Allegro PCB drawing software package, other than with respect to complex EDA software, some more steps, here simply drawn out about the step by Allegro PCB software packages, sorting different packages 2, i.e. SMD type plug-in type package and packaging, the specific steps are as follows:
SMD type package manufacturing process according to the following steps:
The first step, the pads need to make a patch, designed to open the pad assembly Pad Designer, shown in Figure 4-2, to select Parameters, a borehole information parameter; shown in Figure 4-3, select Layers, welding is disc information parameter, the specific meaning of each parameter in FIG. 4-2 and FIG. 4-3 are described in detail;
4-2 a schematic view of the drilling parameter information
4-3 a schematic view of a pad parameter information
The second step, is provided in Figure 4-2 Units units and good accuracy, to set the general unit MM, precision setting 4, and then set the common pads, a solder resist layer and the steel mesh in size Layers, as 4- in FIG 4, Soldermask size is generally larger than the unilateral Regular Pad 4mil above (recommended 5mil), whereas the same size Regular Pad with Pastemask;
FIG parameters schematic pad 4-4
The third step, prior to the establishment of the pad, set the first folder path, disposed Set Up-> User Preferences Editor in Figure 4-5;
FIG call path disposed schematic pad 4-5
The fourth step, open the PCB Editor program, select File-> new command to perform the settings shown in the dialog box 4-6;
FIG. 4-6 PCB schematic new package
The fifth step, after the New, click the menu command Setup-Design Parameters, set the parameters. Design selection panel disposed in package design units, and the precision Size panel, shown in Figure 4-7, User Units of design units, generally set MM, Accuracy design accuracy is generally set to 4, provided in the panel Extents canvas size of the entire large area and the position of the origin, can be provided as shown in Figure 4-7;
FIG design units 4-7, accuracy, origin Illustration
A sixth step, click on the menu command Setup-Grids, for grid point setting, open grid panel is disposed, can be provided by the panel of FIG. 4-8;
Figure 4-8 package design grid Illustration
A seventh step according to the respective positions need to draw pad package of given specification, the lands into the corresponding position, shown in Figure 4-9;
4-9 a schematic view corresponding to FIG pad into position
Step eight, finish placing solder pad assembly line painting Next, execute the menu command Add Line, select Options drawn in the line width and the layer panel, shown in Figure 4-10;
4-10 schematic assembly drawing FIG.
The ninth step, after the assembly has been drawn, execute the menu command Add Line, screen frame and a draw pin identification, selection layer and a width, in the screen width of the drawn 4mil Options panel above (typically a 0.15mm or 0.2mm) , shown in Figure 4-11;
4-11 schematic drawing sewage lines
A tenth step, after a good painting, drawing implement the menu command Shape Rectangular setting range and the height of entities, the first draw Place_bound, set up area, providing a layer drawn Options panel, shown in Figure 4-12, then the Setup -> Araes-> Package height disposed in the maximum height, shown in Figure 4-13;
4-12 schematic drawing area
4-13 schematic height information adding device of FIG.
Finally, add the assembly and silk-bit character number of components. Execute the menu command Add Text, select the corresponding layers in the Options panel, characters are added after the addition of the assembly, save and exit, shown in Figure 4-14.
4-14 schematic FIG screen Add Tag
Plug-in type package manufacturing process according to the following steps:
The first step, we need to create Flash pads. Open Allegro software, select File-> new command in the pop-up dialog box, select Flash symbol, shown in Figure 4-15;
A second step of the method according to the settings of the patch in the device, the unit set, and the accuracy of the lattice point, execute the menu command Add-> Flash, set according to the device size, the meanings of the parameters shown in Figure 4-16;
Figure 4-16 is provided a schematic view flash parameters
The third step, set up after clicking OK, the experience value of the parameter is provided around an inner diameter larger than the outer diameter of 20mil, the opening width of the aperture is approximately one 8mil greater than 4 minutes but, after the setting shown in Figure 4-17 OK;
Flash-size can be calculated as:
1) a = size of bore aperture + 0.4 mm;
2) b = bored pore size + 0.8 mm;
3） c = 0.4 mm；
4） d = 45。
The fourth step, open the Pad Designer, the method according to the settings of the patch in the device, the unit set, precision, and information provided borehole and the pad Pad Designer interface information, provided via pads just pore size, pore breaks , Flash (negative process), Anti_Pad (negative process), Regular Pad, Soldermask, shown in Figure 4-18 and 4-19 shown in FIG;
FIG drilling parameters Illustration 4-18
Figure 4-19 parameter schematic pad
The fifth step, after the pad built, would set the library path, you can build the package. The step of building the patch package encapsulation process is exactly the same, reference may SMD package production process. There is not the same thing, if the non-metallized holes (Non plated) package, it is necessary to add keepout non-metallized holes keepout unilateral size (radius) is larger than the hole above 0.3mm, 4 FIG -20;
FIG schematic 4-20 production is completed widget package
