| English name abbreviation |
English name |
Chinese name |
| SK-DIP |
Skinny DIP |
Membrane DIP |
| SL-DIP |
Slim DIP |
Slim DIP |
| SH-DIP |
Shrink DIP |
Shrink DIP |
| DIP |
Dual inline package |
Dual in-line package |
| ZIP |
Zigzag inline package |
In-line package |
| SZIP |
Shrink ZIP |
Reduced ZIP |
| PGA |
Pin grid array |
Pin grid array or cylindrical package |
| HPGA |
PGA with heatsink |
Thermal PGA |
| SPGA |
Shrink PGA |
Reduced PGA |
| QFJ |
Quad flat j-leaded package |
Quad flat package with "J" shaped pins |
| QFP |
Quad flat package |
Quad Flat Package |
| HQFP |
QFP with heatsink |
Thermal QFP |
| SQFP |
Shrink QFP |
Reduced QFP |
| TPQFP |
QFP with test pad |
|
| QTP |
Quad tape carrier package |
|
| UTQFP |
Ultra thin QFP |
|
| CQFP |
|
Ceramic Quad Flat Package |
| PQFF |
|
Plastic Quad Flat Package |
| MQFF |
|
Metal Quad Flat Package |
| SOP |
Small outline package |
Small outline package with wing-shaped "L"-shaped pins |
| MSOP |
SOP with heatsink |
Thermal SOP |
| SOJ |
Small outline j-leaded package |
Small outline package with "J" pin |
| SSOP |
Shrink SOP |
Reduced SOP |
| TSOP |
Thin SOP |
|
| DTP |
Dual tape carrier package |
|
| Please |
Surface wertical package |
|
| UTSOP |
Ultra thin SOP |
Very thin SOP |
| SON |
Small outline non-lead |
Lead-free small outline package |
| QFN |
Quad flat non-lead |
Lead-free West Side Flat Package |
| BGA |
Ball grid array |
Ball grid array package |
| PGA |
Pin grid array package |
Pin Grid Array Package |
| CSP |
Chip size package |
Chip size package |
| PICC |
|
有粗端引线 塑料芯片载体 |
| USP |
Ultra small package |
非常小的封装 |
| 3DPM |
3 dimentional package module |
|
| 3D-SON |
3DPM-son |
|
| 3D-SVP |
3DPM-svp |
|
| 3D-DIP |
3DPM-dip |
|
| MCM |
Multi chip model |
多芯片组件 |
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