Temperature measurement on circuit boards with IR thermometers
use of infrared temperature measurement of assembled circuit board functional test
because the productivity of the rising member, more and more electronic components and circuit board manufacturers are turning to non-contact temperature measurement. By using modern infrared temperature measuring device may be obtained in thermal performance without affecting the data object to be measured and optimized.
Infrared cameras for electronic components for accurate thermal analysis (for example, in some cases, there is not only a key component, but also can not be a clear description of the components). The camera can be positioned as the weakness of the specific heat shown in FIG.
Assembled circuit board recorded with the thermal imager optris PI160
employed DTC1160 Infrared assembled circuit board to the recording data
at the auxiliary infrared camera can be achieved on circuit board assembly (for research and development or production) Thermal Performance Data detailed real-time analysis. By standard USB2.0 interface, video 120 Hz can be achieved. This is particularly applicable to appear a short time, and then the lens needs to slow activity analysis. It can also include all geometric resolution of the video resolution and the heat taken single image.
Subsequent analysis was done in efficient software; It supports any rectangular area measuring user-defined point. For the alarm, the highest temperature value / minimum value / average value, can be defined and displayed. In addition to the recording function, the software also supports recording and storage on to capture.
Infrared DTC1160 160 comprises 160 x 120 pixels, or 19.200 miniature single detector, as a matrix on a chip (focal plane array, English abbreviation for FPA). Such micro uncooled bolometer micro bolometer FPA detector is a kind of image-guided member.
Bolometer heat detectors belonging to one packet. A resistor having its good heat resistance, and therefore is widely popular. When using a heat sensitive element absorbing radiation, the variable resistance bolometer causes a decrease in signal voltage. Using flash analog to digital converter 14 can digitize the video sequence of the amplified signal. Digital signal processing, the calculated temperature value for each pixel, and instantly generate a common pseudo-color image.
Subsequently, the micro-bolometer FPA detector combination with a high performance optical devices, enabling adjustment of the distance measurement and different dimensions. Small pixel size on the detector so that even for a small size of about 50 μm object (e.g. minimum SMD component for functional testing), it is possible to exhibit the thermal process. To 0.5 mm of the smaller element, accurate temperature measurement can be achieved. Camera has a thermal sensitivity of 0.08 K, so the temperature can be a good show details.
In addition to the camera options
Considering the large number of products and testing stations, the use of infrared cameras will cost a lot of money. In order to produce the device in continuous production control of key components, the infrared thermometer can be used as alternative temperature monitoring program. DTC CT LT thermometer using an infrared temperature sensor, temperature measurement can be based on key points of those components into reusable continuous production (the position on the circuit board), be monitored. Subsequently, the temperature measurement result is transmitted to the testing station program for subsequent decisions.
Mini IR Thermometer for continuous control
Modern production technology not only reduces the cost of the production process, but also promote the development of an infrared thermometer on the specific device many purposes. DTCCT LT Mini IR Thermometer mainly for assembling a circuit board such as a check and the like in practical applications. The instrument is one of the world's smallest infrared sensors, linear output can cover a temperature range -50 ° C to 975 ° C is.
Infrared thermometer during temperature measurement of assembled circuit board
The small size of the sensor comprises a miniature infrared sensor probe (14 mm x 28 mm) and a separate electronic cassette. Wherein the micro-infrared sensor probe may be used to narrow environments, where space is limited and therefore can not be due to non-contact temperature measurement of the test station, this sensor probe is particularly applicable here.
The sensor probe with a solid stainless steel housing (IP65), which makes it possible to design at no additional cooling for up to 180 ° C environment. The optical device having a fine resolution (the ratio of the distance measurement points are: 22: 1) provides the flexibility for installation point test station. In addition, it also highlights that can be measured does not exceed a maximum of 0.6 mm using an additional object lens of small size.
Interpretation list element (IP65) supports a variety of signal processing. The measured temperature of the circuit board may provide a signal to the operator through a linear 0-20 mA, 4-20 mA, 0-10 V or thermocouple output. LCD display panel with built-in control may be implemented on the signal processing mode selection and parameter adjustment for the assembly area. With built-in USB or RS232 interface (available on PC or Laptop-PC), the programming can be achieved. In order to run the existing data, but also provides a more addressable interfaces, such as RS485 interface or a CAN-Bus, Profibus DP, Ethernet and alarm relay.