| 英文名称缩写 |
英文名称 |
中文名称 |
| SK-DIP |
Skinny DIP |
膜状DIP |
| SL-DIP |
Slim DIP |
细长DIP |
| SH-DIP |
Shrink DIP |
收缩DIP |
| DIP |
Dual inline package |
双列直插式封装 |
| ZIP |
Zigzag inline package |
直插式封装 |
| SZIP |
Shrink ZIP |
缩小的ZIP |
| PGA |
Pin grid array |
针栅阵列或柱形封装 |
| HPGA |
PGA with heatsink |
散热的PGA |
| SPGA |
Shrink PGA |
缩小的PGA |
| QFJ |
Quad flat j-leaded package |
四边扁平封装，引脚为“J”形 |
| QFP |
Quad flat package |
四边扁平封装 |
| HQFP |
QFP with heatsink |
散热的QFP |
| SQFP |
Shrink QFP |
缩小的QFP |
| TPQFP |
QFP with test pad |
|
| QTP |
Quad tape carrier package |
|
| UTQFP |
Ultra thin QFP |
|
| CQFP |
|
陶瓷四边扁平封装 |
| PQFF |
|
塑料四边扁平封装 |
| MQFF |
|
金属四边扁平封装 |
| SOP |
Small outline package |
小外形封装，引脚为翼形“L”形 |
| MSOP |
SOP with heatsink |
散热的SOP |
| SOJ |
Small outline j-leaded package |
小外形封装，引脚为“J”型 |
| SSOP |
Shrink SOP |
缩小的SOP |
| TSOP |
Thin SOP |
|
| DTP |
Dual tape carrier package |
|
| SVP |
Surface wertical package |
|
| UTSOP |
Ultra thin SOP |
非常瘦的SOP |
| SON |
Small outline non-lead |
无铅的小外形封装 |
| QFN |
Quad flat non-lead |
无铅的西边扁平封装 |
| BGA |
Ball grid array |
球栅阵列封装 |
| PGA |
Pin grid array package |
插针网格阵列封装 |
| CSP |
Chip size package |
芯片尺寸封装 |
| PICC |
|
有粗端引线 塑料芯片载体 |
| USP |
Ultra small package |
非常小的封装 |
| 3DPM |
3 dimentional package module |
|
| 3D-SON |
3DPM-son |
|
| 3D-SVP |
3DPM-svp |
|
| 3D-DIP |
3DPM-dip |
|
| MCM |
Multi chip model |
多芯片组件 |
声明：该文只适用于学习，其内容包含来自书本的摘抄和总结，欢迎大家补充，共同学习进步。