(6) Switching power supply circuit integration and packaging technology
The switching power supply circuit integration and packaging process involves integrating various components of the power supply circuit into a chip and packaging the chip.
1. Integrated process
In integrated circuit design, the main functional modules of the switching power supply, such as switching tubes, transformers, filter capacitors, inductors, etc., are usually integrated on one chip to achieve higher integration and smaller size. The benefits of this are reduced component count, lower system cost, and improved system reliability and efficiency.
In terms of packaging technology, common packaging types include: DIP (Dual Inline Package), SOP (Small Outline Package), QFP (Quad Flat Package), BGA (Ball Grid Array), etc. Different packaging types are suitable for different application scenarios and power consumption requirements. Choosing the appropriate packaging type can meet the heat dissipation requirements and space constraints of the circuit.
The integration and packaging process also involves multiple steps such as chip design, mask production, wafer processing, and packaging testing.
Among them, chip design is the core link of the entire process, including circuit design, layout design, layout design, etc. Mask making is the process of converting chip designs into mask patterns. Wafer processing is the process of transferring mask patterns to silicon wafers and performing steps such as processing, thinning and cutting. Packaging testing is to package the chip into a packaging base and conduct electrical performance testing and reliability testing.
All in all, the switching power supply circuit integration and packaging process is to integrate the power circuit into a chip, and use the packaging process to package the chip into a packaging type suitable for the application to meet the requirements of circuit integration, power consumption, heat dissipation and space.