Recently, MeiG Intelligent, the world's leading provider of wireless communication modules and solutions, released the high-computing AI module SNM970 . This product is the industry's first batch of AI module products developed based on Qualcomm® QCS8550 processor , and with its excellent 8-core Qualcomm® Kryo™ CPU, comprehensive AI computing power up to 48Tops , and support for Wi-Fi 7 , it helps to increase computing performance And flexibility is raised to a new level, meeting the demand for smart computing capabilities in the smart age.
▌Extreme performance, refresh terminal experience
MeiG Intelligent high-computing AI module SNM970 is equipped with Qualcomm QCS8550 processor, integrated 8-core Qualcomm Kryo CPU , including a super-large core with a main frequency of 3.2GHz, four performance cores with a main frequency of 2.8 GHz and three efficiency cores with a main frequency of 2.0 GHz Core, and built-in Qualcomm® Adreno™ 740 GPU and Qualcomm Spectra™ 680 ISP. SNM970 has SoC heterogeneous computing features, which can accurately optimize computing power resources and support high performance and low power consumption of the product.
At the same time, it supports 2x2 MIMO Wi-Fi 7 and Bluetooth 5.3, bringing a more stable and smooth network experience to application scenarios that require very high network speed. In terms of external devices, this series of modules integrates a wealth of functional interfaces, including LCM, Display Port display, touch screen, camera, PCle, USB, I2C, UART, SPI and other interfaces, and supports OpenGL ES 3.2, Vulkan1.2, OpenCL 3.0 full profile, which can fully expand its peripheral connection devices to meet the personalized performance requirements of video surveillance, intelligent information collection equipment, live broadcast terminals and other fields.
In terms of images, SNM970 series modules have better processing performance, support up to 8K@30fps video encoding or 8K@60fps video decoding, support H.264/H.265, and up to 8 cameras. It also supports dual-screen/three-screen display, and the display resolution can support up to 8K, truly achieving ultra-high-definition, high frame rate, and multi-resolution multi-screen display. It is worth mentioning that the SNM970 series modules utilize the built-in cognitive ISP of Qualcomm QCS8550, which can automatically enhance photos and videos through real-time semantic segmentation, bringing a new experience of professional quality images.
▌AI Empowerment, Towards Smart Interconnection
AI innovation makes terminals more intelligent. SNM970 series modules integrate Qualcomm® Hexagon™ processor, a Qualcomm neural network processing unit , to provide groundbreaking AI performance for the entire system. With the blessing of up to 48Tops AI computing power, it can perform high-speed, high-quality calculation and processing of massive data, creating greater imagination space for industry applications and scenarios.
The field of autonomous mobile robots:
SNM970 can easily match the high requirements of service robots in terms of computing power. At the same time, it is equipped with rich peripheral interfaces. In the form of AI modules, speech recognition, machine vision, navigation, positioning, obstacle avoidance and multi-modal technologies can be integrated through various sensors. Implanted into existing automation equipment, to achieve more and more extensive human-computer interaction, so that the robot has "sight and brain".
AI edge computing box field:
In terms of AI acceleration, SNM970 uses Qualcomm Hexagon processor, the most advanced AI engine developed by Qualcomm Technologies can support the transformative INT4 Al precision format, and achieve 60% energy efficiency improvement compared with the previous generation in terms of continuous AI reasoning. At the same time, it can perform video structural analysis on multiple cameras, and quickly realize intelligent perception, data analysis, security management and other functions of people, things, and objects.
Smart industry field:
In terms of industrial vision, SNM970 can perform image preprocessing through powerful AI capabilities, and can complete complex tasks such as image recognition, feature detection, and multi-dimensional detection to obtain more accurate target information and achieve accurate, fast, and efficient real-time detection.
In terms of design, it adopts the LGA packaging mode , the size is 40.0mm x 45.0mm x 2.7mm, the life cycle is up to 2030 , and it can be compatible with MeiG Smart SNM950 (based on Qualcomm QCS8250 processor), SNM960 (based on Qualcomm SM8475 processor) The series of modules are package compatible , which is convenient for customers to upgrade the performance of their terminal products, and meets customers' requirements for different processor performance or AI computing power. In addition, in addition to being equipped with the Android 13 operating system, the SNM970 will also launch a Linux version in the future to fully meet the secondary development needs of customers and release the performance potential of the hardware.
Dev Singh, vice president of business development and head of building, enterprise and industrial automation at Qualcomm Technologies, said: "At present, the field of Internet of Things is accelerating development, and the release of Qualcomm QCS8550 processor has brought powerful AI performance and leading connectivity to the industry. capabilities to help meet the top-level performance required by IoT terminals in different scenarios and applications. We are very pleased to join hands with MeiG Smart to help develop innovative technologies for the expansion of its customers in many fields."
Du Guobin, CEO of MeiG Smart, said: "Over the years, MeiG Smart has maintained close cooperation with Qualcomm Technologies, and we are very honored to be the first manufacturer to release the Qualcomm QCS8550 IoT solution. The power module will bring a new benchmark for high-computing AI performance to terminal applications. In the future, MeiG Smart will give full play to its software and hardware collaborative development capabilities in the fields of wireless communication, high-performance and low-power consumption computing, and terminal-side AI applications. Introduce innovative wireless communication modules and IoT industry solutions, opening a new era of intelligent connection."