PCB production process ten: PCB production process step 8 | Post-process process

PCB production process ten: PCB production process step 8 | Post-process process

Today we are exploring the content of the tenth issue, the post-process process of the PCB process. Review of previous issues→PCB production process process ninth issue丨Silk printing, today we mainly talk about the entire process of the surface process and the introduction and purpose of each process step.

Post process process introduction

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The purpose of the post-processing process

① Complete the processing according to the customer's shape.

②Bare board test is carried out according to the requirements of electrical performance.

③Do the final quality review before shipment.

Introduction to the process flow of the shape of the post-process

Purpose: Let the board be cut into the size required by the customer

Principle: mechanical cutting by digital machine tool

Main production materials: milling cutter

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Introduction to the post-process electrical measurement process

Purpose: To test the electrical performance of the PCB, that is, open and short circuit, to meet customer requirements.

Types of electrical tests:

✦Special machine (dedicated) test

A. Advantages: fast production speed

B. Disadvantages: The test needle cannot be recycled, and the cost of the fixture is high.

✦Universal test

A. Advantages: lower fixture cost

B. Disadvantages: The equipment is doubled

✦Moving probe test

There is no need to make expensive fixtures, and two probes are used to move x, y, and z to test the two ends of each line one by one.

Final Inspection / Laboratory Introduction

Purpose: Final inspection/laboratory is the final quality check in the manufacturing process.

The main items of inspection:

1. Outline Dimension

2. Each size and board edge Hole to Edge

3. Board Thickness

4. Holes Diameter

5. Line width/space

6. Annular Ring Size

The main projects of the laboratory:

1. Solderability

2. Peel strength

3. Micro Section

4 Thermal Shock Thermal Shock

5 Ionic Contamination

6 Moisture and insulation Moisture and Insulation Resistance

7 Impedance Impedance
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So up to now, our PCB process flow has been fully introduced.

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Origin blog.csdn.net/qq_31444421/article/details/129943366