Article directory
Chinese Journal of Mechanical Engineering
"Journal of Mechanical Engineering" was founded in 1953. It is managed by the China Association for Science and Technology and sponsored by the Chinese Mechanical Engineering Society. It is the top academic journal in the field of mechanical engineering in China. It mainly reports innovative basic theoretical research, Excellent scientific research achievements in the application of engineering technology.
The publication has won the highest honor in my country's periodical industry. In 2019, it was selected as an echelon journal of the China Science and Technology Journal Excellence Action Plan. In 2013, it was selected as one of the "Top 100 Science and Technology Journals"; in 2011, it won the "Second China Publishing Government Award Journal Award"; in 1999, 2003, and 2005, it won the "National Journal Award" for three consecutive times; in 2001, it was listed as "China Journal Square" double-high journals;
"Journal of Mechanical Engineering" is included by many well-known retrieval systems at home and abroad, such as Ei, CA, SA, AJ, China Journal Network Full-text Database, etc., and its total citation frequency, impact factor and comprehensive evaluation score rank among the top among mechanical engineering journals .
The three teams of editorial board, board of directors and reviewers have become a strong backing to ensure the high academic level and high publishing quality of the journal. After decades of development, the editorial board has increased from 21 experts at the beginning to more than 100 experts now, including more than 40 academicians of the two academies. Since the establishment of the first board of directors in 1996, more than 40 units have participated in it, providing strong support for the development of the publication. The scale of the team of reviewers has now exceeded 1,000, and their majors cover the field of mechanical engineering and its interdisciplinary subjects.
Publish excellent scientific research papers in the field of mechanical engineering and its interdisciplinary subjects. It mainly includes the following columns:
Robotics and Mechanism,
Mechanical Dynamics,
Tribology
, Manufacturing Process and Equipment,
Instrument Science and Technology,
Materials Science and Engineering,
Transportation Engineering,
Crossover and Frontier, etc.
Journal of Instrumentation
"Journal of Instrumentation" (Chinese Edition) was founded in 1980. It is sponsored by the China Association for Science and Technology and the China Instrumentation Society. It is the top academic journal in the field of instrumentation in China. Excellent scientific research achievements in basic theoretical research and engineering technology application.
"Journal of China" has always been known for its rigorous scientific attitude, serious journal style and strict review procedures, and has won good reputation and high popularity at home and abroad. Journal development and achievements are widely recognized.
At present, it has been indexed by American Engineering Index (Engineering Index), American Chemical Abstracts (CA), British Scientific Abstracts (INSPEC), Russian Journal of Abstracts (РЖ), Chinese Academic Journal Comprehensive Evaluation Database CAJCED, Chinese Core Journals, Chinese Science Citation Database, China Sci-Tech Papers and Citation Database (CSTPCD), China Academic Journals (CD-ROM), China Journal Network, China Academic Journal Abstracts and other important retrieval systems at home and abroad.
In recent years, the academic influence index and publishing ability index of the journal have grown rapidly, and the total citation frequency, impact factor and comprehensive evaluation score rank first among instrumentation journals (data source: "China Science and Technology Journal Citation Report") .
Since 2006, the publication has continued to receive engineering funding from the China Association for Science and Technology's high-quality scientific and technological journals project; The "China Science and Technology Journal Excellence Action Plan" jointly implemented by the Ministry of Technology, the State Press and Publication Administration, the Chinese Academy of Sciences, and the Chinese Academy of Engineering.
IEEE Sensors Journal
Founded in 2001, the call for papers mainly involves topics closely related to sensor technology, such as signal processing and analysis, communication, network and broadcasting technology, components, circuits, devices and systems, and robots and control systems. Compared with other IEEE Trans journals, this journal has a short review period and a high hit rate, which is highly recommended.
The content area is the theory, design, fabrication, fabrication and application of devices for sensing and transforming physical, chemical and biological phenomena, with emphasis on the electronic and physical aspects of sensors and integrated sensor-actuators. Focus on the many sensor technologies spanned by IEEE as well as emerging sensor technologies.
Sensors and Actuators A: Physical
Sensors and Actuators A-Physical (SNA) is dedicated to disseminating information on all aspects of research and development of solid-state devices for sensing physical signals. As an internationally renowned journal of drives and sensors, it mainly collects manuscripts related to mechanical instruments and meters, electronics and electrical. The green cover of SNA journals looks very environmentally friendly, and many manuscripts on energy recovery choose SNA as their destination.
SNA journals require authors to prepare additional Highlights and upload them as an attachment when submitting a manuscript, which is convenient for editors and reviewers to preview. In the attachment, the author needs to add the pictures in the manuscript and list the innovative points one by one. These points need to be very special, so as to arouse the reading interest of editors and reviewers, thereby improving the hit rate of the manuscript.
