1. Chip-based naming pad
(1) round pad: SC + diameter, such as SC1R00, that the diameter of the circle pad 1mm
(2) square pad: SR + L × W as SR1R00 × 1R00, and represents a long both the width of 1mm square pad
(3) oval pad: SOB + L × W as SOB2R00 × 1R00, represent length and width respectively 2mm, 1mm oval pads
2. The through hole land-based naming
(1) circular through hole pad: C + ± pad diameter aperture, such as C1R60-1R00, represents a land diameter of 1.6mm, a pore size of 1mm round the pad
(2) side welding plate through hole: R + ± pad aperture length × width pad, as R1R60 × 1R60-1R00, showing the pad length and width are 1.6mm, pore size of 1mm
(. 3) elliptical pad vias: OB + L × pad ± pad aperture width, as OB1R60 × 1R60-1R00, showing the pad length and width are 1.6mm, pore size of 1mm through holes elliptical pad
3. Thermal pad (Flash) named
(1) a circular pad heat pad: Flash pad outer diameter - inner diameter of the pads, such as FLASH2R20-1R50, the outer diameter 2.2mm, inner diameter of 1.5mm thermal pad.
(2) square pad hot pad: FLASH pad length × width outside diameter - inner diameter of the pad length × width as FLASH3R20 × 2R50-2R20 × 1R50, represents the outer diameter of the pad length 3.2mm, width 2.5mm, the pad inside diameter length 2.2mm, width 1.5mm thermal pad.
