After the new crown pneumonia outbreak, many regions have adopted the unmanned aerial vehicles, intelligent robots medical assistance and epidemic prevention and control, effectively reduce contact between people, the possibility of spread of the epidemic to a minimum. Meanwhile, the condition is more serious, autopilot technology for unmanned delivery has become a good way to replace manpower. In the winter of 2019 into the automatic driving skills, it will once again become the focus of attention.
With the real test carried out on the road today, autonomous vehicles must support the functionality continues to expand, its complexity also increases rapidly. These automated systems will have on performance, power consumption, safety, security and reliability requirements continue to increase, and this need for faster, more reliable and more cost-effective memory chips.
There semiconductor mentioned before Hong Wang, at present, the world's leading memory chip is divided into three types, DRAM is mainly used to make the PC memory (such as DDR) and phone memory (such as LPDDR), both half and three percent. Nonvolatile chips (after power failure, the information still present in the memory) is mainly a flash memory (Nand FLASH and NOR FLASH), NOR storage medium in mainly used, while NAND is used for data storage.
The UFS, called the Universal Flash Storage, is a "universal flash storage." It is understood Hong Wang semiconductor, a UFS serial data transmission technology, but only two data rate channels beyond eMMC. At present, there are more popular UFS 3.0, its bandwidth is twice UFS 2.1, and lower power consumption. In the single-channel, UFS 3.0 can be achieved 11.2Gb / s, can achieve dual channel 23.2Gb / s. UFS 3.0 can also operate at higher temperatures, which is very important (-40 to 105 ° C) to meet the requirements of car regulatory level. Because most embedded multimedia card (eMMC) 5.1 solution can only meet -25 to 85 ° C operating temperature.
UFS 3.0 comprises two characteristics designed for automotive applications, to support a wide range of temperatures, and the refresh operation is supported. By repositioning the old data to the other units less frequently used data refresh function can improve system reliability. In addition, temperature warning, an alarm device comprising a predefined range based on the temperature.
Earlier, Hong Wang also been committed to the semiconductor and automotive industries work closely with partner companies to develop more high-quality memory solutions. Hong Wang Semiconductor introduced UFS, serial data transmission technology, and full-duplex mode of operation, the same transmission channel allows read and write, read and write can be performed simultaneously, bandwidth is reached 1.5GB / s or more, the transmission efficiency is improved effectively . So whether it is data transfer technology, or work mode, UFS are comprehensive ahead of eMMC.
It is because of these advantages UFS, so the market's flagship machine equipped with UFS has become a trend, so in every respect UFS to be a lot stronger than the eMMC. Prior to that, whether it is life or read and write speeds. Hong Wang Semiconductor believes that to achieve automatic pilot, joined the autopilot to take memory and overall system integration. Future, Wang-Wang will be combined with the huge demand from the automotive semiconductor market, better quality, complete storage solutions.