, and also include standard and advanced communication interfaces: up to 2 I2C interfaces, 3 SPI interfaces, 2 I2S interfaces, 1 SDIO interface, 5 USART interfaces, a USB interface and a CAN interface.

5) Industrial grade features

A: The STM32F103XX large-capacity enhanced series works in the temperature range of -40C to +105C, with a power supply voltage of 2.0V to 3.6V, and a series of power-saving modes to meet the requirements of low-power applications.

6) STM32F103xC, STM32F103xD and STM32F103xE device function and configuration diagram

The difference between STM32 size and capacity chips - fly-top - fly-top

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