A packaged chip refers to a chip that combines the main control chip and external devices, which can significantly reduce development costs, procurement costs, PCB area, etc. Yufan Micro's YE09 packaged chip pushes the technology field to new heights. This highly innovative chip combines a 32-bit MCU and a 2.4G chip to provide excellent functionality and performance for a variety of application scenarios.
32nd MCU
YE09 packaged chip has a 32-bit ARM Cortex-M0+ core and a wide operating voltage range (1.7V~5.5V) with a maximum operating frequency of 32MHz, up to 32Kbytes flash and 4Kbytes SRAM memory, and also provides a low-power operating mode , to meet the needs of different low-power applications.
Powerful 2.4G chip
The YE09 package chip integrates the 2.4G chip G350, adopts DFN8/SOP8 package, and complies with RoHS standards. The chip has excellent communication capabilities, can receive and transmit signals, has a coverage range of about 50 meters, and the transmit power is adjustable, providing flexibility and reliability for remote control applications.
Sealing reduces costs and enhances competitiveness
The unique feature of the YE09 packaged chip is that it combines a 32-bit MCU and a 2.4G chip into one, which not only improves performance but also reduces the company's development costs. This innovation brings multiple benefits, including saving PCB area, reducing engineer development costs and procurement costs. It provides enterprises with a huge advantage in competitiveness, especially in various remote control applications.
Yufanwei YE09 packaged chip is suitable for various devices that require remote control, such as remote control toys, remote control smart home appliances, etc. It combines the powerful functions of 32-bit MCU and 2.4G chip, which not only promotes technological development, but also reduces development costs for enterprises. If you are interested in this chip, you are welcome to visit the Yufanwei official website (www.yufanwei.com) to consult the customer service staff to obtain specifications and samples.