About the removal method of the sealing paint of the integrated package

        We all know that the outer layer of the one-piece U disk has a layer of paint to isolate the circuit board. Therefore, if you need to export the data through the nand flash debugging point, you need to polish off the outer layer of insulating paint, which is to restore the integrated disk. Below is the whole process.

  1. In a hurry, I scratched twice without taking pictures

  2. This is the tool we use, a very common scalpel, which can be bought online. The blade can be old or new, as long as it can be scraped, but don't want that kind of dull knife, that kind of thing won't work.

  3. At the beginning, it is enough to scrape horizontally, so that the speed is fast and the force is stronger, and it can be quickly polished to the metal layer. The reason why no sandpaper is used is 1. Because the area of ​​the sandpaper is quite large, the specific situation under the sandpaper is unknown. With the blade we can see how far to grind and then control the method and force.

  4. After hanging for a while, I saw the metal layer. At this time, the force is slightly smaller to prevent damage to the metal layer.

  5. The exposed part is getting bigger and bigger, keep trying.

  6. When scraping to the back, you can use the tip of the knife to scrape, so that the control can be more precise.

  7. Okay, it's all finished and polished very finely. It can be done in about 5 minutes. The sd card of the mobile phone is easier to polish, because the paint is very thin, much thinner than the U disk.

 

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