Its content is designed in the following areas:
fundamentals and physics, eg: classification of effects, physical effects, measurement theory, sensor modeling, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field, supported by experimental results.
Materials and their processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibers, amorphous silicon, polycrystalline silicon, and single crystal silicon.
Photosensors such as: photodiodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers, and liquid crystal displays.
Mechanical sensors such as: metal, thin film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid state displacement sensors, piezoelectric junction devices, piezoelectric field effect sensors (PiFETs), tunnel diode strain sensors, surface acoustic wave devices, silicon Micromechanical switches, solid state flow meters and electronic flow controllers.
Thermal sensors such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperature sensors, PTAT circuits, thermocouples, thermopiles, thermoelectric thermometers, quartz thermometers, power transistors and thick film thermal print heads.
Magnetic sensors such as: magnetoresistive, Corbino disks, magnetic diodes, Hall effect devices, integrated Hall devices, silicon depletion layer magnetometers, magnetic injection transistors, magnetoresistors, transverse magnetic transistors, load field magnetometers, MOS magnetic field sensor, solid-state read/write head.
Micromechanics, e.g.: research papers on actuators, structures, integrated sensor-actuators, microsystems, and other devices or sub-devices, ranging in size from millimeters to sub-micrometers; MEMS; MEMS; Micro-optics Mechanical systems; microchemical mechanical systems; microrobotics; silicon and non-silicon manufacturing technologies; fundamental research on physical phenomena of interest to micromechanics; microsystem analysis; exploring new topics and materials related to micromechanics; related to microsystems problems such as power and signal transmission, simulation tools related to microsystems; other topics of interest in micromechanics.
Interface Electronics: Electronic circuits designed to directly interface with the transducers mentioned above to improve or complement the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light intensity compensation, current/frequency conversion, and microcomputer interface .
Sensor systems and applications such as: sensor buses, multi-sensor systems, sensor networks, voting systems, telemetry, sensor arrays and automotive, environmental, surveillance and control, consumer, medical, alarm and security, robotics, marine, aerial and space surveying system.
IEEE Transactions on Industrial Electronics
"IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS" is a publication published by the Institute of Electrical and Electronics Engineers of UNITED STATES in 1982.
Abbreviated as TIE, it is a TOP journal in the mechanical field, and it is an interdisciplinary subject of engineering technology and computer science. Impact factor 6 to 8 (mechanical journals are not high). The submission period is mostly 8 to 12 months. Generally speaking, review comments are returned once every three months, several re-battles go back and forth, and the submission cycle is almost one year. Since it is a TOP journal, the cycle is relatively long.
IEEE Transactions on Industrial Informatics
IEEE Transactions on Industrial Informatics, a bimonthly publication, focuses on the fundamentals of factory automation, covering techniques for information analysis, processing, and distribution, and how to achieve efficiency, effectiveness, reliability, and safety in industrial settings.
Works on the basics of factory automation as a means of enhancing industrial manufacturing and manufacturing processes. This includes a range of technologies that use information analysis, manipulation and distribution to achieve greater efficiency, effectiveness, reliability and/or safety in aggregate in industrial settings. The scope of the transaction includes reports, definitions, provides a forum for discussion, and informs readers about the latest developments in intelligent and computerized control systems, robotics, factory communication and automation, flexible manufacturing, vision systems, and data acquisition and signal processing.
NDT&E International
NDT&E INT publishes original research and development in all areas of non-destructive testing and evaluation including ultrasonic, electromagnetic, radiographic, optical and thermal methods. In addition to traditional non-destructive testing topics, the emerging technical areas of civil structures and materials testing are emphasized.
The journal publishes original papers on research and development of new detection technologies and methods, as well as novel and innovative applications of existing methods. Papers on NDT sensors and their use in inspection and process control, as well as papers describing novel NDT systems for structural health monitoring and their performance in industrial settings, were also considered.
IEEE Transactions on Instrumentation and Measurement
Papers published in IEEE Transactions on Instrumentation and Measurement concern the development and use of innovative solutions for electrical and electronic instruments and devices to measure, monitor, and/or record physical phenomena in order to advance measurement science, methods, functions, and applications. The scope of these papers may include:
(1) theory, methods, and practice of measurement;
(2) design, development, and evaluation of instrumentation and measurement systems and components for generating, acquiring, conditioning, and processing signals; (3)
analyzing , Represent, display and save information obtained from a set of measurements;
(4) Provide scientific and technical support for the establishment and maintenance of technical standards in the field of instrumentation and measurement.