Chipping is a common cutting defect when the wafer dicing machine cuts the wafer, which affects the cutting quality and production efficiency. To choose a suitable cutting knife to reduce edge chipping, the following points can be considered:
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According to the wafer size and cutting requirements, select the appropriate diamond particle size and concentration cutting knife. The larger the diamond particles, the stronger the cutting ability, but at the same time, the impact force on the cutting surface is also greater.
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The smoothness and flatness of the blade surface have a great influence on chipping. Chipping can be reduced by using a clean, flat insert surface.
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During dicing, the distance and angle between the blade and the wafer will also affect chipping. Appropriate distance and angle can make the diamond particles generate the maximum cutting force during the cutting process, thereby reducing chipping.
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Cutting temperature and pressure also affect chipping. Excessively high or low temperature and pressure will deform or crack the wafer, resulting in edge chipping.
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The installation accuracy and balance of the blade will also affect the edge chipping. Inclined or unbalanced installation of the blade will cause unnecessary vibration and shock to the diamond particles during the cutting process, thereby increasing the risk of edge chipping.
To sum up, to choose a suitable cutting knife to reduce edge chipping, the above factors need to be considered, and adjusted and optimized according to the specific situation.
